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1. 发明授权

US5288698A Method of positioning lead frame on molding die to seal semiconductor element with resin 失效
标题翻译：将引线框架定位在成型模具上以用树脂密封半导体元件的方法
公开(公告)号：US5288698A
公开(公告)日：1994-02-22
申请号：US858785
申请日：1992-03-27
申请人： Toshinobu Banjo , Kouji Shika , Minoru Tanaka
发明人： Toshinobu Banjo , Kouji Shika , Minoru Tanaka
IPC分类号： B29C45/14 , B29C45/84 , H01L21/56 , B29C33/12 , B29C33/30
CPC分类号： B29C47/903 , B29C45/14008 , B29C45/842 , B29C47/907 , H01L21/56 , B29C47/0019 , H01L2924/0002
摘要： A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.
摘要翻译：参考销（150）设置在模制装置（100）的底模（108）上。引线框架（3）由附接到X-Y工作台机构（110）的夹紧装置（120）承载。在X-Y台机构的台（131）中形成有孔（132）。通过TV摄像机（142）检测孔和针的相应图像，以通过驱动X-Y平台来控制底模和引线框架的相对位置。

2. 发明授权

US5123823A Molding device for sealing semiconductor element with resin 失效
标题翻译：用树脂密封半导体元件的成型装置
公开(公告)号：US5123823A
公开(公告)日：1992-06-23
申请号：US641397
申请日：1991-01-15
申请人： Toshinobu Banjo , Kouji Shika , Minoru Tanaka
发明人： Toshinobu Banjo , Kouji Shika , Minoru Tanaka
IPC分类号： B29C45/14 , B29C45/84 , H01L21/56
CPC分类号： B29C47/903 , B29C45/14008 , B29C45/842 , B29C47/907 , H01L21/56 , B29C47/0019 , H01L2924/0002
摘要： A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.
摘要翻译：参考销（150）设置在模制装置（100）的底模（108）上。引线框架（3）由附接到X-Y工作台机构（110）的夹紧装置（120）承载。在X-Y台机构的台（131）中形成有孔（132）。通过TV摄像机（142）检测孔和针的相应图像，以通过驱动X-Y平台来控制底模和引线框架的相对位置。

3. 发明授权

US4933540A IC card 失效
标题翻译： IC卡
公开(公告)号：US4933540A
公开(公告)日：1990-06-12
申请号：US169459
申请日：1988-03-17
申请人： Makoto Omori , Toshinobu Banjo , Shigeo Onoda
发明人： Makoto Omori , Toshinobu Banjo , Shigeo Onoda
IPC分类号： B42D15/10 , G06K19/077
CPC分类号： G06K19/07743
摘要： An IC card has a shutter reciprocatively mounted on a frame in order to protect a plurality of external-element connection terminals which are mounted on the frame. Guide grooves formed in the frame include those which receive corresponding projections formed on spring-mounting portions of the shutter to keep the projections in engagement therewith, thereby enabling both the base portion and the spring-mounting portion of the shutter to be guided. End portions at one end of those guide grooves determine a position of the shutter such that the shutter is prevented from overshooting the frame. Thus, the IC card is capable of ensuring stable opening and closing action of the shutter.
摘要翻译：一个IC卡具有一个往复式安装在框架上的挡板，以便保护安装在框架上的多个外部元件连接端子。形成在框架中的引导槽包括接收形成在活门的弹簧安装部分上的相应突起以保持突起与其接合，从而能够引导闸板的基部和弹簧安装部分两者的引导槽。这些导向槽的一端的端部确定快门的位置，从而防止快门超过框架。因此，IC卡能够确保快门的稳定的打开和关闭动作。

4. 外观设计

USD305886S Memory card for a computer system 失效
公开(公告)号：USD305886S
公开(公告)日：1990-02-06
申请号：US79505
申请日：1987-07-30
申请人： Toshinobu Banjo , Shigeo Onoda
设计人： Toshinobu Banjo , Shigeo Onoda

