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1. 发明授权

US06947651B2 Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof 失效
标题翻译：由纳米气隙层间电介质材料形成的光波导及其制造方法
公开(公告)号：US06947651B2
公开(公告)日：2005-09-20
申请号：US10142601
申请日：2002-05-10
申请人： Tony Mule′ , Paul Kohl , James D. Meindl , Agnes Padovani , Thomas K. Gaylord , Elias N. Glytsis , Sue Ann B. Allen
发明人： Tony Mule′ , Paul Kohl , James D. Meindl , Agnes Padovani , Thomas K. Gaylord , Elias N. Glytsis , Sue Ann B. Allen
IPC分类号： G02B6/12 , G02B6/124 , G02B6/13 , G02B6/138 , G02B6/02 , G02B6/20
CPC分类号： G02B6/13 , G02B6/124 , G02B6/138 , G02B2006/12104
摘要： Waveguides and methods of fabrication thereof are presented. A representative waveguide includes a waveguide core and a cladding layer, where the cladding layer surrounds the waveguide core. The waveguide core and cladding can be made of a host material having a plurality of nano-pores, wherein the nano-pores include a sacrificial material, and the sacrificial material can be selectively decomposed in both the core and cladding layers to form a plurality of nano air-gaps.
摘要翻译：提出了波导及其制造方法。代表性的波导包括波导芯和包覆层，其中包层围绕波导芯。波导芯和包层可以由具有多个纳米孔的主体材料制成，其中纳米孔包括牺牲材料，牺牲材料可以在芯层和包覆层中选择性地分解形成多个纳米气隙。

2. 发明授权

US06785458B2 Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package 失效
标题翻译：引导波光学互连嵌入在微电子晶圆级批量封装内
公开(公告)号：US06785458B2
公开(公告)日：2004-08-31
申请号：US10074420
申请日：2002-02-11
申请人： Tony Mule′ , Chirag Patel , James D. Meindl , Thomas K. Gaylord , Elias N. Glytsis , Kevin P. Martin , Stephen M. Schultz , Muhannad Bakir , Hollie Reed , Paul Kohl
发明人： Tony Mule′ , Chirag Patel , James D. Meindl , Thomas K. Gaylord , Elias N. Glytsis , Kevin P. Martin , Stephen M. Schultz , Muhannad Bakir , Hollie Reed , Paul Kohl
IPC分类号： G02B610
CPC分类号： G02B6/43 , G02B6/10 , G02B6/12002 , G02B6/1221 , G02B6/132 , G02B6/136 , G02B6/34 , G02B2006/12107
摘要： Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.
摘要翻译：公开了具有波导的晶片级电子封装以及制造具有波导的芯片级电子封装的方法。代表性的芯片级电子封装包括至少一个具有波导芯的波导。此外，另一代表性的芯片级电子封装包括在波导芯的一部分周围具有气隙包覆层的波导。用于制造芯片级电子封装的代表性方法包括：提供具有设置在基板上的钝化层的基板; 在所述钝化层的一部分上设置波导芯; 在所述钝化层和所述波导芯的至少一部分上设置第一牺牲层; 在所述钝化层和所述第一牺牲层上设置外涂层; 以及去除所述第一牺牲层以在所述外涂层聚合物层内和所述波导芯的一部分周围限定气隙包覆层。

