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1. 发明申请

US20140106961A1 PHOTOCATALYTIC COATING FILM AND METHOD FOR PRODUCING SAME 有权
标题翻译：光电涂层膜及其制造方法
公开(公告)号：US20140106961A1
公开(公告)日：2014-04-17
申请号：US14124292
申请日：2012-06-06
申请人： Toru Nakai , Yoshinori Funaki , Toshikazu Nakamura
发明人： Toru Nakai , Yoshinori Funaki , Toshikazu Nakamura
IPC分类号： B01J31/38 , B01J23/745
CPC分类号： B01J31/38 , B01J21/063 , B01J23/745 , B01J35/004 , B01J35/06 , B01J37/0215 , B01J37/0219 , G02B1/18 , G02B27/0006
摘要： Provided is a photocatalytic coating film that can develop excellent photocatalytic activity and exhibit superior adhesion to an adherend surface.The photocatalytic coating film is obtained by applying and drying a photocatalytic coating composition containing at least rod-like or needle-like titanium oxide particles and a binder component so that the photocatalytic coating film contains the titanium oxide particles in a content of 0.5 g/m2 or more. The photocatalytic coating film contains the titanium oxide particle in a content per unit volume (1 m2 by 1 μm thick) of less than 3.0 g. The titanium oxide particles preferably have an aspect ratio of 1.5 or more, the aspect ratio specified as the ratio of a long side length to a short side length of particle. The compositional ratio (by weight) of the titanium oxide particles to the binder component in the photocatalytic coating film is preferably from 1:6 to 30:1.
摘要翻译：提供了可以显现出优异的光催化活性并且表现出对被粘物表面的优异粘附性的光催化涂膜。通过涂布和干燥含有至少棒状或针状二氧化钛颗粒和粘合剂成分的光催化涂料组合物，使得光催化涂膜含有0.5g / m 2的氧化钛颗粒，得到光催化涂膜或者更多。光催化涂膜含有小于3.0g的每单位体积（1m 2×1μm）的氧化钛粒子。优选氧化钛粒子的纵横比为1.5以上，纵横比规定为长边长与粒子的短边长的比例。光催化性涂膜中的氧化钛粒子与粘合剂成分的组成比（重量比）优选为1:6〜30:1。

2. 发明授权

US09517459B2 Photocatalytic coating film and method for producing same 有权
标题翻译：光催化涂膜及其制备方法
公开(公告)号：US09517459B2
公开(公告)日：2016-12-13
申请号：US14124292
申请日：2012-06-06
申请人： Toru Nakai , Yoshinori Funaki , Toshikazu Nakamura
发明人： Toru Nakai , Yoshinori Funaki , Toshikazu Nakamura
IPC分类号： B01J31/38 , B01J37/02 , B01J35/00 , G02B27/00 , B01J23/745 , B01J21/06 , B01J35/06
CPC分类号： B01J31/38 , B01J21/063 , B01J23/745 , B01J35/004 , B01J35/06 , B01J37/0215 , B01J37/0219 , G02B1/18 , G02B27/0006
摘要： Provided is a photocatalytic coating film that can develop excellent photocatalytic activity and exhibit superior adhesion to an adherend surface.The photocatalytic coating film is obtained by applying and drying a photocatalytic coating composition containing at least rod-like or needle-like titanium oxide particles and a binder component so that the photocatalytic coating film contains the titanium oxide particles in a content of 0.5 g/m2 or more. The photocatalytic coating film contains the titanium oxide particle in a content per unit volume (1 m2 by 1 μm thick) of less than 3.0 g. The titanium oxide particles preferably have an aspect ratio of 1.5 or more, the aspect ratio specified as the ratio of a long side length to a short side length of particle. The compositional ratio (by weight) of the titanium oxide particles to the binder component in the photocatalytic coating film is preferably from 1:6 to 30:1.
摘要翻译：通过涂布和干燥含有至少棒状或针状二氧化钛颗粒和粘合剂成分的光催化涂料组合物，使得光催化涂膜含有0.5g / m 2的氧化钛颗粒，得到光催化涂膜或者更多。光催化涂膜含有小于3.0g的每单位体积（1m 2×1μm）的氧化钛粒子。优选氧化钛粒子的纵横比为1.5以上，纵横比规定为长边长与粒子的短边长的比例。光催化性涂膜中的氧化钛粒子与粘合剂成分的组成比（重量比）优选为1:6〜30:1。

