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1. 发明授权

US06905757B2 DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE 有权
标题翻译：包含用于形成印刷电路板的内置电容器层的电介质填料和具有使用含有树脂的相同介电填料形成的介电层的双面铜层压板以及双面铜箔层压板的生产方法
公开(公告)号：US06905757B2
公开(公告)日：2005-06-14
申请号：US10478419
申请日：2003-04-01
申请人： Toshifumi Matsushima , Hideaki Miwa , Akira Ichiryu , Kazuhiro Yamazaki , Tetsuro Sato , Fujio Kuwako
发明人： Toshifumi Matsushima , Hideaki Miwa , Akira Ichiryu , Kazuhiro Yamazaki , Tetsuro Sato , Fujio Kuwako
IPC分类号： B32B15/08 , B32B27/18 , B32B27/34 , B32B27/38 , C08K7/00 , C08K7/16 , C08L63/00 , C08L77/00 , C08L77/10 , H01L23/12 , H05K1/16 , H05K3/38 , B32B3/00
CPC分类号： H05K1/162 , C08K7/00 , C08L63/00 , C08L77/00 , C08L77/10 , H05K3/384 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , H05K2203/1476 , Y10T428/24917 , Y10T428/25 , C08L2666/20
摘要： An object is to provide a dielectric layer of a double-sided copper clad laminate, for use in formation of a built-in capacitor layer, which can be formed in an optional thickness without using a skeletal material and is provided with a high strength. For the purpose of achieving the object, “a dielectric filler containing resin for use in formation of the built-in capacitor layer of a printed wiring board obtained by mixing a binder resin comprising 20 to 80 parts by weight of epoxy resin (inclusive of a curing agent), 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer, and a curing accelerator added in an appropriate amount according to need; and a dielectric filler which is a nearly spherical dielectric powder having perovskite structure which is 0.1 to 1.0 μm in the average particle size DIA, 0.2 to 2.0 μm in the weight cumulative particle size D50 based on the laser diffraction scattering particle size distribution measurement method, and 4.5 or less in the coagulation degree represented by D50/DIA where the weight cumulative particle size D50 and the average particle size DIA obtained by the image analysis”; and the like are used.
摘要翻译：本发明的目的是提供一种用于形成内置电容器层的双面覆铜层压板的介电层，其可以在不使用骨架材料的情况下以可选择的厚度形成并且具有高强度。为了实现该目的，“用于形成印刷线路板的内置电容器层的电介质填充剂含有树脂，其通过将包含20至80重量份的环氧树脂（包括固化剂），20〜80重量份溶剂可溶性芳族聚酰胺树脂聚合物和根据需要加入适量的固化促进剂;以及介电填料，其为具有钙钛矿结构的近似球形的电介质粉末，其为0.1〜基于激光衍射散射粒度分布测量方法，平均颗粒尺寸D IA IA为1.0μm，重量累积粒径D <50 <0.2的2.0-2.0μm，4.5 以下的重量累积粒度D 50和平均粒径D IA 通过图像分析获得“; 等等。

2. 发明授权

US06693793B2 Double-sided copper clad laminate for capacitor layer formation and its manufacturing method 有权
标题翻译：用于电容器层形成的双面铜箔层压板及其制造方法
公开(公告)号：US06693793B2
公开(公告)日：2004-02-17
申请号：US09981296
申请日：2001-10-15
申请人： Fujio Kuwako , Kazuhiro Yamazaki , Toshifumi Matsushima
发明人： Fujio Kuwako , Kazuhiro Yamazaki , Toshifumi Matsushima
IPC分类号： H01G408
CPC分类号： H01G4/005 , H01G4/20 , H05K1/162 , H05K3/384 , H05K3/389 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , H05K2203/0307 , Y10T29/435
摘要： The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The capacitor comprises a pair of parallel conductive foils separated by a pair of dielectric layers. The dielectric layers are further separated by a heat resistant film layer such that the capacitor exhibits excellent short circuit resistance. The resulting capacitor exhibits excellent void and electrical short resistance.
摘要翻译：本发明涉及可用于形成电容器的多层结构，其可嵌入印刷电路板或其它微电子器件中。电容器包括由一对电介质层分开的一对平行导电箔。电介质层被耐热膜层进一步分离，使得电容器表现出优异的短路电阻。所得到的电容器具有优异的空隙和电阻。

