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1. 发明申请

US20060019832A1 Metal substrate for an oxide superconducting wire, oxide superconducting wire and manufacturing method of the same 有权
标题翻译：用于氧化物超导线的金属衬底，氧化物超导线及其制造方法
公开(公告)号：US20060019832A1
公开(公告)日：2006-01-26
申请号：US11239204
申请日：2005-09-30
申请人： Toshihiko Maeda , Toru Izumi , Katsuya Hasegawa , Shigenobu Asada , Teruo Izumi , Yuh Shiohara
发明人： Toshihiko Maeda , Toru Izumi , Katsuya Hasegawa , Shigenobu Asada , Teruo Izumi , Yuh Shiohara
IPC分类号： H01L39/24
CPC分类号： H01L39/2454 , Y10T29/49014
摘要： A metal substrate for an oxide superconducting wire, which comprises a polycrystalline metal substrate with a rolled aggregate structure having a {100} plane which is parallel to the rolled surface and a axis which is parallel to the rolling direction, and an oxide crystal layer comprising an oxide of the polycrystalline metal and formed on a surface of the polycrystalline metal substrate, wherein at least 90% of grain boundaries in the oxide crystal layer have an inclination of 10° or less, and at least 90% of the {100} plane of the oxide crystal layer make an angle of 10° or less with the surface of the polycrystalline metal substrate.
摘要翻译：一种用于氧化物超导线的金属基底，其包括具有平行于轧制表面的{100}平面和平行于轧制方向的<001>轴的轧制骨料结构的多晶金属基体和氧化物所述多晶金属的氧化物形成在所述多晶金属基板的表面上，所述氧化物晶层中的至少90％的晶界倾斜度为10°以下，所述{ 100}面与多晶金属基板的表面成10°以下的角度。

2. 发明授权

US07431868B2 Method of manufacturing a metal substrate for an oxide superconducting wire 有权
标题翻译：制造氧化物超导线金属基板的方法
公开(公告)号：US07431868B2
公开(公告)日：2008-10-07
申请号：US11239204
申请日：2005-09-30
申请人： Toshihiko Maeda , Toru Izumi , Katsuya Hasegawa , Shigenobu Asada , Teruo Izumi , Yuh Shiohara
发明人： Toshihiko Maeda , Toru Izumi , Katsuya Hasegawa , Shigenobu Asada , Teruo Izumi , Yuh Shiohara
IPC分类号： H01B12/00 , H01L39/24 , B05D5/12
CPC分类号： H01L39/2454 , Y10T29/49014
摘要： A metal substrate for an oxide superconducting wire, which comprises a polycrystalline metal substrate with a rolled aggregate structure having a {100} plane which is parallel to the rolled surface and a axis which is parallel to the rolling direction, and an oxide crystal layer comprising an oxide of the polycrystalline metal and formed on a surface of the polycrystalline metal substrate, wherein at least 90% of grain boundaries in the oxide crystal layer have an inclination of 10° or less, and at least 90% of the {100} plane of the oxide crystal layer make an angle of 10° or less with the surface of the polycrystalline metal substrate.
摘要翻译：一种用于氧化物超导线的金属基底，其包括具有平行于轧制表面的{100}平面和平行于轧制方向的<001>轴的轧制骨料结构的多晶金属基体和氧化物所述多晶金属的氧化物形成在所述多晶金属基板的表面上，所述氧化物晶层中的至少90％的晶界倾斜度为10°以下，所述{ 100}面与多晶金属基板的表面成10°以下的角度。

