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1. 发明授权

US10046418B2 Electrically conductive paste, and electrically conducive connection member produced using the paste 有权
公开(公告)号：US10046418B2
公开(公告)日：2018-08-14
申请号：US13634057
申请日：2011-03-18
申请人： Shunji Masumori , Toshiaki Asada , Hidemichi Fujiwara
发明人： Shunji Masumori , Toshiaki Asada , Hidemichi Fujiwara
IPC分类号： H01B1/02 , H01L23/485 , B23K35/02 , H01L21/48 , H05K3/34 , H01B1/22 , H01L23/00
摘要： Providing the conductive paste for the material forming the conductive connecting member without disproportionately located holes (gaps), coarse voids, and cracks, which improves thermal cycle and is excellent in crack resistance and bonding strength. An conductive paste including metal fine particles (P) comprising metal fine particles (P1) of one or more than two kinds selected from metal and alloy thereof, having mean primary particle diameter from 1 to 150 nm, and metal fine particles (P2) of same metal as the metal fine particles (P1), having mean primary particle diameter from 1 to 10 μm, mixing ratio of (P1/P2) being from 80 to 95 mass % for P1 and from 20 to 5 mass % for P2 (a total of mass % being 100 mass %); and organic dispersion medium (D) comprising organic solvent (S), or organic solvent (S) and organic binder (B), mixing ratio (P/D) of the metal fine particles (P) and the organic dispersion medium (D) being from 50 to 85 mass % for P and from 50 to 15 mass % for D (a total of mass % being 100 mass %).

2. 发明授权

US09221130B2 Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding method 有权
标题翻译：用于热粘合的材料，用于热粘合的涂层材料，涂层和电子部件粘合方法
公开(公告)号：US09221130B2
公开(公告)日：2015-12-29
申请号：US13993457
申请日：2011-12-15
申请人： Toshiaki Asada , Hidemichi Fujiwara
发明人： Toshiaki Asada , Hidemichi Fujiwara
IPC分类号： B32B5/16 , B23K35/12 , B23K35/24 , B23K35/02 , B23K35/36 , H01B1/22 , H01L23/00 , H05K3/32 , B22F1/00 , B22F7/08 , B23K1/20 , C09J5/06 , C09J9/02 , C09J11/04 , B23K20/02 , B23K20/233 , B82Y30/00 , C08K3/08 , C08K7/00 , C08K5/053
CPC分类号： B23K35/24 , B22F1/0022 , B22F1/0074 , B22F7/08 , B23K1/20 , B23K20/023 , B23K20/233 , B23K20/2333 , B23K35/0222 , B23K35/025 , B23K35/3612 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/18 , B23K2103/52 , B23K2103/56 , B82Y30/00 , C08K3/08 , C08K5/053 , C08K7/00 , C09J5/06 , C09J9/02 , C09J11/04 , C09J2203/326 , C09J2400/123 , C09J2400/163 , H01B1/22 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/8384 , H01L2924/01006 , H01L2924/01029 , H01L2924/10253 , H01L2924/12044 , H05K3/321 , H05K2203/1131 , Y10T428/25 , H01L2924/00
摘要： A material is for thermal bonding by metal fine particle sintering mediated by a metal sintered film, such that shorts do not occur readily between bonded sections, and bonding strength is higher than that achieved by plating or sputtering. The material is obtained by dispersing metal fine particles in an organic compound dispersion medium that melts or softens through heating at a temperature higher than 30° C., and is interposed between metal members, semiconductor members or ceramic members. The material includes 60 wt % or more of the organic compound dispersion medium containing one or more types of a polyol having a melting point or softening point of 30° C. or higher and having two or more hydroxyl groups in the molecule, and 80 wt % or more of the metal fine particles that have an average particle size of primary particles ranging from 5 to 200 nm.
摘要翻译：材料是通过金属烧结薄膜介导的金属细粒烧结进行热粘合，使得接合部之间不容易发生短路，并且接合强度高于通过电镀或溅射实现的接合强度。该材料通过将金属微粒分散在通过在高于30℃的温度下加热熔化或软化的有机化合物分散介质中而分散，并且介于金属构件，半导体构件或陶瓷构件之间。该材料包含60重量％以上的含有一种或多种具有30℃以上的熔点或软化点，分子中具有2个以上羟基的多元醇的有机化合物分散介质，80重量％具有一次粒子的平均粒径为5〜200nm的金属微粒的％以上。