3. 发明申请

US20080107865A1 Electrodeposited Copper Foil with Carrier Foil with a Primer Resin Layer and Manufacturing Method Thereof 失效
标题翻译：具有引物树脂层的载体箔的电沉积铜箔及其制造方法
公开(公告)号：US20080107865A1
公开(公告)日：2008-05-08
申请号：US11662475
申请日：2005-09-09
申请人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato , Kensuke Nakamura , Hiroyuki Kon , Kenichiro Iwakiri
发明人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato , Kensuke Nakamura , Hiroyuki Kon , Kenichiro Iwakiri
IPC分类号： B32B3/00 , C25D7/00
CPC分类号： C25D7/0614 , B32B7/06 , B32B15/01 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/26 , B32B27/285 , B32B27/286 , B32B27/38 , B32B2255/10 , B32B2255/205 , B32B2255/24 , B32B2255/28 , B32B2270/00 , B32B2457/08 , C22C19/002 , C23C28/00 , C25D3/562 , H05K3/025 , H05K3/384 , H05K3/389 , H05K2201/0358 , H05K2203/0723 , Y10T428/12569 , Y10T428/24355
摘要： Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.
摘要翻译：本发明提供了一种具有载体箔的电沉积铜箔，即使在表面粗糙度低的情况下也能保证体铜层的表面与树脂基材层之间的高结合强度，即使销孔等保持体积也难以发生分层铜层或通孔的侧壁或与去污溶液等接触后的通孔等。为了解决这个问题，具有载体箔的电沉积铜箔具有底层树脂层，该底层树脂层包括接合界面层，体铜层，镀Ni-Zn合金层和底漆树脂层，该层以该顺序至少一个地形成涂布载体箔的表面。

4. 发明授权

US08431224B2 Resin composition for forming insulating layer of printed wiring board 有权
标题翻译：用于形成印刷线路板绝缘层的树脂组合物
公开(公告)号：US08431224B2
公开(公告)日：2013-04-30
申请号：US12530534
申请日：2008-03-21
申请人： Tetsuro Sato , Toshifumi Matsushima
发明人： Tetsuro Sato , Toshifumi Matsushima
IPC分类号： B32B15/092 , B32B27/38 , B05D3/02 , C08G59/30 , C08G59/38 , C08G59/40 , C08L63/00
CPC分类号： H05K1/0353 , C08G59/226 , C08G59/304 , H05K1/0326 , Y10T428/24917 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529
摘要： Disclosed is a halogen-free resin composition for printed wiring board production, which is remarkably reduced in quality deterioration due to moisture absorption of a semi-cured resin film (layer). Also disclosed is a copper film with resin or the like. The resin composition is characterized by containing a component A (one or more resins selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and bisphenol-AD epoxy resins, which have an epoxy equivalent of not more than 200, while being in a liquid state at 25 DEG C.), a component B (a linear polymer having a crosslinkable functional group), a component C (a crosslinking agent), a component D (an imidazole-based epoxy resin curing agent) and a component E (a phosphorus-containing epoxy resin). The resin composition is also characterized by containing 0.5-3.0% by weight of phosphorus atoms per 100% by weight of the resin composition. In the copper foil with resin, a resin layer is formed by using the resin composition.
摘要翻译：公开了一种用于印刷电路板生产的无卤树脂组合物，其由于半固化树脂膜（层）的吸湿而显着降低了质量劣化。还公开了具有树脂等的铜膜。树脂组合物的特征在于含有A组分（一种或多种选自环氧当量不超过200的双酚A环氧树脂，双酚F环氧树脂和双酚-AD环氧树脂的树脂，同时在25℃处于液态），组分B（具有交联性官能团的线性聚合物），组分C（交联剂），组分D（咪唑基环氧树脂固化剂）和成分E（含磷环氧树脂）。树脂组合物的特征还在于每100重量％的树脂组合物含有0.5-3.0重量％的磷原子。在具有树脂的铜箔中，通过使用树脂组合物形成树脂层。

5. 发明申请

US20100108368A1 RESIN COMPOSITION FOR FORMING INSULATING LAYER OF PRINTED WIRING BOARD 有权
标题翻译：形成印刷线路绝缘层的树脂组合物
公开(公告)号：US20100108368A1
公开(公告)日：2010-05-06
申请号：US12530534
申请日：2008-03-21
申请人： Tetsuro Sato , Toshifumi Matsushima
发明人： Tetsuro Sato , Toshifumi Matsushima
IPC分类号： H05K1/00 , C08L63/02 , B32B15/092 , H05K3/00
CPC分类号： H05K1/0353 , C08G59/226 , C08G59/304 , H05K1/0326 , Y10T428/24917 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529
摘要： Disclosed is a halogen-free resin composition for printed wiring board production, which is remarkably reduced in quality deterioration due to moisture absorption of a semi-cured resin film (layer). Also disclosed is a copper film with resin or the like. The resin composition is characterized by containing a component A (one or more resins selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and bisphenol-AD epoxy resins, which have an epoxy equivalent of not more than 200, while being in a liquid state at 25 DEG C.), a component B (a linear polymer having a crosslinkable functional group), a component C (a crosslinking agent), a component D (an imidazole-based epoxy resin curing agent) and a component E (a phosphorus-containing epoxy resin). The resin composition is also characterized by containing 0.5-3.0% by weight of phosphorus atoms per 100% by weight of the resin composition. In the copper foil with resin, a resin layer is formed by using the resin composition.
摘要翻译：公开了一种用于印刷电路板生产的无卤树脂组合物，其由于半固化树脂膜（层）的吸湿而显着降低了质量劣化。还公开了具有树脂等的铜膜。树脂组合物的特征在于含有A组分（一种或多种选自环氧当量不超过200的双酚A环氧树脂，双酚F环氧树脂和双酚-AD环氧树脂的树脂，同时在25℃处于液态），组分B（具有交联官能团的线性聚合物），组分C（交联剂），组分D（咪唑基环氧树脂固化剂）和成分E（含磷环氧树脂）。树脂组合物的特征还在于每100重量％的树脂组合物含有0.5-3.0重量％的磷原子。在具有树脂的铜箔中，通过使用树脂组合物形成树脂层。