3. 发明申请

US20090091018A1 Electronic Component Sealing Substrate, Electronic Component Sealing Substrate to be Divided Into a Plurality of Pieces, Electronic Apparatus Including Electronic Component Sealing Substrate, and Method for Producing Electronic Apparatus 有权
标题翻译：电子部件密封基板，分割成多个部件的电子部件密封基板，包括电子部件密封基板的电子设备以及电子设备的制造方法
公开(公告)号：US20090091018A1
公开(公告)日：2009-04-09
申请号：US12094132
申请日：2006-11-16
申请人： Toshihiko Maeda , Katsuyuki Yoshida , Kouzou Makinouchi
发明人： Toshihiko Maeda , Katsuyuki Yoshida , Kouzou Makinouchi
IPC分类号： H01L23/48 , H01L21/02
CPC分类号： B81B7/0064 , B81B2207/092 , B81B2207/093 , B81B2207/095 , B81B2207/097 , B81C2203/0118 , B81C2203/035 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/94 , H01L2924/00014 , H01L2924/1461 , H01L2924/15311 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided. An electronic component sealing substrate (4) for hermetically sealing a micro electronic mechanical system (4) of an electronic component (2) that includes a semiconductor substrate (5), the micro electronic mechanical system (3) formed on a main face of the semiconductor substrate (5), and an electrode (6) electrically connected to the micro electronic mechanical system (3), includes an insulating substrate (7) that has a first main face joined to the main face of the semiconductor substrate (5) so as to hermetically seal the micro electronic mechanical system (3), and a wiring conductor (8) that has an end extending to the first main face of the insulating substrate (7) and is electrically connected to the electrode (6) of the electronic component (2), and the end of the wiring conductor (8) is positioned outside a joined portion of the main face of the semiconductor substrate (5) and the first main face of the insulating substrate (7).
摘要翻译：提供一种电子部件密封基板，其能够构成抑制电连接路径和微电子机械系统之间的电磁耦合和无线电频率噪声的影响的电子设备。一种用于气密密封包括半导体衬底（5）的电子部件（2）的微电子机械系统（4）的电子部件密封基板（4），形成在所述微电子机械系统半导体衬底（5）和与微电子机械系统（3）电连接的电极（6）包括绝缘衬底（7），其具有接合到半导体衬底（5）的主面的第一主面，因此为了气密地密封微电子机械系统（3），以及布线导体（8），其具有延伸到绝缘基板（7）的第一主面的端部，并且电连接到电子器件的电极（6）（2），并且布线导体（8）的端部位于半导体基板（5）的主面和绝缘基板（7）的第一主面的接合部的外侧。

4. 发明授权

US06626692B2 INSERTION AND WITHDRAWAL CONNECTOR APPARATUS, STRUCTURE OF REMOTE CONTROLLING ENGAGEMENT AND SEPARATION THEREOF, AND CONNECTING FRAME BLOCK STRUCTURE FOR INSERTION AND WITHDRAWAL CONNECTOR APPARATUS OR THE LIKE 失效
标题翻译：插入和拔出连接器装置，远程控制结构及其分离结构，以及连接插入和插拔连接器装置的框架结构
公开(公告)号：US06626692B2
公开(公告)日：2003-09-30
申请号：US10054478
申请日：2002-01-22
申请人： Toshihiko Maeda , Yoshinori Mizusawa , Osamu Hashiguchi , Kazuomi Sato , Hisashi Ishida , Hiroyuki Tsuzuki , Masahiro Yamada , Masahiro Yamauchi
发明人： Toshihiko Maeda , Yoshinori Mizusawa , Osamu Hashiguchi , Kazuomi Sato , Hisashi Ishida , Hiroyuki Tsuzuki , Masahiro Yamada , Masahiro Yamauchi
IPC分类号： H01R13627
CPC分类号： H01R13/518 , B63B22/04 , F16B5/02 , H01R13/6272 , H01R13/62905 , H01R13/64 , H04Q1/023 , H04Q1/14 , Y10S439/953 , Y10S439/954
摘要： There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces. The lance (5f) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (5g) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (10d) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.
摘要翻译：提供了插入和取出连接器装置，其中多个连接器只能在能够与连接器接收体内的多个配合连接器接合和分离的范围内移动。连接器接收体（1）具有一对平行框架（3），位于两端部的一对框架块（4）和多个分隔构件（5）。一个连接器（10）和一个配合连接器被接收在多个空间部分中的每一个中，即，由一对框架分隔的接收室，一对框架块和多个分隔构件。每个分隔构件具有一对具有弹簧特性的喷枪（5f，5g），并且每个连接器在两个侧表面上具有一对互锁槽部分（10g）。喷枪（5f）与连接器中的一个侧表面上的互锁槽部互锁，并且喷枪（5g）与连接器中的另一侧面上的互锁槽部互锁。每个连接器在一个侧表面上的上端部和另一个侧表面的下端部处具有凸部（10d），并且每个凸部与每个分隔构件互锁。

5. 发明授权

US06149447A Insertion and withdrawal connector apparatus, structure of remote controlling engagement and separation thereof, and connecting frame block structure for insertion and withdrawal connector apparatus or the like 失效
公开(公告)号：US06149447A
公开(公告)日：2000-11-21
申请号：US145844
申请日：1998-09-02
申请人： Toshihiko Maeda , Yoshinori Mizusawa , Osamu Hashiguchi , Kazuomi Sato , Hisashi Ishida , Hiroyuki Tsuzuki , Masahiro Yamada , Masahiro Yamauchi
发明人： Toshihiko Maeda , Yoshinori Mizusawa , Osamu Hashiguchi , Kazuomi Sato , Hisashi Ishida , Hiroyuki Tsuzuki , Masahiro Yamada , Masahiro Yamauchi
IPC分类号： B63B22/04 , H01R13/518 , H01R13/629 , H04Q1/14 , H01R13/62
CPC分类号： H01R13/518 , B63B22/04 , F16B5/02 , H01R13/62905 , H01R13/64 , H04Q1/023 , H04Q1/14 , H01R13/6272 , Y10S439/953 , Y10S439/954
摘要： There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces. The lance (5f) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (5g) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (10d) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.

