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1. 发明申请

US20050272351A1 Method and apparatus for cleaning mounting nozzle, and mounting machine 审中-公开
标题翻译：清洗安装喷嘴和安装机器的方法和装置
公开(公告)号：US20050272351A1
公开(公告)日：2005-12-08
申请号：US11138302
申请日：2005-05-27
申请人： Toru Mizuno , Tomomi Asakura , Toshinobu Miyakoshi , Yuji Saito , Tsugihiro Hasebe
发明人： Toru Mizuno , Tomomi Asakura , Toshinobu Miyakoshi , Yuji Saito , Tsugihiro Hasebe
IPC分类号： B08B1/00 , B24B19/16 , B24B49/00 , H01L21/00 , H01L21/52 , H01L21/60 , H01L21/683
CPC分类号： H01L21/67144 , B08B1/008 , B24B19/16 , H01L21/67028 , H01L21/6838 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/01082 , Y10T29/53178 , Y10T29/53191
摘要： A cleaning apparatus according to the invention is used for an electronic component mounting machine, includes a abrading unit for abrading the suction surface of the mounting nozzle; and a drive unit for moving the abrading unit in a predetermined direction, the abrading unit being formed by a ceramics structure, and a grain size of a contact surface of the abrading unit ranges from P1000 to P5000, the contact surface of the abrading unit coming into contact with the suction surface of the mounting nozzle.
摘要翻译：根据本发明的清洁装置用于电子部件安装机，包括用于研磨安装喷嘴的吸附表面的研磨单元; 以及用于沿预定方向移动研磨单元的驱动单元，所述研磨单元由陶瓷结构形成，并且所述研磨单元的接触表面的晶粒尺寸范围为P1000至P5000，所述研磨单元的接触表面接近与安装喷嘴的吸入表面接触。

2. 发明授权

US07814645B2 Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration 有权
标题翻译：安装设备使用超声波振动将接地装置安装在接收装置上
公开(公告)号：US07814645B2
公开(公告)日：2010-10-19
申请号：US12175770
申请日：2008-07-18
申请人： Toru Mizuno , Tomomi Asakura , Yuji Saito , Hiroyuki Takano , Toshinobu Miyagoshi
发明人： Toru Mizuno , Tomomi Asakura , Yuji Saito , Hiroyuki Takano , Toshinobu Miyagoshi
IPC分类号： B23P19/00
CPC分类号： B23K1/06 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75252 , H01L2224/75745 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/3025 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53252 , Y10T29/53265
摘要： A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.
摘要翻译：安装装置在SMD和SMD接收装置之间的结点处精确地施加超声波振动，并且在SMD和由保持单元保持的SMD接收装置的超声波接合中以简单的结构将结连接在合适的温度。这包括SMD保持单元，SMD接收装置保持单元，移动至少一个SMD保持单元和SMD接收装置保持单元彼此接触的移动单元，振动产生单元向SMD和 SMD接收装置，在SMD和SMD接收装置之间施加偏置力的按压单元，加热单元可移动地布置，以非接触方式围绕SMD保持单元的一部分靠近SMD并加热SMD保持单元，以及联锁单元将加热单元与SMD保持单元联锁。

3. 发明授权

US07828190B2 Ultrasonic mounting apparatus 有权
标题翻译：超声波安装装置
公开(公告)号：US07828190B2
公开(公告)日：2010-11-09
申请号：US12418926
申请日：2009-04-06
申请人： Yuji Saito , Tomomi Asakura , Mitsuyoshi Makida , Toru Mizuno , Toshinobu Miyagoshi
发明人： Yuji Saito , Tomomi Asakura , Mitsuyoshi Makida , Toru Mizuno , Toshinobu Miyagoshi
IPC分类号： B23K1/06 , B23K5/20 , B23K20/10
CPC分类号： H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2924/01006 , H01L2924/01033 , H01L2924/14 , H01L2924/00014
摘要： In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.
摘要翻译：在超声波安装装置中，独立于包括接合工具，超声波喇叭，换能器和喇叭支撑构件的部件，放置与音圈电动机耦合以将负载施加在待安装部件上的按压轴。部件可以与作为驱动力的施加轴的按压轴同轴地移动。接合工具和按压轴的接合位置与在接合工具中产生的驻波的节点一致。

4. 发明申请

US20090255979A1 ULTRASONIC MOUNTING APPARATUS 有权
标题翻译：超声波安装设备
公开(公告)号：US20090255979A1
公开(公告)日：2009-10-15
申请号：US12418926
申请日：2009-04-06
申请人： Yuji Saito , Tomomi Asakura , Mitsuyoshi Makida , Toru Mizuno , Toshinobu Miyagoshi
发明人： Yuji Saito , Tomomi Asakura , Mitsuyoshi Makida , Toru Mizuno , Toshinobu Miyagoshi
IPC分类号： B23K20/10
CPC分类号： H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2924/01006 , H01L2924/01033 , H01L2924/14 , H01L2924/00014
摘要： In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.
摘要翻译：在超声波安装装置中，独立于包括接合工具，超声波喇叭，换能器和喇叭支撑构件的部件，放置与音圈电动机耦合以将负载施加在待安装部件上的按压轴。部件可以与作为驱动力的施加轴的按压轴同轴地移动。接合工具和按压轴的接合位置与在接合工具中产生的驻波的节点一致。