3. 发明授权

US06807352B2 Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof 有权
标题翻译：具有嵌入式气隙包覆层的光波导及其制造方法
公开(公告)号：US06807352B2
公开(公告)日：2004-10-19
申请号：US10074067
申请日：2002-02-11
申请人： Tony Mule′ , James D. Meindl , Thomas K. Gaylord , Elias N. Glytsis , Paul Kohl
发明人： Tony Mule′ , James D. Meindl , Thomas K. Gaylord , Elias N. Glytsis , Paul Kohl
IPC分类号： G02B610
CPC分类号： G02B6/136 , G02B6/10 , G02B6/1221 , G02B6/132 , G02B6/34 , G02B6/43 , G02B2006/12107
摘要： Waveguides having air-gap cladding layers and methods of fabricating waveguides having air-gap cladding layers are disclosed. A representative waveguide includes a waveguide core having an air-gap cladding layer engaging a portion of the waveguide core. In addition, a representative method of fabricating a waveguide having an air-gap cladding layer includes: providing a substrate having a lower cladding layer disposed on the substrate; disposing a waveguide core on a portion of the lower cladding layer; disposing a sacrificial layer onto at least one portion of the lower cladding layer and the waveguide core; disposing an overcoat layer onto the lower cladding layer and the sacrificial layer; and removing the sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and engaging a portion of the waveguide core.
摘要翻译：公开了具有气隙包覆层的波导和制造具有气隙包覆层的波导的方法。代表性的波导包括具有接合波导芯的一部分的气隙包覆层的波导芯。另外，制造具有气隙包层的波导的代表性方法包括：提供具有设置在基板上的下包层的基板; 在所述下包层的一部分上设置波导芯; 在所述下包层和所述波导芯的至少一部分上设置牺牲层; 在下包层和牺牲层上设置外涂层; 以及去除所述牺牲层以在所述外涂层聚合物层内限定气隙包层并与所述波导芯的一部分接合。

4. 发明授权

US06954576B2 Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package 失效
标题翻译：引导波光学互连嵌入在微电子晶圆级批量封装内
公开(公告)号：US06954576B2
公开(公告)日：2005-10-11
申请号：US10895685
申请日：2004-07-21
申请人： Tony Mule′ , Chirag Patel , James D. Meindl , Thomas K. Gaylord , Elias N. Glytsis , Kevin P. Martin , Stephen M. Schultz , Muhannad Bakir , Hollie Reed , Paul Kohl
发明人： Tony Mule′ , Chirag Patel , James D. Meindl , Thomas K. Gaylord , Elias N. Glytsis , Kevin P. Martin , Stephen M. Schultz , Muhannad Bakir , Hollie Reed , Paul Kohl
IPC分类号： G02B6/10 , G02B6/12 , G02B6/122 , G02B6/132 , G02B6/136 , G02B6/34 , G02B6/43
CPC分类号： G02B6/43 , G02B6/10 , G02B6/12002 , G02B6/1221 , G02B6/132 , G02B6/136 , G02B6/34 , G02B2006/12107
摘要： Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.
摘要翻译：公开了具有波导的晶片级电子封装以及制造具有波导的芯片级电子封装的方法。代表性的芯片级电子封装包括至少一个具有波导芯的波导。此外，另一代表性的芯片级电子封装包括在波导芯的一部分周围具有气隙包覆层的波导。用于制造芯片级电子封装的代表性方法包括：提供具有设置在基板上的钝化层的基板; 在所述钝化层的一部分上设置波导芯; 在所述钝化层和所述波导芯的至少一部分上设置第一牺牲层; 在所述钝化层和所述第一牺牲层上设置外涂层; 以及去除所述第一牺牲层以在所述外涂层聚合物层内和所述波导芯的一部分周围限定气隙包覆层。

5. 发明授权

US06788867B2 Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication 失效
标题翻译：具有嵌入式气隙技术和制造方法的背板，印刷电路板和/或多芯片模块级光学互连层
公开(公告)号：US06788867B2
公开(公告)日：2004-09-07
申请号：US10734075
申请日：2003-12-11
申请人： Tony Mule′ , James D. Meindl , Paul Kohl , Stephen M. Schultz , Thomas K. Gaylord , Elias N. Glytsis , Ricardo Villalaz , Muhannad Bakir , Hollie Reed
发明人： Tony Mule′ , James D. Meindl , Paul Kohl , Stephen M. Schultz , Thomas K. Gaylord , Elias N. Glytsis , Ricardo Villalaz , Muhannad Bakir , Hollie Reed
IPC分类号： G02B600
CPC分类号： G02B6/136 , G02B6/12004 , G02B6/132 , G02B6/138
摘要： Optical interconnect layers and methods of fabrication thereof are described. In addition, the optical interconnect layers integrated into devices such as backplane (BP), printed wiring board (PWB), and multi-chip module (MCM) level devices are described. A representative optical interconnect layer includes a first cladding layer, a second cladding layer, one or more waveguides having a waveguide core and an air-gap cladding layer engaging a portion of waveguide core, wherein the first cladding layer and the second cladding layer engage the waveguide.
摘要翻译：描述光学互连层及其制造方法。此外，描述了集成到诸如背板（BP），印刷布线板（PWB）和多芯片模块（MCM）级装置的装置中的光学互连层。代表性的光学互连层包括第一包层，第二包层，具有波导芯的一个或多个波导和与波导芯的一部分接合的气隙包层，其中第一包层和第二包层与波导。