6. 发明授权

US06831129B2 Resin-coated copper foil, and printed wiring board using resin-coated copper foil 失效
标题翻译：树脂被覆铜箔和使用树脂被覆铜箔的印刷线路板
公开(公告)号：US06831129B2
公开(公告)日：2004-12-14
申请号：US10156339
申请日：2002-05-24
申请人： Tetsuro Sato , Tsutomu Asai , Toshifumi Matsushima
发明人： Tetsuro Sato , Tsutomu Asai , Toshifumi Matsushima
IPC分类号： B05D302
CPC分类号： H05K3/4655 , B32B15/08 , C08L63/00 , C09D163/00 , H05K3/4626 , H05K3/4652 , H05K2201/0133 , H05K2201/0358 , Y10T428/31529 , C08L2666/02
摘要： An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: a. a high polymer having cross-linkable 5 to 30 parts by weight functional groups in the molecule, and a cross-linking agent therefor b. an epoxy resin that is liquid at 5 to 30 parts by weight room temperature c. a compound having the structure shown 40 to 90 parts by weight in Formula 1 where R is H or
摘要翻译：本发明的目的是提供一种用于制造印刷线路板的树脂涂覆铜箔，其在阻燃特性，树脂流动性，耐水性和剥离强度的总体平衡上是优异的。树脂被覆铜箔包括在铜箔的一侧上的树脂层，其特征在于，树脂层包含具有以下组成的树脂组合物：

7. 发明授权

US08815387B2 Copper foil with ultra thin adhesive layer, and a method for manufacturing the copper foil with ultra thin adhesive layer 有权
标题翻译：具有超薄粘合剂层的铜箔，以及具有超薄粘合剂层的铜箔的制造方法
公开(公告)号：US08815387B2
公开(公告)日：2014-08-26
申请号：US10565587
申请日：2004-07-15
申请人： Tetsuro Sato , Toshifumi Matsushima
发明人： Tetsuro Sato , Toshifumi Matsushima
IPC分类号： B32B15/08 , B32B15/20 , H05K3/38
CPC分类号： H05K3/386 , H05K3/389 , H05K2201/0358 , Y10T428/12431 , Y10T428/26 , Y10T428/265 , Y10T428/31522 , Y10T428/31529 , Y10T428/31678 , Y10T428/31681
摘要： The object of the present invention is to provide a copper foil with an ultra thin resin layer for a printed wiring board without roughening treatment. In order to achieve the object, there is adopted a copper foil with an ultra thin adhesive layer for a printed wiring board 1 or the like, which is a copper foil provided with an ultra thin primer resin layer for securing good laminating adhesiveness with a resin base material on one side of a copper foil 3 without roughening treatment, characterized in that a silane coupling agent layer 2 is formed on a surface of the copper foil without the roughening treatment having a surface roughness (Rz) of 2 μm or below, and an ultra thin primer resin layer 4 having a converted thickness of 1 to 5 μm is formed on the silane coupling agent layer 2.
摘要翻译：本发明的目的是提供一种具有用于印刷线路板的超薄树脂层的铜箔，而不进行粗糙化处理。为了实现该目的，采用了具有超薄粘合剂层的铜箔，用于印刷线路板1等，其是设置有超薄底漆树脂层的铜箔，用于确保与树脂的良好的层压粘合性在没有粗糙化处理的铜箔3的一面上的基材，其特征在于，在铜箔的表面上形成硅烷偶联剂层2，而不进行表面粗糙度（Rz）为2μm以下的粗糙化处理，在硅烷偶联剂层2上形成转化厚度为1〜5μm的超薄底漆树脂层4。