5. 发明授权

US07181833B2 Method of mounting an electronic part 失效
标题翻译：安装电子部件的方法
公开(公告)号：US07181833B2
公开(公告)日：2007-02-27
申请号：US10978365
申请日：2004-11-02
申请人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
发明人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
IPC分类号： B23P19/00
CPC分类号： H05K13/0812 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53061 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.
摘要翻译：本发明提供了能够应对高密度安装，窄间距安装，腔体安装等的安装方法。在该方法中，可以获得相对于基准姿态从由捡取喷嘴保持的拾取喷嘴从晶片上取出的芯片的位移量，并且当芯片被输送到用于将芯片实际安装到基板上的安装喷嘴，考虑到位移量来校正位移量，使得安装喷嘴始终将芯片保持在固定的姿态。

6. 发明授权

US06931717B2 Apparatus for mounting an electronic part onto a circuit substrate 失效
标题翻译：用于将电子部件安装到电路基板上的装置
公开(公告)号：US06931717B2
公开(公告)日：2005-08-23
申请号：US10682731
申请日：2003-10-10
申请人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
发明人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
IPC分类号： B23P19/00 , H01L21/00 , H01L21/60 , H05K13/04
CPC分类号： H05K13/0812 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53061 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.
摘要翻译：一种能够应对高密度安装，窄间距安装，腔体安装等的安装装置。在该装置中，获得由相对于基准姿势由拾取喷嘴保持的拾取喷嘴从晶片上取出的芯片的位移量，并且当芯片被输送到用于将芯片实际安装到基板上的安装喷嘴，考虑到位移量来校正位移量，使得安装喷嘴始终将芯片保持在固定的姿态。

7. 发明申请

US20050076498A1 Apparatus and method for mounting electronic part 失效
标题翻译：用于安装电子部件的装置和方法
公开(公告)号：US20050076498A1
公开(公告)日：2005-04-14
申请号：US10978365
申请日：2004-11-02
申请人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
发明人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
IPC分类号： B23P19/00 , H01L21/00 , H01L21/60 , H05K13/04
CPC分类号： H05K13/0812 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53061 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.
摘要翻译：本发明提供了能够应对高密度安装，窄间距安装，腔体安装等的安装方法。在该方法中，可以获得相对于基准姿态从由捡取喷嘴保持的拾取喷嘴从晶片上取出的芯片的位移量，并且当芯片被输送到用于将芯片实际安装到基板上的安装喷嘴，考虑到位移量来校正位移量，使得安装喷嘴始终将芯片保持在固定的姿态。

8. 发明申请

US20050076497A1 Apparatus and method for mounting electronic part 失效
标题翻译：用于安装电子部件的装置和方法
公开(公告)号：US20050076497A1
公开(公告)日：2005-04-14
申请号：US10682731
申请日：2003-10-10
申请人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
发明人： Toru Mizuno , Tomomi Asakura , Masatoshi Ito , Masaaki Kaneko , Toshinobu Miyagoshi
IPC分类号： B23P19/00 , H01L21/00 , H01L21/60 , H05K13/04
CPC分类号： H05K13/0812 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53061 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.
摘要翻译：一种能够应对高密度安装，窄间距安装，腔体安装等的安装装置。在该装置中，获得由相对于基准姿势由拾取喷嘴保持的拾取喷嘴从晶片上取出的芯片的位移量，并且当芯片被输送到用于将芯片实际安装到基板上的安装喷嘴，考虑到位移量来校正位移量，使得安装喷嘴始终将芯片保持在固定的姿态。

9. 发明授权

US4184323A Method and apparatus for recovering energy possessed by exhaust gas from blast furnace by turbine 失效
标题翻译：通过涡轮机回收高炉废气所具有的能量的方法和装置
公开(公告)号：US4184323A
公开(公告)日：1980-01-22
申请号：US862588
申请日：1977-12-20
申请人： Setsuo Abe , Tomomi Asakura , Takeshi Shirato , Motomasa Miyake
发明人： Setsuo Abe , Tomomi Asakura , Takeshi Shirato , Motomasa Miyake
IPC分类号： C21B7/00 , F01K25/14 , F02C1/00 , F02C9/16 , F27D17/00 , F02C9/02
CPC分类号： F01K25/14 , C21B7/007
摘要： Method and apparatus for recovering heat energy and kinetic energy of a gas discharged from the top of a blast furnace effectively as electric energy or other energy by a turbine and a control mechanism. An exhaust gas is supplied to a septum valve and then into a turbine connected in parallel, and the capacity or design value of the turbine is set at a mean value of the total flow rate of the exhaust gas varying with the lapse of time during the normal steady operation of the blast furnace. When the total flow rate of the exhaust gas is lower than the mean value, all the exhaust gas is supplied to the turbine to recover the energy of the exhaust gas and the top pressure of the furnace is controlled by a governor valve regulating the speed of the turbine. On the other hand, when the total flow rate of the exhaust gas is higher than the mean value, a part of the exhaust gas corresponding to the mean value of the flow rate is supplied to the turbine to recover the energy of the exhaust gas, while the remaining part of the exhaust gas corresponding to the excess over the mean value is supplied to the septum valve and the top pressure of the blast furnace is controlled by the septum valve.
摘要翻译：从高炉顶部回收热能和动能的方法和装置，作为涡轮机和控制机构的电能或其他能量。排气被输送到隔膜阀然后进入并联连接的涡轮机中，并且涡轮机的容量或设计值被设定为废气的总流量的平均值随着时间的流逝而变化正常运行高炉。当废气的总流量低于平均值时，所有废气都被供给到涡轮机以回收废气的能量，并且炉子的顶部压力由调节阀控制，涡轮机。另一方面，当废气的总流量高于平均值时，将与流量的平均值相对应的一部分废气供给到涡轮机以回收排气的能量，而对应于超过平均值的过量的废气的剩余部分被供应到隔膜阀，并且高炉的顶部压力由隔膜阀控制。

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