6. 发明授权

US07554347B2 High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use 失效
标题翻译：用于电气和光学互连部件晶圆级测试的高输入/输出密度光电探针卡，制造方法和使用方法
公开(公告)号：US07554347B2
公开(公告)日：2009-06-30
申请号：US10390873
申请日：2003-03-17
申请人： Tony Mule′ , Hiren Thacker , Muhannad Bakir , James D. Meindl , Thomas K. Gaylord , Kevin P. Martin , Paul Kohl
发明人： Tony Mule′ , Hiren Thacker , Muhannad Bakir , James D. Meindl , Thomas K. Gaylord , Kevin P. Martin , Paul Kohl
IPC分类号： G01R31/02
CPC分类号： G02B6/138 , G01R3/00 , G01R31/311 , G02B6/12004 , G02B6/132 , G02B6/136
摘要： Optoelectronic probe cards, methods of fabrication, and methods of use, are disclosed. Briefly described, one exemplary embodiment includes an optoelectronic probe card adapted to test an electrical quality and an optical quality of an optoelectronic structure under test having electrical and optical components.
摘要翻译：公开了光电探针卡，制造方法和使用方法。简要描述，一个示例性实施例包括适于测试具有电和光学部件的被测光电结构的电气质量和光学质量的光电探针卡。

7. 发明申请

US20050257709A1 Systems and methods for three-dimensional lithography and nano-indentation 审中-公开
标题翻译：三维光刻和纳米压痕的系统和方法
公开(公告)号：US20050257709A1
公开(公告)日：2005-11-24
申请号：US10699287
申请日：2003-10-31
申请人： Tony Mule , Paul Kohl , Muhannad Bakir , Kevin Martin , James Meindl , Hiren Thacker
发明人： Tony Mule , Paul Kohl , Muhannad Bakir , Kevin Martin , James Meindl , Hiren Thacker
IPC分类号： B41F1/00 , B81C1/00 , G03F7/00
CPC分类号： G03F7/00 , B81B2201/042 , B81B2201/047 , B81B2201/058 , B81B2203/0384 , B81C1/00119 , B81C2201/0108 , B81C2201/0152 , B81C2201/0159 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F7/0015
摘要： Systems and methods for three dimensional lithography, nano-indentation, and combinations thereof are disclosed. One exemplary three dimensional lithography method, among others, includes: providing a substrate having at least one optical element, wherein the optical element is selected from a refractive element and a diffractive element; disposing a polymer layer on the substrate and the at least one optical element, wherein the polymer layer includes a polymer material selected from a positive-tone polymer material and a negative-tone polymer material; positioning a mask adjacent the polymer layer, wherein the mask does not cover at least one directly exposed portion of the polymer material directly overlaying the at least one element; and exposing the at least one directly exposed portion of the polymer material to optical energy, wherein the optical energy passes through the at least one directly exposed portion of the polymer material and interacts with the element, and the element redirects the optical energy through the polymer material forming at least one area of indirectly exposed polymer material.
摘要翻译：公开了用于三维光刻，纳米压痕及其组合的系统和方法。一种示例性的三维光刻方法，其中包括：提供具有至少一个光学元件的衬底，其中所述光学元件选自折射元件和衍射元件; 在所述基板和所述至少一个光学元件上设置聚合物层，其中所述聚合物层包括选自正性聚合物材料和负性聚合物材料的聚合物材料; 将掩模定位在所述聚合物层附近，其中所述掩模不覆盖直接覆盖所述至少一个元件的聚合物材料的至少一个直接暴露部分; 并且将所述聚合物材料的至少一个直接暴露部分暴露于光能，其中所述光能通过所述聚合物材料的所述至少一个直接暴露部分并且与所述元件相互作用，并且所述元件将所述光能重定向通过所述聚合物形成间接暴露的聚合物材料的至少一个区域的材料。