3. 发明申请

US20130266796A1 MATERIAL FOR THERMAL BONDING, COATING MATERIAL FOR THERMAL BONDING, COATING, AND ELECTRONIC COMPONENT BONDING METHOD 有权
标题翻译：热粘合材料，热粘合涂料，电子组件接合方法
公开(公告)号：US20130266796A1
公开(公告)日：2013-10-10
申请号：US13993457
申请日：2011-12-15
申请人： Toshiaki Asada , Hidemichi Fujiwara
发明人： Toshiaki Asada , Hidemichi Fujiwara
IPC分类号： B23K35/24 , B23K1/20 , H01B1/22 , B23K35/02
CPC分类号： B23K35/24 , B22F1/0022 , B22F1/0074 , B22F7/08 , B23K1/20 , B23K20/023 , B23K20/233 , B23K20/2333 , B23K35/0222 , B23K35/025 , B23K35/3612 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/18 , B23K2103/52 , B23K2103/56 , B82Y30/00 , C08K3/08 , C08K5/053 , C08K7/00 , C09J5/06 , C09J9/02 , C09J11/04 , C09J2203/326 , C09J2400/123 , C09J2400/163 , H01B1/22 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/8384 , H01L2924/01006 , H01L2924/01029 , H01L2924/10253 , H01L2924/12044 , H05K3/321 , H05K2203/1131 , Y10T428/25 , H01L2924/00
摘要： A material is for thermal bonding by metal fine particle sintering mediated by a metal sintered film, such that shorts do not occur readily between bonded sections, and bonding strength is higher than that achieved by plating or sputtering. The material is obtained by dispersing metal fine particles in an organic compound dispersion medium that melts or softens through heating at a temperature higher than 30° C., and is interposed between metal members, semiconductor members or ceramic members. The material includes 60 wt % or more of the organic compound dispersion medium containing one or more types of a polyol having a melting point or softening point of 30° C. or higher and having two or more hydroxyl groups in the molecule, and 80 wt % or more of the metal fine particles that have an average particle size of primary particles ranging from 5 to 200 nm.
摘要翻译：材料是通过金属烧结薄膜介导的金属细粒烧结进行热粘合，使得接合部之间不容易发生短路，并且接合强度高于通过电镀或溅射实现的接合强度。该材料通过将金属微粒分散在通过在高于30℃的温度下加热熔化或软化的有机化合物分散介质中而分散，并且介于金属构件，半导体构件或陶瓷构件之间。该材料包含60重量％以上的含有一种或多种具有30℃以上的熔点或软化点，分子中具有2个以上羟基的多元醇的有机化合物分散介质，80重量％具有一次粒子的平均粒径为5〜200nm的金属微粒的％以上。

