专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100284849A1 AUSTENITIC CAST IRON AND MANUFACTURING PROCESS FOR THE SAME, AUSTENITIC-CAST-IRON CAST PRODUCT AND COMPONENT PART FOR EXHAUST SYSTEM 审中-公开
标题翻译：奥斯卡铸铁及其制造方法，奥斯卡 - 铸铁铸件产品和排气系统组件
公开(公告)号：US20100284849A1
公开(公告)日：2010-11-11
申请号：US12675283
申请日：2008-08-29
申请人： Tomohei Sugiyama , Manabu Ishikawa , Hiroyuki Isomura , Mamoru Kojima , Naoki Yamamoto , Kyoichi Kinoshita , Takao Fujikawa
发明人： Tomohei Sugiyama , Manabu Ishikawa , Hiroyuki Isomura , Mamoru Kojima , Naoki Yamamoto , Kyoichi Kinoshita , Takao Fujikawa
IPC分类号： C22C37/08 , C22C37/00 , C22C38/42 , C22C38/16 , C22C38/40 , C22C38/08 , C22C37/06 , C22C37/10 , B22D27/00
CPC分类号： C22C37/08 , C21C1/105 , C22C37/04
摘要： An austenitic cast iron according to the present invention has Ni: from 7 to 15% by mass, and is characterized in that it comprises a base structure in which an austenite phase makes a major phase even in ordinary-temperature region by adjusting the respective compositions of Cr, Ni and Cu, excepting C and Si, so as to fall within predetermined ranges. In accordance with the present invention, it is possible to obtain an austenitic cast iron, which is excellent in terms of oxidation resistance and the like, inexpensively, while reducing the content of expensive Ni.
摘要翻译：根据本发明的奥氏体铸铁的Ni：7〜15质量％，其特征在于，其特征在于，通过调整各组成物，其中奥氏体相在常温区域中成为主相的基体结构的Cr，Ni和Cu，除了C和Si之外，以便落在预定范围内。根据本发明，可以在降低昂贵的Ni的含量的同时，廉价地获得耐氧化性优异的奥氏体铸铁。

2. 发明申请

US20130045127A1 AUSTENITIC CAST IRON, AUSTENITIC-CAST-IRON CAST PRODUCT AND MANUFACTURING PROCESS FOR THE SAME 有权
标题翻译：奥斯卡铸铁，奥斯卡 - 铸铁铸造产品及其制造工艺
公开(公告)号：US20130045127A1
公开(公告)日：2013-02-21
申请号：US13695719
申请日：2011-05-18
申请人： Tomohei Sugiyama , Manabu Ishikawa , Mamoru Kojima , Kyoichi Kinoshita
发明人： Tomohei Sugiyama , Manabu Ishikawa , Mamoru Kojima , Kyoichi Kinoshita
IPC分类号： C22C37/08 , C22C37/10 , B22D25/06
CPC分类号： C22C37/08 , C21C1/10 , C21C1/105 , C21D5/00 , C22C33/08 , C22C37/04 , C22C37/10 , F01N13/16 , F01N2530/02 , F01N2530/04 , F05D2220/40
摘要： An austenitic cast iron according to the present invention is characterized in that: it comprises: basic elements comprising C, Si, Cr, Ni, Mn and Cu; and the balance comprising Fe, inevitable impurities and/or a trace-amount modifier element, which is effective in improving characteristic, in a trace amount; and it is an austenitic cast iron being a cast iron that is structured by a base comprising an Fe alloy in which an austenite phase makes a major phase in ordinary-temperature region; wherein said basic elements fall within compositional ranges that satisfy the following conditions when the entirety of said cast iron is taken as 100% by mass (hereinafter being simply expressed as “%”): C: from 2.0 to 3.0%; Si: from 4.0 to 5.4%; Cr: from 0.8 to 2.0%; Mn: from 3.9 to 5.6%; Ni: from 17 to 22%; and Cu: from 0.9 to 1.6%. It is an austenitic cast iron whose Ni content is less relatively, and is excellent in terms of oxidation resistance under high temperature and austenite-phase stability in intermediate-temperature region.
摘要翻译：根据本发明的奥氏体铸铁的特征在于：它包括：包含C，Si，Cr，Ni，Mn和Cu的基本元素; 并且余量包含微量有效改善特性的Fe，不可避免的杂质和/或微量改性剂元素; 并且是奥氏体铸铁，其是由包含奥氏体相在常温区域中产生主相的Fe合金的基体构成的铸铁; 其中当全部所述铸铁为100质量％（以下简称为％）时，所述碱性元素处于满足以下条件的组成范围内：C：2.0〜3.0％ Si：4.0〜5.4％ Cr：0.8〜2.0％ Mn：3.9〜5.6％ Ni：17〜22％和Cu：0.9〜1.6％。它是一种奥氏体铸铁，其Ni含量相对较少，并且在高温下的耐氧化性和中间温度区域的奥氏体相稳定性方面优异。