3. 发明授权

US08499446B2 Method of manufacturing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08499446B2
公开(公告)日：2013-08-06
申请号：US13187060
申请日：2011-07-20
申请人： Toru Nakai , Sho Akai
发明人： Toru Nakai , Sho Akai
IPC分类号： H05K3/02 , C25D5/02
CPC分类号： H05K3/4644 , H05K3/108 , H05K3/4602 , H05K3/4661 , H05K2201/0341 , H05K2201/0347 , H05K2201/0959 , H05K2203/073 , Y10T29/4913 , Y10T29/49156 , Y10T29/49162 , Y10T29/49165
摘要： A method of manufacturing a multilayer printed wiring board includes forming a first interlaminar resin insulating layer, a first conductor circuit on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer, opening portions in the second interlaminar resin insulating layer to expose a face of the first conductor circuit, an electroless plating film on the second interlaminar resin insulating layer and the exposed face, and a plating resist on the electroless plating film. The method further includes substituting the electroless plating film with a thin film conductor layer, having a lower ion tendency than the electroless plating film, and a metal of the exposed face, forming an electroplating film including the metal on a portion of the electroless plating film and the thin film conductor layer, stripping the plating resist, and removing the electroless plating film exposed by the stripping.
摘要翻译：一种制造多层印刷线路板的方法包括在第一层间树脂绝缘层上形成第一层间树脂绝缘层，第一导体电路，第二层间树脂绝缘层，第二层间树脂绝缘层中的开口部分，露出面第一导体电路的第二层间树脂绝缘层上的无电镀膜和暴露面，以及化学镀膜上的电镀抗蚀剂。该方法还包括用具有比无电镀膜低的离子倾向的薄膜导体层和暴露面的金属代替化学镀膜，在化学镀膜的一部分上形成包括金属的电镀膜和薄膜导体层，剥离电镀抗蚀剂，以及除去通过剥离暴露的化学镀膜。

4. 发明授权

US08043994B2 Thermal transfer receiving sheet and its manufacturing method 有权
标题翻译：热转印接收片及其制造方法
公开(公告)号：US08043994B2
公开(公告)日：2011-10-25
申请号：US12801994
申请日：2010-07-07
申请人： Toshikazu Onishi , Toru Nakai , Kazuyuki Tachibana , Kyoko Uchida , Yoshimasa Tanaka , Yoshihiro Shimizu , Hideaki Shinohara , Masato Kawamura , Chikara Tsukada
发明人： Toshikazu Onishi , Toru Nakai , Kazuyuki Tachibana , Kyoko Uchida , Yoshimasa Tanaka , Yoshihiro Shimizu , Hideaki Shinohara , Masato Kawamura , Chikara Tsukada
IPC分类号： B41M5/035 , B41M5/50
CPC分类号： B41M5/44 , B41M2205/02 , B41M2205/06 , B41M2205/12 , B41M2205/32 , B41M2205/36 , B41M2205/38 , Y10T428/249953
摘要： The present invention provides a thermal transfer receiving sheet obtained by sequentially forming a hollow particle-containing intermediate layer and an image receiving layer on one surface of a sheet-like support mainly comprising cellulose pulp, wherein the moisture content of the entire thermal transfer receiving sheet is from 2 to 8 mass % and the moisture permeability of the entire receiving sheet is 400 g/m2·day or less; and a production method thereof. The present invention further provides a thermal transfer receiving sheet obtained by sequentially forming a hollow particle-containing intermediate layer and an image receiving layer on one surface of a sheet-like support mainly comprising cellulose pulp and providing a backside layer on another surface of the support, wherein the backside layer mainly comprises an acryl-based resin having a glass transition point (Tg) of 45° C. or less and contains a resin filler having an average particle diameter of 5 to 22 μm and the Bekk smoothness according to JIS P 8119 on the backside layer surface is 100 seconds or less.
摘要翻译：本发明提供一种热转印接收片材，其通过在主要包含纤维素纸浆的片状载体的一个表面上依次形成含中空颗粒的中间层和图像接收层而获得，其中整个热转印接收片材的水分含量为2〜8质量％，整个接收片的透湿度为400g / m 2·天以下; 及其制造方法。本发明还提供一种热转印接收片，其通过在主要包含纤维素纸浆的片状载体的一个表面上依次形成含中空颗粒的中间层和图像接收层而获得，并且在载体的另一个表面上提供背面层其特征在于，所述背面层主要包含玻璃化转变点（Tg）为45℃以下的丙烯酸类树脂，并且含有平均粒径为5〜22μm的树脂填料和根据JIS P的Bekk平滑度背面层表面的8119为100秒以下。

