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    • 2. 发明申请
    • Assembly with Enhanced Thermal Uniformity and Method For Making Thereof
    • 具有增强的热均匀性的组装及其制造方法
    • US20080066683A1
    • 2008-03-20
    • US11554573
    • 2006-10-30
    • Kensuke FujimuraAkira MiyaharaTakeshi Higuchi
    • Kensuke FujimuraAkira MiyaharaTakeshi Higuchi
    • C23C16/00
    • H01L21/67103H05B3/143
    • An assembly is provided for regulating the temperature of and supporting a heating target such as semiconductor substrate or a metal/ceramic mold or other industrial processes that require temperature regulations such as degassing or annealing. In one embodiment, the assembly comprises a heating target support for supporting the heating target ; a ceramic heating element for heating the heating target to a temperature of at least 300° C.; a first thermally conductive layer disposed between the substrate support and the ceramic heating layer; a second layer disposed below the ceramic heating layer. Both the first layer and the second layer in the heater assembly have an elastic modulus of less than 5 GPa, for biasing the ceramic heating layer without causing damage to the ceramic layer while still providing uniform and excellent heating to the substrate.
    • 提供了一种组件,用于调节加热目标如半导体基板或金属/陶瓷模具的温度和其他需要诸如脱气或退火等温度规定的工业过程。 在一个实施例中,组件包括用于支撑加热靶的加热靶支撑件; 用于将加热靶加热到至少300℃的陶瓷加热元件; 设置在所述基板支撑件和所述陶瓷加热层之间的第一导热层; 设置在陶瓷加热层下方的第二层。 加热器组件中的第一层和第二层都具有小于5GPa的弹性模量,用于偏压陶瓷加热层而不会对陶瓷层造成损害,同时仍然对基板提供均匀和优异的加热。