4. 发明申请

US20130001774A1 ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICALLY CONDUCTIVE CONNECTION MEMBER PRODUCED USING THE PASTE 审中-公开
标题翻译：电导电胶，电导电连接部件
公开(公告)号：US20130001774A1
公开(公告)日：2013-01-03
申请号：US13634057
申请日：2011-03-18
申请人： Shunji Masumori , Toshiaki Asada , Hidemichi Fujiwara
发明人： Shunji Masumori , Toshiaki Asada , Hidemichi Fujiwara
IPC分类号： H01B1/02 , H01L23/485 , B82Y30/00
CPC分类号： B23K35/0244 , H01B1/22 , H01L21/4853 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L2224/0345 , H01L2224/0401 , H01L2224/04026 , H01L2224/05644 , H01L2224/1132 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16505 , H01L2224/2732 , H01L2224/29101 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/32505 , H01L2224/45144 , H01L2224/48227 , H01L2224/48644 , H01L2224/81121 , H01L2224/81191 , H01L2224/81192 , H01L2224/81203 , H01L2224/8184 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8384 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/35121 , H05K3/3484 , H01L2924/00014 , H01L2924/00 , H01L2924/3512
摘要： Providing the conductive paste for the material forming the conductive connecting member without disproportionately located holes (gaps), coarse voids, and cracks, which improves thermal cycle and is excellent in crack resistance and bonding strength. An conductive paste including metal fine particles (P) comprising metal fine particles (P1) of one or more than two kinds selected from metal and alloy thereof, having mean primary particle diameter from 1 to 150 nm, and metal fine particles (P2) of same metal as the metal fine particles (P1), having mean primary particle diameter from 1 to 10 μm, mixing ratio of (P1/P2) being from 80 to 95 mass % for P1 and from 20 to 5 mass % for P2 (a total of mass % being 100 mass %); and organic dispersion medium (D) comprising organic solvent (S), or organic solvent (S) and organic binder (B), mixing ratio (P/D) of the metal fine particles (P) and the organic dispersion medium (D) being from 50 to 85 mass % for P and from 50 to 15 mass % for D (a total of mass % being 100 mass %).
摘要翻译：为形成导电连接构件的材料提供导电膏，而不会发生不成比例的孔（间隙），粗糙的空隙和裂纹，这改善了热循环，并且具有优异的抗裂性和接合强度。包含金属微粒（P）的金属微粒（P）的导电性糊料包含平均一次粒径为1〜150nm的选自金属及其合金中的一种或两种以上的金属微粒（P1）和金属微粒（P2）与P1的平均一次粒径为1〜10μm的金属微粒（P1）相同的金属，P1的（P1 / P2）的混合比例为80〜95质量％，P2的混合比例为20〜5质量％质量百分比为100质量％）; 和含有有机溶剂（S）或有机溶剂（S）和有机粘合剂（B）的有机分散介质（D），金属微粒（P）和有机分散介质（D）的混合比（P / D）对于P为50〜85质量％，D为50〜15质量％（质量％的总和为100质量％）。

5. 发明授权

US08475923B2 Heat transfer film, semiconductor device, and electronic apparatus 有权
公开(公告)号：US08475923B2
公开(公告)日：2013-07-02
申请号：US12232470
申请日：2008-09-17
申请人： Masako Katayama , Hidemichi Fujiwara
发明人： Masako Katayama , Hidemichi Fujiwara
IPC分类号： B32B9/00 , B32B9/04 , B32B13/04 , B32B27/32 , B32B19/00 , H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/373 , H01L21/268 , H01L21/84 , H01L23/3735 , H01L33/641 , H01L2924/0002 , Y10T428/30 , H01L2924/00
摘要： A heat transfer film includes a heat transfer layer formed of a first constituent material containing C (carbon) for transferring heat in an in-plane direction thereof and a layer thickness direction thereof; and a strain relaxation layer formed of a second constituent material and laminated on the heat transfer layer for relaxing a strain in the heat transfer layer. The first constituent material includes a graphite, and the second constituent material includes an amorphous material.

6. 发明授权

US08337726B2 Fine particle dispersion and method for producing fine particle dispersion 有权
标题翻译：细颗粒分散体和微粒分散体的制造方法
公开(公告)号：US08337726B2
公开(公告)日：2012-12-25
申请号：US12309738
申请日：2007-07-25
申请人： Takuya Harada , Hidemichi Fujiwara , Kazuhiro Takashiba , Nobumitsu Yamanaka , Yusuke Yamada , Hideo Nishikubo , Takashi Unno
发明人： Takuya Harada , Hidemichi Fujiwara , Kazuhiro Takashiba , Nobumitsu Yamanaka , Yusuke Yamada , Hideo Nishikubo , Takashi Unno
IPC分类号： H01B1/24 , H01B1/02
CPC分类号： C09D11/36 , B22F1/0022 , B22F2998/10 , B82Y30/00 , C01P2004/64 , C09C1/62 , C09C3/045 , C09C3/10 , C09D11/52 , H05K1/097 , B22F9/24 , B22F1/0062
摘要： In a fine particle dispersion, a fine particle (P) is dispersed in a mixed organic solvent. The fine particle (P) is formed of one type or not less than two types of a metal, an alloy, and/or a metallic compound, and has a mean particle diameter between 1 nm and 150 nm for primary particles thereof. Further, the fine particle (P) has a surface at least a part thereof coated with a polymer dispersing agent (D).
摘要翻译：在细颗粒分散体中，将微粒（P）分散在混合有机溶剂中。细颗粒（P）由一种或不少于两种类型的金属，合金和/或金属化合物形成，并且其一次颗粒的平均粒径为1nm至150nm。此外，微粒（P）的至少一部分表面涂布有高分子分散剂（D）。