8. 发明授权

US06933165B2 Method of making an electrostatic actuator 失效
标题翻译：制造静电致动器的方法
公开(公告)号：US06933165B2
公开(公告)日：2005-08-23
申请号：US10668887
申请日：2003-09-22
申请人： Jurgen Musolf , Paul Kohl
发明人： Jurgen Musolf , Paul Kohl
IPC分类号： H01G5/18 , H01H59/00 , H01L21/00 , H01L21/44
CPC分类号： H01H59/0009 , B82Y30/00 , H01G5/18 , H01H2059/0081
摘要： A method of fabricating an electrostatic actuator with an intrinsic stress gradient is provided. An electrode is formed on a substrate and a support layer is formed over the electrode. A metal layer is deposited onto the support layer via a deposition process. Deposition process conditions are varied in order to induce a stress gradient into the metal layer. The intrinsic stress in the metal layer increases in the direction from the bottom to the top of the metal layer. The support layer under the electrode is removed to release the electrostatic actuator.
摘要翻译：提供一种制造具有固有应力梯度的静电致动器的方法。在基板上形成电极，在电极上形成支撑层。通过沉积工艺将金属层沉积到载体层上。改变沉积工艺条件以便诱导金属层中的应力梯度。金属层中的固有应力在从金属层的底部到顶部的方向上增加。除去电极下面的支撑层以释放静电致动器。

9. 发明授权

US06625004B1 Electrostatic actuators with intrinsic stress gradient 失效
标题翻译：具有固有应力梯度的静电执行器
公开(公告)号：US06625004B1
公开(公告)日：2003-09-23
申请号：US09944867
申请日：2001-08-31
申请人： Jurgen Musolf , Paul Kohl
发明人： Jurgen Musolf , Paul Kohl
IPC分类号： H01G501
CPC分类号： H01H59/0009 , B82Y30/00 , H01G5/18 , H01H2059/0081
摘要： An electrostatic actuator with an intrinsic stress gradient is provided. The electrostatic actuator comprises an electrode and an electrostatically actuated beam fixed at one end relative to the electrode. The electrostatically actuated beam further includes a metal layer made substantially of a single metal with an induced stress gradient therein. The stress gradient in the metal layer determines the initial curvature of the beam. Upon electrostatic actuation of the beam, the beam is deflected from its initial curvature relative to the electrode. In one embodiment, the electrostatically actuated beam is used as a top movable electrode of an electrostatically actuated variable capacitor. The capacitance of the electrostatically actuated capacitor is changed upon electrostatic actuation of the beam.
摘要翻译：提供具有固有应力梯度的静电致动器。静电致动器包括相对于电极在一端固定的电极和静电致动的光束。静电致动光束还包括基本上由其中具有诱发应力梯度的单一金属制成的金属层。金属层中的应力梯度决定了梁的初始曲率。在光束的静电致动时，光束相对于电极从其初始曲率偏转。在一个实施例中，静电驱动的光束用作静电驱动的可变电容器的顶部可移动电极。静电驱动的电容器的电容在光束的静电驱动时改变。

10. 发明申请

US20080050637A1 Microfabricated Fuel Cell 审中-公开
标题翻译：微型燃料电池
公开(公告)号：US20080050637A1
公开(公告)日：2008-02-28
申请号：US11843634
申请日：2007-08-22
申请人： Shruti Prakash , Paul Kohl , Dhananjay Bhusari
发明人： Shruti Prakash , Paul Kohl , Dhananjay Bhusari
IPC分类号： H01M8/02 , C23C16/00
CPC分类号： H01M8/0245 , H01M8/0232 , H01M8/0269 , H01M8/1004 , H01M8/1011 , H01M8/1046 , H01M8/1069 , H01M8/1097 , H05K1/16 , Y02E60/523 , Y02P70/56
摘要： One or more microfabricated fuel cells may be integrated into a printed circuit board or a printed wiring board within an electronic device. The electrical energy created by the integrated microfabricated fuel cells within the metal wiring on the PWB may then be used by the electronic components within and on the PWB.
摘要翻译：一个或多个微细加燃料电池可以集成到电子设备内的印刷电路板或印刷电路板中。由PWB上的金属配线内的集成的微细化燃料电池产生的电能可以由PWB内部和电路板上的电子部件使用。

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