6. 发明授权

US5220246A Method and apparatus for transmitting information using arc 失效
标题翻译：使用电弧传输信息的方法和装置
公开(公告)号：US5220246A
公开(公告)日：1993-06-15
申请号：US565210
申请日：1990-08-08
申请人： Eizo Ide , Kitoshi Hashimoto , Takijiro Shimamoto , Tetsuo Horie , Yasuyuki Maehara , Toshihiko Maeda
发明人： Eizo Ide , Kitoshi Hashimoto , Takijiro Shimamoto , Tetsuo Horie , Yasuyuki Maehara , Toshihiko Maeda
IPC分类号： H04R23/00
CPC分类号： H04R23/004
摘要： An information transmission method using arc and apparatus thereof are applied to a loudspeaker and the like having the function of illumination. The information transmission method is characterized in that arc current supplied to an arc generating device is modulated by a signal based on information to vibrate arc column so that at least one of audible waves, ultrasonic waves and arc light is employed to transmit the information. Arc having small mechanical inertia is employed as a sound producing device and accordingly can be used as a loudspeaker having a good frequency characteristic and large output. It can be used as a sound producing device having the function of illumination by utilizing strong light emitted from arc column.
摘要翻译：使用电弧及其装置的信息传输方法应用于具有照明功能的扬声器等。信息传输方法的特征在于，提供给电弧发生装置的电弧电流通过基于信息的信号进行调制，以振动电弧列，使得使用声波，超声波和电弧光中的至少一个来传送信息。采用具有小的机械惯性的电弧作为声音产生装置，因此可以用作具有良好的频率特性和大的输出的扬声器。它可以用作通过利用从电弧柱发出的强光而具有照明功能的声音产生装置。

7. 发明授权

US08204352B2 Optical apparatus, sealing substrate, and method of manufacturing optical apparatus 有权
标题翻译：光学装置，密封基板以及光学装置的制造方法
公开(公告)号：US08204352B2
公开(公告)日：2012-06-19
申请号：US12745634
申请日：2008-12-01
申请人： Toshihiko Maeda
发明人： Toshihiko Maeda
IPC分类号： G02B6/00
CPC分类号： B81B7/007 , B81C1/00317 , G02B26/0841 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/1461 , H01L2924/00 , H01L2224/0401
摘要： An optical apparatus includes an element substrate on whose surface an optical element is provided; a wiring board disposed so as to face the optical element; a sealing member and a conductive member provided between the element substrate and the wiring board. The sealing member surrounds and hermetically seals the optical element. The conductive member electrically connects the optical element and the wiring board. The wiring board has a light-transmitting area transmitting light to the optical element.
摘要翻译：光学装置包括其表面上设置有光学元件的元件基板; 以与所述光学元件相对的方式配置的布线板; 密封构件和设置在元件基板和布线基板之间的导电构件。密封构件包围并密封光学元件。导电部件电连接光学元件和布线板。布线板具有将光传递到光学元件的透光区域。

