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1. 发明授权

US06201309B1 Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same 失效
标题翻译：用于密封半导体元件的热塑性材料，由该材料密封的半导体器件及其制造方法
公开(公告)号：US06201309B1
公开(公告)日：2001-03-13
申请号：US09092990
申请日：1998-06-08
申请人： Tomoko Honda , Masaki Adachi
发明人： Tomoko Honda , Masaki Adachi
IPC分类号： H01L2329
CPC分类号： C09K3/1012 , H01B3/307 , H01L23/295 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2924/00014 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01079 , H01L2924/12043 , H01L2924/1305 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/20752 , H01L2224/05599 , H01L2224/85399
摘要： A reusable packaging material for semiconductor devices. The semiconductor device package is formed from a thermoplastic resin. The resin has good fluidity and good adhesion. The new package is recyclable because the thermoplastic resin hardening process is reversible. The new package has sufficient mechanical strength and adhesion to seal a semiconductor device. A thermoplastic material for sealing a semiconductor element is characterized by 4.5×10−5[1/.degree.C.] or less linear thermal expansivity at about 150-200 .degree.C.
摘要翻译：一种用于半导体器件的可重复使用的封装材料。半导体器件封装由热塑性树脂形成。该树脂具有良好的流动性和良好的附着力。新包装是可回收的，因为热塑性树脂硬化过程是可逆的。新的封装具有足够的机械强度和密合性以密封半导体器件。用于密封半导体元件的热塑性材料的特征在于在约150-200℃下具有4.5×10-5 [1 /℃]或更小的线性热膨胀性。

2. 发明授权

US08067779B2 Light emitting device with a recess lead portion 有权
标题翻译：具有凹陷引线部分的发光器件
公开(公告)号：US08067779B2
公开(公告)日：2011-11-29
申请号：US12652422
申请日：2010-01-05
申请人： Tetsuya Muranaka , Masaki Adachi , Iwao Matsumoto , Kenji Naito , Toshiaki Hosoya
发明人： Tetsuya Muranaka , Masaki Adachi , Iwao Matsumoto , Kenji Naito , Toshiaki Hosoya
IPC分类号： H01L33/00 , H01R9/00
CPC分类号： H01L33/60 , H01L33/52 , H01L33/62 , H01L2224/48247 , H01L2924/181 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device includes: a light emitting element; a first lead including a recess in one end portion, the recess including a first bottom surface with the light emitting element bonded thereto, at least one of a through hole and a notch, and a light shielding portion capable of suppressing leakage of emitted light from the light emitting element from the one of the through hole and the notch; a second lead opposed to the first lead; and a molded body filling the one of the through hole and the notch, covering the light emitting element, embedding at least part of the first lead and at least part of the second lead, and made of a translucent resin.
摘要翻译：发光器件包括：发光元件; 第一引线，其包括在一个端部中的凹部，所述凹部包括与发光元件接合的第一底表面，通孔和凹口中的至少一个以及能够抑制发射光的泄漏的遮光部分所述发光元件来自所述通孔和所述凹口中的一个; 第二个领先者反对第一个领先; 以及填充所述通孔和所述凹口中的一个的成型体，覆盖所述发光元件，包埋所述第一引线的至少一部分和所述第二引线的至少一部分，并且由半透明树脂制成。

3. 发明授权

US06255739B1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06255739B1
公开(公告)日：2001-07-03
申请号：US09451755
申请日：1999-12-01
申请人： Masaki Adachi , Megumi Yamamura
发明人： Masaki Adachi , Megumi Yamamura
IPC分类号： H01L2329
CPC分类号： H01L31/173 , H01L23/293 , H01L24/45 , H01L31/0203 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/48465 , H01L2924/10157 , H01L2924/12042 , H01L2924/14 , H01L2924/16195 , H01L2924/181 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/00012
摘要： A composition for sealing a semiconductor device contains polyphenylene sulfide wherein a line expansion coefficient at 150° C. to 200° C. is 4.75×10−5 [1/°C.] or less, a line thermal expansion coefficient at 80 to 130° C. is 6.0×10−5 [1/°C.] or less, and a line expansion coefficient ratio between the flow direction and a normal direction of the flow direction is 0.55 or more.
摘要翻译：用于密封半导体器件的组合物含有聚苯硫醚，其中150℃至200℃的线膨胀系数为4.75×10 -5 [1 /℃]以下，线热膨胀系数为80〜130° C为6.0×10 -5 [1 /℃]以下，流动方向与流动方向的法线方向之间的线膨胀系数比为0.55以上。