5. 发明授权

US08013256B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US08013256B2
公开(公告)日：2011-09-06
申请号：US12261517
申请日：2008-10-30
申请人： Toru Nakai
发明人： Toru Nakai
IPC分类号： H05K1/09
CPC分类号： H05K1/115 , C23C18/54 , H01L21/486 , H01L23/498 , H01L23/49816 , H01L23/49822 , H01L23/538 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/16237 , H01L2224/45144 , H01L2224/81026 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01061 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H05K1/112 , H05K3/244 , H05K3/28 , H05K3/3463 , H05K3/383 , H05K3/4602 , H05K3/4644 , Y10T29/49147 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propagation rate can be increased, as compared with a printed wiring board of the prior art on which two metal layers are formed. In addition, due to lack of nickel layers, manufacturing cost can be decreased and electric characteristics can be enhanced.
摘要翻译：提供了包括频率特性优异的焊盘的印刷线路板。为此，通过在导体电路158或通孔160上设置单个锡层74来形成每个焊盘73.因此，与现有技术的印刷电路板相比，可以增加信号传播速率形成两个金属层。此外，由于缺乏镍层，可以降低制造成本，并且可以提高电特性。

6. 发明申请

US20080063817A1 Thermal Transfer Receiving Sheet, Production Method Thereof and Image Forming Method Using the Sheet 有权
标题翻译：热转印接收纸，其生产方法和图像成型方法
公开(公告)号：US20080063817A1
公开(公告)日：2008-03-13
申请号：US10566202
申请日：2004-08-04
申请人： Yoshimasa Tanaka , Masato Kawamura , Chikara Tsukada , Kyoko Uchida , Toshikazu Onishi , Toru Nakai , Kazuyuki Tachibana , Hideaki Shinohara
发明人： Yoshimasa Tanaka , Masato Kawamura , Chikara Tsukada , Kyoko Uchida , Toshikazu Onishi , Toru Nakai , Kazuyuki Tachibana , Hideaki Shinohara
IPC分类号： B41M5/40 , B05D1/36
CPC分类号： B41M5/42 , B41M5/44 , B41M2205/32 , B41M2205/36 , B41M2205/38
摘要： A thermal transfer receiving sheet comprising a sheet-like support having sequentially formed on at least one surface thereof a hollow particle-containing intermediate layer and an image receiving layer, wherein the hollow particles have an average particle diameter of 0.2 to 35 μm and a hollow percentage by volume of 30 to 97% and the printing smoothness (Rp value) on the surface of the thermal transfer receiving sheet, as measured by using a Microtopograph under an applied pressure of 0.1 MPa 10 m-seconds after the initiation of pressure application, is 1.5 μm or less. A production method of the thermal transfer receiving sheet is also provided.
摘要翻译：一种热转印接收片材，其包含在至少一个表面上依次形成有中空颗粒的中间层和图像接收层的片状载体，其中所述中空颗粒的平均粒径为0.2〜35μm，在热压接受片的表面上的印刷平滑度（Rp值）在压力施加开始后的0.1MPa的施加压力下使用微图形仪测量，为1.5mum以下。还提供了热转印接收片材的制造方法。

7. 发明授权

US08828598B2 Sealed-type cell 有权
标题翻译：密封式电池
公开(公告)号：US08828598B2
公开(公告)日：2014-09-09
申请号：US14115776
申请日：2011-07-27
申请人： Toru Nakai
发明人： Toru Nakai
IPC分类号： H01M2/02
CPC分类号： H01M2/345 , H01M2/1229 , H01M2/305 , H01M10/0525 , H01M2200/20 , H01M2220/20 , Y02E60/122
摘要： A cell has: a pole terminal placed on outside of a cell case; a deformed terminal fixing the pole terminal to the case by a base surface portion and a protruding portion; an inversion plate attached to the base surface portion and interrupting conduction between the internal terminal and the deformed terminal by inversion deforming away from the internal terminal at least at a portion when the internal pressure of the case increases beyond working pressure; and a shaft member having at least a part of the top portion placed in the protruding portion, and reestablishing conduction between the internal terminal and the deformed terminal after the inversion plate inverted by the top portion being pressed from the outside and thereby being moved inside the protruding section to press the inversion plate inward. A sealed space is provided between the deformed terminal and the inversion plate.
摘要翻译：电池具有：极端子放置在电池壳体的外部; 变形端子，通过基面部分和突出部分将极端子固定到壳体; 安装在所述基面部上的反转板，并且当所述壳体的内压增加超过工作压力时，至少在所述壳体的内部压力的一部分处，通过反转而从所述内部端子变形而中断所述内部端子与所述变形端子之间的导通; 以及轴构件，其具有顶部的至少一部分放置在突出部分中，并且在由顶部反转的反转板从外部按压之后重新建立内部端子与变形端子之间的导通，从而在内部端子和变形端子之间移动突出部分将反转板向内压。在变形端子和反转板之间设有密封空间。