5. 发明授权

US4868074A Battery holder mechanism 失效
标题翻译：电池座机构
公开(公告)号：US4868074A
公开(公告)日：1989-09-19
申请号：US174901
申请日：1988-03-29
申请人： Makoto Omori , Toshinobu Banjo , Shigeo Onoda
发明人： Makoto Omori , Toshinobu Banjo , Shigeo Onoda
IPC分类号： G06K19/077 , B42D15/10 , G11C5/00 , H01M2/10
CPC分类号： H01M2/1044
摘要： A battery holder mechanism comprises lower supporting portions for receiving the peripheral edge of a battery holder body from below and upper supporting portions for receiving the same from above when the battery holder body is inserted into a battery inserting opening of a package of an electronic appliance, such as an IC card. The upper and lower supporting portions are provided alternatingly inside an inserting hole of a package.
摘要翻译：电池保持器机构包括用于从下方接收电池保持器主体的周缘的下部支撑部和用于从电池保持器主体插入到电子设备的包装的电池插入口中时从上方接收电池保持体的上部支撑部，如IC卡。上下支撑部交替地设置在包装的插入孔的内部。

6. 发明授权

US5445677A Apparatus for manufacturing semiconductor and method of manufacturing semiconductor 失效
标题翻译：半导体制造装置及半导体制造方法
公开(公告)号：US5445677A
公开(公告)日：1995-08-29
申请号：US241572
申请日：1994-05-12
申请人： Yoshinobu Kawata , Toshinobu Banjo
发明人： Yoshinobu Kawata , Toshinobu Banjo
IPC分类号： H01L21/205 , C23C16/04 , C23C16/44 , C23C16/455 , C23C16/458 , H01L21/683 , C23C16/00
CPC分类号： C23C16/45565 , C23C16/04 , C23C16/45508 , C23C16/45521 , C23C16/4586 , H01L21/6838
摘要： A treatment utilizing chemical vapor deposition is conducted on a major treatment surface (14) of a semiconductor substrate (8) under the condition where the semiconductor substrate (8) is held on a bottom surface of a stage (10) by suction force which is caused by reducing pressure in a vacuum pocket (13). In such a treatment, inert gas supplied by an inert gas feeder (24) is fed through a fluid duct (43) and inert gas feed holes (52) to an inert gas jetting gap (32) which is a space between an outermost circular surface (31) of an outer portion of a substrate holding surface (11) and a reverse major surface (12) of the semiconductor substrate (8). The inert gas is jetted out of the inert gas jetting gap (32) to a reaction chamber (6). Jets of the inert gas prevents undesirable objects or reaction byproduct (34) from easily penetrating in an inner region of the substrate holding surface (11). Thus, deposition of the reaction byproduct is prevented, and reduction of strength of holding the semiconductor substrate by suction force is avoided. As a result, operating efficiency of a semiconductor manufacturing apparatus and the yield are enhanced.
摘要翻译：在半导体基板（8）通过抽吸力将其保持在台（10）的底面上的状态下，在半导体基板（8）的主处理表面（14）上进行利用化学气相沉积的处理，由真空口袋（13）中的压力降低引起的。在这种处理中，由惰性气体供给器（24）供应的惰性气体通过流体管道（43）和惰性气体供给孔（52）供给到惰性气体喷射间隙（32），惰性气体喷射间隙（32）是最外圆衬底保持面（11）的外部部分的表面（31）和半导体衬底（8）的反向主表面（12）。将惰性气体从惰性气体喷射间隙（32）喷射到反应室（6）。惰性气体的喷射可防止不期望的物体或反应副产物（34）容易地渗透到基板保持表面（11）的内部区域中。因此，防止反应副产物的沉积，并且避免了通过抽吸力来保持半导体衬底的强度的降低。结果，提高了半导体制造装置的工作效率和成品率。

7. 发明授权

US5246513A Die bonding apparatus and method of controlling the same 失效
标题翻译： DIE结合装置及其控制方法
公开(公告)号：US5246513A
公开(公告)日：1993-09-21
申请号：US763214
申请日：1991-09-20
申请人： Masaharu Yoshida , Toshinobu Banjo , Akira Yamamoto
发明人： Masaharu Yoshida , Toshinobu Banjo , Akira Yamamoto
IPC分类号： H01L21/52 , H01L21/00
CPC分类号： H01L21/67144 , H01L24/75
摘要： A die bonding apparatus includes a Z-axis direction drive mechanism having a main drive motor, a bonding arm having a first arm and a second arm, a holding device provided on one end of the second arm for releasably holding a die, a torque generating device for applying a torque to the second arm, a parallel position detecting device for detecting a displacement of the second arm from a state in which the die and the bonding surface are parallel to each other and for generating a displacement signal, and a control device for storing an inclination of the bonding surface beforehand and for controlling the descent of the second arm and the application of a load to the die.
摘要翻译：芯片接合装置包括具有主驱动电机的Z轴方向驱动机构，具有第一臂和第二臂的接合臂，设置在第二臂的一端上用于可释放地保持模具的保持装置，转矩产生用于向第二臂施加扭矩的装置，用于检测第二臂从模具和接合面彼此平行的状态以及用于产生位移信号的位移的平行位置检测装置，以及控制装置用于预先存储接合表面的倾斜度并且用于控制第二臂的下降和向模具施加负载。