4. 发明授权

US6091139A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US6091139A
公开(公告)日：2000-07-18
申请号：US938998
申请日：1997-09-26
申请人： Masaki Adachi , Isao Ogawa
发明人： Masaki Adachi , Isao Ogawa
IPC分类号： H01L23/28 , H01L21/56 , H01L21/60 , H01L23/495 , H01L23/50 , H01L31/12 , H01L33/48 , H01L33/62 , H01L23/48
CPC分类号： H01L33/62 , H01L21/56 , H01L23/49541 , H01L23/49582 , H01L33/54 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/1815 , H01L2924/3011 , H01L2924/3025
摘要： A semiconductor device comprising a package formed of a thermoplastic resin, first and second lead frames arranged parallel to each other with a predetermined space interposed therebetween, and each having a distal end portion of a predetermined length located in the package, solder films formed on the first and second lead frames from outside the package to inside the package, a semiconductor element mounted on the distal end portion of the first lead frame and having an electrode, and a bonding wire having an end connected to the electrode of the semiconductor element, and another end connected to the distal end portion of the second lead frame.
摘要翻译：一种半导体器件，包括由热塑性树脂形成的封装，彼此平行地布置有预定空间的第一和第二引线框架，并且每个具有位于所述封装中的预定长度的远端部分，形成在所述封装上的焊料膜第一引线框架和第二引线框架从封装外部到封装内部，半导体元件安装在第一引线框架的远端部分上并具有电极，以及接合线，其端部连接到半导体元件的电极，以及另一端连接到第二引线框架的远端部分。

5. 发明授权

US08946948B2 Motor with stator cover formed by overlapping two members 有权
标题翻译：带有定子盖的电机通过重叠两个构件形成
公开(公告)号：US08946948B2
公开(公告)日：2015-02-03
申请号：US13457862
申请日：2012-04-27
申请人： Masaki Adachi , Yoshiaki Oguma , Yasuyuki Kaji
发明人： Masaki Adachi , Yoshiaki Oguma , Yasuyuki Kaji
IPC分类号： H02K5/00 , H02K5/10 , H02K11/00 , H02K7/14 , H02K5/128
CPC分类号： H02K5/10 , H02K5/128 , H02K7/14 , H02K11/30
摘要： A motor includes a cover made of a resin material. The cover includes a first annular portion arranged to extend in an annular shape above coils, a side wall portion arranged to extend downward from an outer circumferential portion of the first annular portion, and a second annular portion arranged to extend radially outward or radially inward from a lower end portion of the side wall portion along an upper surface of a circuit board. The side wall portion is arranged to extend in an axial direction while filling in gaps between teeth on a radially inner side of radially outer end surfaces of the teeth. The coils are covered by the cover to be protected from dust, water droplets, etc. The radially outer end surfaces of the teeth are exposed from the cover, and are thus arranged to be in radial proximity to a rotor magnet.
摘要翻译：电动机包括由树脂材料制成的盖。所述盖包括布置成在线圈上方以环形形状延伸的第一环形部分，设置成从所述第一环形部分的外圆周部分向下延伸的侧壁部分和布置成径向向外或径向向内延伸的第二环形部分沿着电路板的上表面的侧壁部分的下端部分。侧壁部分被布置成在轴向方向上延伸，同时填充齿的径向外端表面的径向内侧上的齿之间的间隙。线圈由盖子覆盖以防止灰尘，水滴等。齿的径向外端表面从盖子露出，并且因此布置成径向接近转子磁体。

