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1. 发明授权

US07323093B2 Producing method of flexible wired circuit board 有权
标题翻译：柔性布线电路板的制作方法
公开(公告)号：US07323093B2
公开(公告)日：2008-01-29
申请号：US10950428
申请日：2004-09-28
申请人： Toshiki Naito , Yoshifumi Shinogi , Takeshi Yamato
发明人： Toshiki Naito , Yoshifumi Shinogi , Takeshi Yamato
IPC分类号： C25D1/00 , C25D5/02
CPC分类号： H05K3/0097 , H05K1/0393 , H05K3/007 , H05K3/108 , H05K3/28 , H05K2203/0156 , H05K2203/1545
摘要： A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive pattern 3 on a surface of the elongate substrate 1 by the semi-additive process using electrolysis plating and then annealing the elongate substrate 1 with the conductive pattern 3 in its wound up state, a stiffener sheet 9 having a width narrower than the elongate substrate 1 is bonded to the back side of the elongate substrate 1. Thereafter, an oxidized film formed on a surface of the conductive pattern 3 is removed and then a solder resist 11 is formed thereon. This prevents the strip of the stiffener sheet 9 from the elongate substrate 1 and in turn prevents etching solution or developing solution from entraining in a gap therebetween.
摘要翻译：一种柔性布线电路板的制造方法，其可以防止在细长基板和与其结合的加强板之间形成间隙，以防止所获得的柔性布线电路板的污染。在通过使用电解电镀的半添加方法在细长基板1的表面上形成导电图案3的过程之后的过程中，然后使导电图案3处于其卷绕状态的细长基板1退火，加强件具有比细长基板1窄的宽度的片材9被接合到细长基板1的背面。之后，去除在导电图案3的表面上形成的氧化膜，然后在其上形成阻焊剂11。这样可以防止加强板9从细长基板1上剥离，从而防止蚀刻溶液或显影液夹带在它们之间的间隙中。

2. 发明申请

US20050067293A1 Producing method of flexible wired circuit board 有权
标题翻译：柔性布线电路板的制作方法
公开(公告)号：US20050067293A1
公开(公告)日：2005-03-31
申请号：US10950428
申请日：2004-09-28
申请人： Toshiki Naito , Yoshifumi Shinogi , Takeshi Yamato
发明人： Toshiki Naito , Yoshifumi Shinogi , Takeshi Yamato
IPC分类号： H05K3/28 , H05K1/00 , H05K1/02 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/22 , C25D5/02
CPC分类号： H05K3/0097 , H05K1/0393 , H05K3/007 , H05K3/108 , H05K3/28 , H05K2203/0156 , H05K2203/1545
摘要： A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive pattern 3 on a surface of the elongate substrate 1 by the semi-additive process using electrolysis plating and then annealing the elongate substrate 1 with the conductive pattern 3 in its wound up state, a stiffener sheet 9 having a width narrower than the elongate substrate 1 is bonded to the back side of the elongate substrate 1. Thereafter, an oxidized film formed on a surface of the conductive pattern 3 is removed and then a solder resist 11 is formed thereon. This prevents the strip of the stiffener sheet 9 from the elongate substrate 1 and in turn prevents etching solution or developing solution from entraining in a gap therebetween.
摘要翻译：一种柔性布线电路板的制造方法，其可以防止在细长基板和与其结合的加强板之间形成间隙，以防止所获得的柔性布线电路板的污染。在通过使用电解电镀的半添加方法在细长基板1的表面上形成导电图案3的过程之后的过程中，然后使导电图案3处于其卷绕状态的细长基板1退火，加强件具有比细长基板1窄的宽度的片材9被接合到细长基板1的背面。之后，去除在导电图案3的表面上形成的氧化膜，然后在其上形成阻焊剂11。这样可以防止加强板9从细长基板1上剥离，从而防止蚀刻溶液或显影液夹带在它们之间的间隙中。

3. 发明授权

US06889432B2 Method of manufacturing double-sided circuit board 失效
标题翻译：制造双面电路板的方法
公开(公告)号：US06889432B2
公开(公告)日：2005-05-10
申请号：US10358219
申请日：2003-02-05
申请人： Toshiki Naito , Yoshifumi Shinogi , Daisuke Uenda
发明人： Toshiki Naito , Yoshifumi Shinogi , Daisuke Uenda
IPC分类号： H05K1/02 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/38 , H05K3/42 , H01K3/10
CPC分类号： H05K1/0265 , H05K3/064 , H05K3/108 , H05K3/388 , H05K3/421 , H05K3/426 , H05K3/427 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09509 , H05K2201/09736 , H05K2203/0574 , H05K2203/0577 , H05K2203/1394 , Y10T29/49117 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T428/24917
摘要： A method for manufacturing a double-sided circuit board from a board material having a first electric conductor layer and a first electrically insulating layer, including the steps of: making conduction holes in the board material so as to penetrate only the first electrically insulating layer or both the first electrically insulating layer and the first electric conductor layer; forming an electrically conductive thin-film layer on a surface of the first electrically insulating layer and wall surfaces of the conduction holes; forming a second electrically insulating layer on the electrically conductive thin-film layer; forming a first electric conductor wiring by electroplating on predetermined portions of the electrically conductive thin-film layer; covering the first electric conductor wiring with a chemical-resistant film; forming a second electric conductor wiring by chemically dissolving a predetermined portion of another surface of the first electric conductor layer; and removing the second electrically insulating layer and the film.
摘要翻译：一种从具有第一导电体层和第一电绝缘层的基板材料制造双面电路板的方法，包括以下步骤：在基板材料中形成导电孔，以仅穿透第一电绝缘层或第一电绝缘层和第一导电体层; 在第一电绝缘层的表面和导电孔的壁表面上形成导电薄膜层; 在所述导电薄膜层上形成第二电绝缘层; 通过电镀在导电薄膜层的预定部分上形成第一导电体布线; 用耐化学性膜覆盖第一导电线; 通过化学溶解所述第一导电体层的另一个表面的预定部分来形成第二导电体布线; 以及去除所述第二电绝缘层和所述膜。

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