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    • 6. 发明授权
    • Method of manufacturing a semiconductor device with a planar interlayer
insulating film
    • 制造具有平面层间绝缘膜的半导体器件的方法
    • US5077238A
    • 1991-12-31
    • US353892
    • 1989-05-18
    • Atsuhiro FujiiToshihiko MinamiHideki Genjo
    • Atsuhiro FujiiToshihiko MinamiHideki Genjo
    • H01L21/3105H01L21/311H01L21/312H01L21/768
    • H01L21/31111H01L21/31055H01L21/312H01L21/76819H01L21/76804Y10S148/133Y10S438/98
    • A method of manufacturing a semiconductor device in which an element is flattened by improving a technique of forming an interlayer insulating film. A thick insulating film having a film thickness necessary for a convexo-concave pattern to be flattened is deposited on a semiconductor substrate comprising the convexo-concave pattern of an element, a wiring and the like. Then, the thick insulating film is etched until it becomes a predetermined film thickness to form an interlayer insulating film having a predetermined film thickness from said thick insulating film. At this time, since acid and water are attached on the surface of the interlayer insulating film, a new film is formed on the surface of the interlayer insulating film to cover this water and acid. Then, a resist pattern having a desired configuration is formed on this new film. A contact hole is formed on the interlayer insulating film using this resist pattern. Thereafter, a wiring pattern electrically connected to the element is formed on the interlayer insulating film through the contact hole. According to this method, since the acid and water attached on the interlayer insulating film are covered with the new film, the adhesion between the interlayer insulating film and the resist is improved. As a result, the contact hole can be opened reliably, whereby the element is surely connected to the wiring pattern and a semiconductor device can be provided with high reliability.
    • 通过改进形成层间绝缘膜的技术来制造半导体器件的方法,其中元件被平坦化。 在包含元件的凸凹图形,布线等的半导体衬底上沉积具有要平坦化的凹凸图案所需的膜厚度的厚绝缘膜。 然后,对厚的绝缘膜进行蚀刻,直至其变为预定的膜厚度,以从所述厚绝缘膜形成具有预定膜厚度的层间绝缘膜。 此时,由于酸和水附着在层间绝缘膜的表面上,所以在层间绝缘膜的表面上形成新的膜以覆盖该水和酸。 然后,在该新膜上形成具有所需结构的抗蚀剂图案。 使用该抗蚀剂图案在层间绝缘膜上形成接触孔。 此后,通过接触孔在层间绝缘膜上形成与元件电连接的布线图案。 根据该方法,由于附着在层间绝缘膜上的酸和水被新的膜覆盖,所以层间绝缘膜和抗蚀剂之间的粘合性提高。 结果,可以可靠地打开接触孔,从而元件可靠地连接到布线图案,并且可以提供高可靠性的半导体器件。