6. 发明授权

US07393706B2 Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig 有权
标题翻译：光学半导体器件的制造方法，封装成型夹具，封装成型夹具的制造方法以及封装成形用夹具的制造装置
公开(公告)号：US07393706B2
公开(公告)日：2008-07-01
申请号：US11072233
申请日：2005-03-07
申请人： Masaki Adachi , Masaharu Yamanaka , Fumihide Nagashima , Tatsuhiko Nagafuchi , Takao Abe , Masayoshi Harada , Hirofumi Hansei , Hironari Kotsubo
发明人： Masaki Adachi , Masaharu Yamanaka , Fumihide Nagashima , Tatsuhiko Nagafuchi , Takao Abe , Masayoshi Harada , Hirofumi Hansei , Hironari Kotsubo
IPC分类号： H01L21/00
CPC分类号： B29C33/3842 , B29C33/40 , B29C39/10 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.
摘要翻译：一种制造光学半导体器件的方法包括：制备在引线框架的第一引线部分的远端上设置并与引线框架的第二引线部分的电极电连接的光学半导体，形成用于制备封装成形夹具，其具有与光半导体装置的封装的轮廓对应的凹部，将引线部的前端插入到用于定位固定的封装成型夹具的凹部内，并将封装树脂填充到凹部的包装成型夹具。

7. 发明申请

US20050208690A1 Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig 有权
标题翻译：光学半导体器件的制造方法，封装成型夹具，封装成型夹具的制造方法以及封装成形用夹具的制造装置
公开(公告)号：US20050208690A1
公开(公告)日：2005-09-22
申请号：US11072233
申请日：2005-03-07
申请人： Masaki Adachi , Masaharu Yamanaka , Fumihide Nagashima , Tatsuhiko Nagafuchi , Takao Abe , Masayoshi Harada , Hirofumi Hansei , Hironari Kotsubo
发明人： Masaki Adachi , Masaharu Yamanaka , Fumihide Nagashima , Tatsuhiko Nagafuchi , Takao Abe , Masayoshi Harada , Hirofumi Hansei , Hironari Kotsubo
IPC分类号： B29C33/38 , B29C33/40 , B29C39/10 , H01L21/00 , H01L21/56 , H01L23/02 , H01L23/495 , H01L33/56 , H01L33/62
CPC分类号： B29C33/3842 , B29C33/40 , B29C39/10 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.
摘要翻译：一种制造光学半导体器件的方法包括：制备在引线框架的第一引线部分的远端上设置并与引线框架的第二引线部分的电极电连接的光学半导体，形成用于制备封装成形夹具，其具有与光半导体装置的封装的轮廓对应的凹部，将引线部的前端插入到用于定位固定的封装成型夹具的凹部内，并将封装树脂填充到凹部的包装成型夹具。

8. 发明授权

US4900985A High-voltage input terminal structure of a magnetron for a microwave oven 失效
标题翻译：用于微波炉的磁控管的高电压输入端子结构
公开(公告)号：US4900985A
公开(公告)日：1990-02-13
申请号：US126229
申请日：1987-11-27
申请人： Norio Tashiro , Masaki Adachi , Toshio Ikeda , Hisao Saito , Saburo Matsushita , Masataka Komine
发明人： Norio Tashiro , Masaki Adachi , Toshio Ikeda , Hisao Saito , Saburo Matsushita , Masataka Komine
IPC分类号： H01J23/15
CPC分类号： H01J23/15
摘要： In a magnetron for microwave oven, a high-voltage input terminal structure 30 is provided on a shield box 26 mounted on a magnetron unit 22. The high-voltage input terminal structure 30 has a cylindrical earth electrode 33, a cylindrical high potential inner electrode 32 and a central conductor 31a. The cylindrical earth electrode 33 is secured to the shield box 26 and the cylindrical high potential inner electrode 32 is coaxially arranged in the cylindrical earth electrode 33. The central conductor 31a is connected through an inductor 28 to a cathode lead 27 of the magnetron unit 22. An insulating resin 34b is filled in a gap between the cylindrical earth electrode 33 and the highpotential electrode 32 to form a capacitor section C. Cylindrical insulating sheaths 37, 38 are formed by the resin on the both sides of the capacitor section C. The capacitor section C and the cylindrical insulating sheaths, 37, 38 are integrally formed and continuously extended along a straight line.
摘要翻译：在用于微波炉的磁控管中，高压输入端子结构30设置在安装在磁控管单元22上的屏蔽盒26上。高电压输入端子结构30具有圆柱形接地电极33，圆柱形高电位内部电极 32和中心导体31a。圆筒形接地电极33固定在屏蔽箱26上，圆柱形高电位内部电极32同轴地布置在圆柱形接地电极33中。中心导体31a通过电感器28连接到磁控管单元22的阴极引线27 绝缘树脂34b填充在圆柱形接地电极33和高电位电极32之间的间隙中以形成电容器部分C.圆柱形绝缘护套37,38由电容器部分C两侧的树脂形成。电容器部分C和圆柱形绝缘护套37,38一体地形成并沿着直线连续延伸。