7. 发明授权

US10177079B2 Conductive connecting member and manufacturing method of same 有权
公开(公告)号：US10177079B2
公开(公告)日：2019-01-08
申请号：US13634079
申请日：2011-03-18
申请人： Hideo Nishikubo , Shunji Masumori , Takuya Harada , Tomohiro Ishii , Hidemichi Fujiwara
发明人： Hideo Nishikubo , Shunji Masumori , Takuya Harada , Tomohiro Ishii , Hidemichi Fujiwara
IPC分类号： H01L21/60 , H05K13/04 , H01L23/492 , H01L21/48 , H01L23/00
摘要： A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.

8. 发明申请

US20100113647A1 FINE PARTICLE DISPERSION AND METHOD FOR PRODUCING FINE PARTICLE DISPERSION 有权
公开(公告)号：US20100113647A1
公开(公告)日：2010-05-06
申请号：US12309738
申请日：2007-07-25
申请人： Takuya Harada , Hidemichi Fujiwara , Kazuhiro Takashiba , Nobumitsu Yamanaka , Yusuke Yamada , Hideo Nishikubo , Takashi Unno
发明人： Takuya Harada , Hidemichi Fujiwara , Kazuhiro Takashiba , Nobumitsu Yamanaka , Yusuke Yamada , Hideo Nishikubo , Takashi Unno
IPC分类号： C08K9/04
CPC分类号： C09D11/36 , B22F1/0022 , B22F2998/10 , B82Y30/00 , C01P2004/64 , C09C1/62 , C09C3/045 , C09C3/10 , C09D11/52 , H05K1/097 , B22F9/24 , B22F1/0062
摘要： Disclosed is a fine particle dispersion which is superior in dispersibility and storage stability. Specifically disclosed is a fine particle dispersion in which a fine particle (P) comprised of one type or not less than two types of a metal, an alloy, and/or a metallic compound, having a mean particle diameter of between 1 nm and 150 nm for primary particles thereof, with being coated at least a part of a surface thereof with a polymer dispersing agent (D), is dispersed in a mixed organic solvent. This fine particle dispersion is characterized in that a weight ratio of (D/P) between the polymer dispersing agent (D) coating the surface of the fine particle (P) and the fine particles (P) in the dispersion is between 0.001 and 10, and the mixed organic solvent is one of: (i) a mixed organic solvent which contains an organic solvent (A) as between 50% and 95% by volume having an amide group, and a low boiling point organic solvent (B) as between 5% and 50% by volume having a boiling point of between 20° C. and 100° C. at a normal pressure; (ii) a mixed organic solvent which contains the organic solvent (A) as between 50% and 95% by volume having the amide group, and an organic solvent (C) as between 5% and 50% by volume having a boiling point of higher than 100° C. at a normal pressure and comprised of an alcohol and/or a polyhydric alcohol having one or not less than two hydroxyl groups in a molecule thereof; or (iii) a mixed organic solvent which contains the organic solvent (A) as between 50% and 94% by volume having the amide group, the low boiling point organic solvent (B) as between 5% and 49% by volume having the boiling point of between 20° C. and 100° C. at the normal pressure, and the organic solvent (C) as between 1% and 45% by volume having the boiling point of higher than 100° C. at the normal pressure and comprised of the alcohol and/or the polyhydric alcohol having the one or not less than the two hydroxyl groups in the molecule thereof.