8. 发明授权

US4924077A Memory card 失效
标题翻译：存储卡
公开(公告)号：US4924077A
公开(公告)日：1990-05-08
申请号：US154319
申请日：1988-02-10
申请人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda
发明人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda
IPC分类号： G06K19/07 , B42D15/10 , G06K19/077 , G11C5/00
CPC分类号： G06K19/07743
摘要： A memory card having: a card-like package; a semiconductor module disposed within the package; a plurality of electrode terminals mounted on the package for external electrical connection of the semiconductor module in the package to an external circuit; a metallic shutter disposed on the package and movable between an open position in which the electrode terminals are exposed for the electrical connection and a closed position in which the electrode terminals are covered; and an insulating layer formed on a surface of the shutter which faces the electrodes.
摘要翻译：一种存储卡，具有：卡状包装; 设置在所述封装内的半导体模块; 安装在所述封装上的多个电极端子，用于将所述封装中的半导体模块外部电连接到外部电路; 金属快门，其设置在所述封装上，并且在所述电极端子暴露于所述电连接的打开位置和所述电极端子被覆盖的关闭位置之间可移动; 以及形成在快门面向电极的表面上的绝缘层。

9. 发明授权

US4838804A Mechanism for connecting IC card and external device 失效
标题翻译：连接IC卡和外部设备的机制
公开(公告)号：US4838804A
公开(公告)日：1989-06-13
申请号：US173149
申请日：1988-03-25
申请人： Toshinobu Banjo , Tetsuya Ueda , Shigeo Onoda , Yasushi Kasatani
发明人： Toshinobu Banjo , Tetsuya Ueda , Shigeo Onoda , Yasushi Kasatani
IPC分类号： G06K7/00 , H01R12/50 , H01R13/62 , H01R13/71
CPC分类号： G06K7/0047 , H01R12/722 , H01R23/70 , H01R13/71 , Y10S439/955
摘要： A connection mechanism for connecting an IC card and an external device to each other, having: a plurality of electrode terminals formed on the IC card package in which a semiconductor device is incorporated, the electrode terminals being adapted to connect the semiconductor device to the external device; a pair of engagement recesses formed on the package of the IC card; and a connector provided in the external device, the connector having a card receiving portion into which the IC card is inserted, a plurality of electrode-contacting pieces disposed inside the card receiving portion and capable of contacting the plurality of electrode terminals of the IC card when the IC card is inserted into the card receiving portion to a predetermined position, and a pair of retaining members disposed on the card receiving portion and capable of advancing toward or retreating from the engagement recesses of the IC card and resiliently engaging the engagement recesses so as to retain the IC card at the predetermined position when the IC card is inserted to the predetermined position.

10. 发明授权

US07390188B2 Resin molding apparatus 失效
标题翻译：树脂成型装置
公开(公告)号：US07390188B2
公开(公告)日：2008-06-24
申请号：US11387842
申请日：2006-03-24
申请人： Toshinobu Banjo , Shigeru Hirata , Masanori Shirasawa
发明人： Toshinobu Banjo , Shigeru Hirata , Masanori Shirasawa
IPC分类号： B29C45/64
CPC分类号： B29C45/1761 , B29C45/1744 , B29C2045/1763
摘要： A resin molding apparatus includes a fixing member to which a top mold is attached, a movable member to which a bottom mold is attached, a push-up member provided below the movable member, a drive mechanism moving the push-up member in upward/downward direction, and a flexible joint provided between the movable member and the push-up member. The push-up force of the drive mechanism is transmitted from the push-up member via the flexible joint to the movable member. Thus, a crack does not occur at a connection portion between the push-up member and the movable member. Therefore, a gap is not created between the top mold and the bottom mold. As a result, an excellent molded product is formed.
摘要翻译：树脂成形装置包括：固定部件，顶模附着到该固定部件，安装有底模的可动部件，设置在可动部件的下方的上推部件，将上推部件向上方移动的驱动机构，以及设置在可动构件和上推构件之间的柔性接头。驱动机构的上推力从上推构件通过柔性接头传递到可动构件。因此，在上推构件和可动构件之间的连接部分处不会发生裂纹。因此，在顶模和底模之间不产生间隙。结果，形成了优异的模制品。

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