8. 发明授权

US08304091B2 Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof 失效
标题翻译：具有底漆树脂层的载体箔的电沉积铜箔及其制造方法
公开(公告)号：US08304091B2
公开(公告)日：2012-11-06
申请号：US11662475
申请日：2005-09-09
申请人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato , Kensuke Nakamura , Hiroyuki Kon , Kenichiro Iwakiri
发明人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato , Kensuke Nakamura , Hiroyuki Kon , Kenichiro Iwakiri
IPC分类号： B32B15/092 , C25D5/34
CPC分类号： C25D7/0614 , B32B7/06 , B32B15/01 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/26 , B32B27/285 , B32B27/286 , B32B27/38 , B32B2255/10 , B32B2255/205 , B32B2255/24 , B32B2255/28 , B32B2270/00 , B32B2457/08 , C22C19/002 , C23C28/00 , C25D3/562 , H05K3/025 , H05K3/384 , H05K3/389 , H05K2201/0358 , H05K2203/0723 , Y10T428/12569 , Y10T428/24355
摘要： Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.
摘要翻译：本发明提供了一种具有载体箔的电沉积铜箔，即使在表面粗糙度低的情况下也能保证体铜层的表面与树脂基材层之间的高结合强度，即使销孔等保持体积也难以发生分层铜层或通孔的侧壁或与去污溶液等接触后的通孔等。为了解决这个问题，具有载体箔的电沉积铜箔具有底层树脂层，该底层树脂层包括接合界面层，体铜层，镀Ni-Zn合金层和底漆树脂层，该层以该顺序至少一个地形成涂布载体箔的表面。

9. 发明申请

US20100068511A1 SURFACE-TREATED COPPER FOIL, SURFACE-TREATED COPPER FOIL WITH VERY THIN PRIMER RESIN LAYER, METHOD FOR MANUFACTURING THE SURFACE-TREATED COPPER FOIL, AND METHOD FOR MANUFACTURING THE SURFACE-TREATED COPPER FOIL WITH VERY THIN PRIMER RESIN LAYER 审中-公开
标题翻译：表面处理的铜箔，具有非常薄的树脂层的表面处理的铜箔，用于制造表面处理的铜箔的方法以及用非常薄的PREMER树脂层制造表面处理的铜箔的方法
公开(公告)号：US20100068511A1
公开(公告)日：2010-03-18
申请号：US12447575
申请日：2007-10-30
申请人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato
发明人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato
IPC分类号： B32B15/08 , C25D5/56 , B05D3/02
CPC分类号： H05K3/384 , C25D5/12 , C25D5/34 , C25D5/48 , C25D5/50 , C25D5/56 , C25D7/12 , H05K3/386 , H05K3/389 , H05K2201/0355 , H05K2201/0358 , H05K2203/072 , H05K2203/0723 , Y10T428/265 , Y10T428/27
摘要： Object of the invention is to provide a surface-treated copper foil comprising a rust-proofing treatment layer without chromium on an electro-deposited copper foil in which the peel strength of the circuits in processing of the printed wiring board and the chemical resistance against to the peel loss and the like are excellent. To achieve the object, the surface-treated copper foil characterized in comprising a rust-proofing treatment layer and a silane coupling agent layer on a bonding surface of an electro-deposited copper foil to an insulating resin substrate wherein the rust-proofing treatment layer is prepared by forming a nickel alloy layer having a thickness by weight of 5 mg/m2 to 50 mg/m2 and a tin layer having a thickness by weight of 5 mg/m2 to 40 mg/m2 in this order, and the silane coupling agent layer is provided on the rust-proofing treatment layer is employed. Further, a surface-treated copper foil with a very thin primer resin layer characterized by that a very thin primer resin layer having an equivalent thickness of 1 μm to 5 μm is provided on a bonding surface to the insulating resin substrate of the surface-treated copper foil without roughening treatment according to the present invention is employed.
摘要翻译：本发明的目的是提供一种表面处理铜箔，其在电沉积铜箔上包含无铬的防锈处理层，其中印刷线路板的加工中的电路的剥离强度和耐化学腐蚀性剥离损失等优异。为了实现该目的，表面处理铜箔的特征在于在电解铜箔与绝缘树脂基板的接合面上具有防锈处理层和硅烷偶联剂层，其中防锈处理层为通过以5mg / m 2至50mg / m 2的厚度形成厚度为5mg / m 2至40mg / m 2的锡层，并制备硅烷偶联剂采用防锈处理层设置有层。此外，具有非常薄的底漆树脂层的表面处理铜箔的特征在于，在与表面处理的绝缘树脂基板的接合面上设置相当厚度为1μm〜5μm的非常薄的底漆树脂层采用根据本发明的不进行粗糙化处理的铜箔。

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