8. 发明申请

US20120251850A1 ELECTRIC STORAGE APPARATUS 有权
标题翻译：电动储存装置
公开(公告)号：US20120251850A1
公开(公告)日：2012-10-04
申请号：US13424474
申请日：2012-03-20
申请人： Nobuo YAMAMOTO , Mizuho Matsumoto , Toru Nakai
发明人： Nobuo YAMAMOTO , Mizuho Matsumoto , Toru Nakai
IPC分类号： H01M2/12
CPC分类号： H01M2/362 , H01G11/18 , H01G11/78 , H01M2/043 , H01M2/1241 , H01M2/365 , H01M2220/20 , Y02E60/13
摘要： An electric storage apparatus has an electric-generating element performing charge and discharge and a case accommodating the electric-generating element and an electrolytic solution. The case has an injection portion, a cap, a worked portion, and a valve. The injection portion is used for injecting the electrolytic solution into the case. The cap closes the injection portion. The worked portion is formed along the outer shapes of the injection portion and the cap by working the wall face of the case. The valve is used for discharging gas produced within the case to the outside of the case and is provided between the injection portion and the worked portion.
摘要翻译：蓄电装置具有执行充放电的发电元件和容纳发电元件和电解液的壳体。壳体具有注射部分，帽，加工部分和阀。注射部分用于将电解溶液注入到壳体中。盖封闭注射部分。加工部通过对壳体的壁面进行加工而沿着注射部和盖的外形形成。阀用于将壳体内产生的气体排放到壳体的外部，并且设置在注射部分和加工部分之间。

9. 发明申请

US20120005888A1 PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD 有权
标题翻译：电镀设备，镀层方法和多层印刷电路板
公开(公告)号：US20120005888A1
公开(公告)日：2012-01-12
申请号：US13240626
申请日：2011-09-22
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： H05K3/00
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.
摘要翻译：一种多层印刷电路板的制造方法，其特征在于，具有提供具有贯通孔的芯基板，在所述基板的表面上形成无电镀膜和所述贯通孔的内壁面，对所述基板进行电解电镀，同时相对于在所述基板的表面上与所述基板的表面接触的绝缘构件，使得在所述无电镀膜上形成电解电镀膜，所述贯通孔内的开口空间填充有电解材料，在导电孔中形成空穴导体结构，在电解镀膜上形成具有开口图案的抗蚀剂，并且除去由开口图案露出的电解电镀膜的露出图案，以及将化学镀膜的图案使得在基板的表面上形成导体电路。

10. 发明授权

US07804031B2 Printed wiring board and manufacturing method thereof 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US07804031B2
公开(公告)日：2010-09-28
申请号：US11763861
申请日：2007-06-15
申请人： Toru Nakai , Masanori Tamaki
发明人： Toru Nakai , Masanori Tamaki
IPC分类号： H05K1/03
CPC分类号： H05K1/0242 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/15311 , H05K1/0216 , H05K1/0245 , H05K3/28 , H05K3/4602 , H05K3/4644 , H05K2201/09236 , H05K2201/098
摘要： A printed wiring board having an interlayer insulation layer and conductive circuits formed on the interlayer insulation layer. The conductive circuits include a first conductive circuit and a second conductive circuit positioned adjacent to each other, and the first and second conductive circuits satisfy a formula, 0.10 T≦|W1−W2|≦0.73 T, where W1 represents an upper conductive circuit space between the first and second conductive circuits, W2 represents a lower conductive circuit space between the first and second conductive circuits, and T represents a thickness of the first and second conductive circuits.
摘要翻译：一种具有层间绝缘层和形成在层间绝缘层上的导电电路的印刷电路板。导电电路包括彼此相邻定位的第一导电电路和第二导电电路，第一和第二导电电路满足公式0.10 T＆nlE; | W1-W2 |＆nlE; 0.73T，其中W1表示上导电电路第一和第二导电电路之间的间隔W2表示第一和第二导电电路之间的较低的导电电路空间，T表示第一和第二导电电路的厚度。

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