8. 发明授权

US06287135B1 Connector engaging/disengaging device accommodating a plurality of connector pairs to mate with each other 失效
标题翻译：连接器接合/分离装置，其容纳多个连接器对以彼此配合
公开(公告)号：US06287135B1
公开(公告)日：2001-09-11
申请号：US09537980
申请日：2000-03-29
申请人： Osamu Hashiguchi , Yoshinori Mizusawa , Toshihiko Maeda , Masahiro Yamada , Shin Kamiyamane , Satoru Nagase
发明人： Osamu Hashiguchi , Yoshinori Mizusawa , Toshihiko Maeda , Masahiro Yamada , Shin Kamiyamane , Satoru Nagase
IPC分类号： H01R1362
CPC分类号： H01R13/518
摘要： A connector engaging/disengaging mechanism comprises a frame member (3) and connector carriers (7) for engaging and disengaging first connector (40) mounted on a printed circuit board (5) fixed onto the frame (3) and second connectors (30) held on said connector carriers (7). The frame member is provided with guide grooves (11) in which the connector carriers (7) are received to be slidable in an engaging direction (A) and a disengaging direction (B). Each of the connector carriers (7) has connector holding portions for holding the second connectors and an operating portion (15) for moving the connector carrier to engage and disengage the second connectors (30) to and from the first connector (40). When the operating portion (15) is manually operated to move the connector carrier in the engaging direction, the second connectors (30) are connected with the first connectors (40). When the connector carrier is moved in the disengaging direction, the second connectors (30) are disconnected from the first connectors (40).
摘要翻译：连接器接合/分离机构包括框架构件（3）和用于接合和分离安装在固定到框架（3）和第二连接器（30）上的印刷电路板（5）上的第一连接器（40）的连接器支架（7）保持在所述连接器支架（7）上。框架构件设置有引导槽（11），其中，接合器支架（7）被容纳在接合方向（A）和分离方向（B）上可滑动。每个连接器支架（7）具有用于保持第二连接器的连接器保持部分和用于移动连接器托架以使第二连接器（30）与第一连接器（40）接合和分离的操作部分（15）。当操作部分（15）被手动操作以沿接合方向移动连接器支架时，第二连接器（30）与第一连接器（40）连接。当连接器支架沿分离方向移动时，第二连接器（30）与第一连接器（40）断开。

9. 发明授权

US5100854A Phosphonium salts and processes for production of and uses for the same 失效
标题翻译：磷酸盐钠盐及其制备方法和用途
公开(公告)号：US5100854A
公开(公告)日：1992-03-31
申请号：US620211
申请日：1990-11-30
申请人： Toshihiko Maeda , Yasuo Tokitoh , Noriaki Yoshimura
发明人： Toshihiko Maeda , Yasuo Tokitoh , Noriaki Yoshimura
IPC分类号： B01J31/02 , B01J31/20 , B01J31/22 , B01J31/24 , B01J31/28 , B01J31/40 , C07C2/74 , C07C29/36 , C07C33/02 , C07C41/06 , C07F9/54
CPC分类号： B01J31/28 , B01J31/0268 , B01J31/24 , C07C2/74 , C07C29/36 , C07C33/02 , C07C41/06 , C07C67/055 , C07F9/5428 , B01J2231/20 , B01J2531/824 , B01J31/20 , B01J31/2208 , B01J31/40 , C07C2531/02 , Y02P20/584
摘要： Novel phosphonium salts of the general formula ##STR1## wherein R.sup.1 and R.sup.2 each is a hydrogen atom or a hydrocarbon group of 1 to 12 carbon atoms which may optionally be substituted; R.sup.3 is a hydrogen atom or a hydrocarbon group of 1 to 5 carbon atoms which may optionally be substituted; R.sup.4, R.sup.5 and R.sup.6 each is a hydrocarbon group of 1 to 8 carbon atoms which may optionally be substituted; X is a hydroxyl group, a hydroxycarbonyloxy group or a lower alkylcarbonyloxy group, and processes for production of the salts are described. Telomerization catalysts containing said phosphonium salts and processes for production of straight-chained alkadienyl compounds using the same catalysts are also provided.

10. 发明授权

US08159059B2 Microelectromechanical device and method for manufacturing the same 有权
标题翻译：微机电装置及其制造方法
公开(公告)号：US08159059B2
公开(公告)日：2012-04-17
申请号：US12438936
申请日：2007-01-29
申请人： Toshihiko Maeda
发明人： Toshihiko Maeda
IPC分类号： H01L23/02
CPC分类号： H01L23/10 , B81B7/0048 , B81B2201/0235 , H01L2224/16 , H01L2924/01079 , H01L2924/09701 , H01L2924/1461 , H01L2924/16195 , H01L2924/00
摘要： The present invention relates to a microelectromechanical device having a simple structure in which strains of the semiconductor substrate can be reduced. Both a semiconductor substrate 17 and a second substrate 14 are disposed to face a first main surface 13a of the first substrate 13 and connected to the first main surface 13a of the first substrate 13. With this structure, no internal line or side surface line is necessary, and the structure of the first substrate 13 can be simplified. The length of the line can be decreased to decrease the resistance of the line, and good electrical characteristics can be achieved at low energy consumption. The strains in the semiconductor substrate 17 can also be reduced.
摘要翻译：本发明涉及具有简单结构的微机电器件，其中可以减少半导体衬底的应变。半导体基板17和第二基板14均设置成与第一基板13的第一主表面13a相对并且连接到第一基板13的第一主表面13a。利用这种结构，内部线或侧面线不是必要的话，能简化第一基板13的结构。可以减小线路的长度以降低线路的电阻，并且可以在低能量消耗下实现良好的电气特性。半导体衬底17中的应变也可以减小。

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