9. 发明申请

US20090321689A1 METHOD FOR PRODUCING FINE PARTICLE DISPERSION AND FINE PARTICLE DISPERSION 有权
公开(公告)号：US20090321689A1
公开(公告)日：2009-12-31
申请号：US12309739
申请日：2007-07-25
申请人： Takuya Harada , Hidemichi Fujiwara , Kazuhiro Takashiba , Nobumitsu Yamanaka , Yusuke Yamada , Hideo Nishikubo , Takashi Unno
发明人： Takuya Harada , Hidemichi Fujiwara , Kazuhiro Takashiba , Nobumitsu Yamanaka , Yusuke Yamada , Hideo Nishikubo , Takashi Unno
IPC分类号： H01B1/22 , C25B1/00 , C09D11/02 , C09D11/10 , C08L39/06 , C08F8/30 , C09D5/02 , C09D103/00 , C09D101/00 , C09D189/00
CPC分类号： B22F1/0022 , B01F17/0007 , B22F9/24 , B22F2999/00 , B82Y30/00 , C01P2004/64 , C09C1/62 , C09C3/045 , C09C3/10 , C09D11/36 , C09D11/52 , H05K1/097 , Y10T428/252 , B22F2202/11
摘要： Disclosed is a method for producing a fine particle dispersion such as a dispersion of metal fine particles which is superior in dispersibility and storage stability. Specifically disclosed is a method for producing a fine particle dispersion wherein fine particles of a metal or the like, having a mean particle diameter of between 1 nm and 150 nm for primary particles, are dispersed in an organic solvent. This method for producing a fine particle dispersion is characterized by comprising the steps of: reducing a metal ion by liquid phase reduction in an aqueous solution wherein the metal ion and a polymer dispersing agent are dissolved, thereby forming a fine particle dispersion aqueous solution wherein fine particles having a mean particle diameter of between 1 nm and 150 nm for the primary particles and dispersed with being coated by the polymer dispersing agent (Process 1); adding an aggregation accelerator into the fine particle dispersion aqueous solution, the resulting solution is agitated for agglomerating or precipitating the fine particles, and then the agglomerated or precipitated fine particles are separated from the aqueous solution, thereby obtaining fine particles comprised of one type or not less than two types of a metal, an alloy and a metallic compound (Process 2); and re-dispersing the thus-obtained fine particles into an organic solvent or the like which contains an organic solvent (A) as between 25% and 70% by volume having an amide group, a low boiling point organic solvent (B) as between 5% and 25% by volume having a boiling point of between 20° C. and 100° C. at a normal pressure, and an organic solvent (C) as between 5% and 70% by volume having a boiling point of higher than 100° C. at a normal pressure and comprised of an alcohol and/or a polyhydric alcohol having one or not less than two hydroxyl groups in a molecule thereof (Process 3).

10. 发明授权

US06573454B2 Electric distribution assembly 有权
标题翻译：配电组件
公开(公告)号：US06573454B2
公开(公告)日：2003-06-03
申请号：US09993458
申请日：2001-11-13
申请人： Hidemichi Fujiwara
发明人： Hidemichi Fujiwara
IPC分类号： G02B532
CPC分类号： H01R4/183 , H01R4/188 , H01R4/62 , H01R43/0207 , H01R43/048
摘要： An electric distributor assembly for movable vehicle is provided which has a distribution cable which is easier to handle, having both a metal terminal excellent in workability and an Al alloy twisted wire conductor connected to the terminal so as to show superior connection characteristics. The twisted-wire conductor may be made of an Al or Al alloy which has conductivity of 50% IACS or more. The metal terminal is made of, preferably, an Al or Al alloy of which elongation is 20% or more. The terminal is connected with the cable conductor, preferably, with ultrasonic vibrations.
摘要翻译：提供了一种用于移动车辆的电动分配器组件，其具有更容易处理的配线，具有优异的可加工性的金属端子和连接到该端子的Al合金绞线导体，以显示出优异的连接特性。绞线导体可以由导电率为50％IACS以上的Al或Al合金制成。金属端子优选由延伸率为20％以上的Al或Al合金制成。端子与电缆导体连接，优选地与超声波振动连接。

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