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    • 4. 发明申请
    • LIGHT-EMITTING DEVICE
    • 发光装置
    • US20130062649A1
    • 2013-03-14
    • US13612988
    • 2012-09-13
    • Toshio HATAMasayuki ItoMasataka Miyata
    • Toshio HATAMasayuki ItoMasataka Miyata
    • H01L33/50
    • H01L33/501H01L33/56H01L33/62H01L2224/48091H01L2224/48247H01L2924/1815H01L2924/00014
    • Disclosed is a light-emitting device having a wide luminous-intensity distribution characteristic with a simple structure. The light-emitting device includes a resin package in which an LED chip, a first inner portion of a first lead terminal, and a second inner portion of a second lead terminal are accommodated and which has a second recess portion formed so that a portion including a first recess portion of the first inner portion of the first lead terminal as well as a portion of the second inner portion of the second lead terminal are exposed to a bottom portion of the second recess portion, and a resin portion containing phosphors and filled in the first recess portion of the first lead terminal and in the second recess portion of the resin package. A photoreflective filler is contained in a region opposed to the LED chip of the resin portion including the phosphors.
    • 公开了具有宽的发光强度分布特性的结构简单的发光装置。 发光装置包括其中容纳LED芯片,第一引线端子的第一内部部分和第二引线端子的第二内部部分的树脂封装,并且具有第二凹部,所述第二凹部形成为包括 第一引线端子的第一内部部分的第一凹部以及第二引线端子的第二内部部分的一部分暴露于第二凹部的底部,并且包含含有荧光体并填充的树脂部分 第一引线端子的第一凹部和树脂封装的第二凹部中。 在与包括荧光体的树脂部分的LED芯片相对的区域中包含光反射填料。
    • 5. 发明申请
    • SURFACE MOUNTING TYPE LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME
    • 表面安装型发光二极管及其制造方法
    • US20080203417A1
    • 2008-08-28
    • US12035320
    • 2008-02-21
    • Masahiro KONISHIToshio HATATaiji MORIMOTO
    • Masahiro KONISHIToshio HATATaiji MORIMOTO
    • H01L33/00H01L21/02
    • H01L33/60H01L33/644H01L2224/48091H01L2924/00014
    • This invention provides a surface mounting type light emitting diode excellent in heat radiation performance, reliability and productivity. The surface mounting type light emitting diode includes an insulating base member, a semiconductor light emitting element having a bottom face fixedly bonded to a top face of the base member, and a metallic reflector joined to the top face of the base member with a heat conduction type adhesive sheet interposed therebetween, to surround the semiconductor light emitting element. Heat generated from the semiconductor light emitting element is transferred to the reflector via the base member and the heat conduction type adhesive sheet, and then is radiated to the outside. The metallic reflector can efficiently radiate the heat to the outside. The cutting margin provided for the reflector facilitates a dicing process, which improves productivity.
    • 本发明提供了散热性能,可靠性和生产率优异的表面安装型发光二极管。 表面安装型发光二极管包括绝缘基底构件,具有固定地接合到基底构件的顶面的底面的半导体发光元件和与基底构件的顶面接合的金属反射体,具有热传导 以夹持半导体发光元件。 从半导体发光元件产生的热量经由基底部件和导热型粘合片传递到反射体,然后被照射到外部。 金属反射器可以有效地将热量辐射到外部。 为反射器提供的切割边缘有助于切割过程,从而提高生产率。