9. 发明授权

US09120176B2 Laser processing machine and laser processing method 有权
标题翻译：激光加工机和激光加工方法
公开(公告)号：US09120176B2
公开(公告)日：2015-09-01
申请号：US13878579
申请日：2011-10-21
申请人： Harumi Nishiyama , Hiroshi Onodera , Masaki Adachi , Toshinori Abe
发明人： Harumi Nishiyama , Hiroshi Onodera , Masaki Adachi , Toshinori Abe
IPC分类号： B23K26/10 , B23K37/04 , B23K26/02 , B23K26/08 , B23K26/38 , B23K37/02 , B23K37/053
CPC分类号： B23K26/02 , B23K26/0823 , B23K26/0876 , B23K26/10 , B23K26/38 , B23K37/0235 , B23K37/04 , B23K37/0435 , B23K37/0533 , B23K2101/10 , B23K2101/28 , B23K2103/04
摘要： A laser processing machine includes a work head, a plate-like work working table for processing a plate-like work, a rod-like work working table including a rod-like work holder for processing a rod-like work, and a work area in which the work head is movably provided. The plate-like work working table is provided movably from one side of the work area into the work area. The rod-like work working table is provided movably from another side of the work area into the work area that is opposite side of the one side. According to the laser processing machine, when switching over between a processing of a plate-like work and a processing of a rod-like work, it is needed only to move/evacuate the plate-like work working table and the rod-like work working table to/from the work area, so that the switching-over operation can be easily done.
摘要翻译：激光加工机包括工作头，用于加工板状工件的板状工作台，包括用于处理棒状工件的杆状工件保持器的杆状作业工作台和工作区域其中工作头可移动地设置。板状工作台从工作区域的一侧可移动地设置到工作区域。杆状作业工作台从工作区域的另一侧可移动地设置到与一侧相对的工作区域。根据激光加工机，在板状工件的加工与棒状加工之间进行切换时，仅需要移动/抽出板状工作台和棒状工件工作台往返于工作区，从而可以轻松完成切换操作。

10. 发明申请

US20130193125A1 LASER PROCESSING MACHINE AND LASER PROCESSING METHOD 有权
标题翻译：激光加工机和激光加工方法
公开(公告)号：US20130193125A1
公开(公告)日：2013-08-01
申请号：US13878579
申请日：2011-10-21
申请人： Harumi Nishiyama , Hiroshi Onodera , Masaki Adachi , Toshinori Abe
发明人： Harumi Nishiyama , Hiroshi Onodera , Masaki Adachi , Toshinori Abe
IPC分类号： B23K26/02
CPC分类号： B23K26/02 , B23K26/0823 , B23K26/0876 , B23K26/10 , B23K26/38 , B23K37/0235 , B23K37/04 , B23K37/0435 , B23K37/0533 , B23K2101/10 , B23K2101/28 , B23K2103/04
摘要： A laser processing machine includes a work head, a plate-like work working table for processing a plate-like work, a rod-like work working table including a rod-like work holder for processing a rod-like work, and a work area in which the work head is movably provided. The plate-like work working table is provided movably from one side of the work area into the work area. The rod-like work working table is provided movably from another side of the work area into the work area that is opposite side of the one side. According to the laser processing machine, when switching over between a processing of a plate-like work and a processing of a rod-like work, it is needed only to move/evacuate the plate-like work working table and the rod-like work working table to/from the work area, so that the switching-over operation can be easily done.
摘要翻译：激光加工机包括工作头，用于加工板状工件的板状工作台，包括用于处理棒状工件的杆状工件保持器的杆状作业工作台和工作区域其中工作头可移动地设置。板状工作台从工作区域的一侧可移动地设置到工作区域。杆状作业工作台从工作区域的另一侧可移动地设置到与一侧相对的工作区域。根据激光加工机，在板状工件的加工与棒状加工之间进行切换时，仅需要移动/抽出板状工作台和棒状工件工作台往返于工作区，从而可以轻松完成切换操作。

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