3. 发明授权

US09567657B2 Austenitic cast iron, austenitic-cast-iron cast product and manufacturing process for the same 有权
标题翻译：奥氏体铸铁，奥氏体铸铁铸造产品及其制造工艺相同
公开(公告)号：US09567657B2
公开(公告)日：2017-02-14
申请号：US13695719
申请日：2011-05-18
申请人： Tomohei Sugiyama , Manabu Ishikawa , Mamoru Kojima , Kyoichi Kinoshita
发明人： Tomohei Sugiyama , Manabu Ishikawa , Mamoru Kojima , Kyoichi Kinoshita
IPC分类号： C22C37/08 , C22C37/10 , B22D25/06 , F01N13/16 , C21C1/10 , C22C33/08 , C21D5/00 , C22C37/04
CPC分类号： C22C37/08 , C21C1/10 , C21C1/105 , C21D5/00 , C22C33/08 , C22C37/04 , C22C37/10 , F01N13/16 , F01N2530/02 , F01N2530/04 , F05D2220/40
摘要： An austenitic cast iron including basic elements of C, Si, Cr, Ni, Mn and Cu; and the balance including Fe, inevitable impurities and/or a trace-amount modifier element, which is effective in improving a characteristic of the cast iron, in a trace amount; and structured by a base comprising an Fe alloy in which an austenite phase makes a major phase in ordinary-temperature region; wherein the basic elements fall within compositional ranges that satisfy the following conditions when the entirety of the cast iron is taken as 100% by mass: C: from 2.0 to 3.0%; Si: from 4.0 to 5.4%; Cr: from 0.8 to 2.0%; Mn: from 3.9 to 5.6%; Ni: from 17 to 22%; and Cu: from 0.9 to 1.6%.
摘要翻译：包括C，Si，Cr，Ni，Mn和Cu的基本元素的奥氏体铸铁; 余量包括微量有效提高铸铁特性的Fe，不可避免的杂质和/或微量改性剂元素; 并由包含奥氏体相在常温区域中形成主相的Fe合金的基体构成，其中当将全部铸铁作为100质量％时，基本元素在满足以下条件的组成范围内：C：2.0〜3.0％; Si：4.0〜5.4％ Cr：0.8〜2.0％ Mn：3.9〜5.6％ Ni：17〜22％和Cu：0.9〜1.6％。

4. 发明授权

US07097914B2 Composite structural material, and method of producing the same 失效
标题翻译：复合结构材料及其制造方法
公开(公告)号：US07097914B2
公开(公告)日：2006-08-29
申请号：US10472273
申请日：2002-08-28
申请人： Katsufumi Tanaka , Tomohei Sugiyama , Kyoichi Kinoshita , Takashi Yoshida , Eiji Kono , Hidehiro Kudo , Manabu Miyoshi
发明人： Katsufumi Tanaka , Tomohei Sugiyama , Kyoichi Kinoshita , Takashi Yoshida , Eiji Kono , Hidehiro Kudo , Manabu Miyoshi
IPC分类号： B32B3/24 , B32B15/06 , H01L23/36
CPC分类号： H01L23/3736 , B23K20/04 , B23K20/22 , B23K2101/38 , B23K2103/10 , B23K2103/12 , B23K2103/16 , B23K2103/18 , B23K2103/20 , B23K2103/22 , H01L23/3733 , H01L2924/0002 , Y10T29/49908 , Y10T156/10 , Y10T428/12451 , Y10T428/12486 , Y10T428/12562 , Y10T428/12757 , Y10T428/12917 , Y10T428/24917 , Y10T428/249956 , H01L2924/00
摘要： A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10−6/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m×K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.
摘要翻译：板状复合材料具有第一构件和第二构件。第一构件是由金属板形成的多孔金属。金属板的线膨胀系数小于或等于8×10 -6 /摄氏度。第一个成分抑制复合材料的热膨胀。第二构件的导热系数大于或等于200W /（m×K）。第二构件保持复合材料的导热系数。这种结构提供了可靠的导热系数和高强度。该结构适用于其上安装诸如半导体的电子元件的冷却基板。

5. 发明申请

US20070045801A1 Circuit board 审中-公开
标题翻译：电路板
公开(公告)号：US20070045801A1
公开(公告)日：2007-03-01
申请号：US11514736
申请日：2006-08-31
申请人： Tomohei Sugiyama , Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
发明人： Tomohei Sugiyama , Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
IPC分类号： H01L23/06
CPC分类号： H05K1/0271 , H01L2224/32225 , H05K1/0272 , H05K1/056 , H05K1/09 , H05K2201/0209 , H05K2201/0338 , H05K2201/068
摘要： A circuit board includes a substrate having a heat exhausting function. A wiring layer of a metal composite material is provided on the substrate with an insulating layer in between. The metal composite material has a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of a silicon semiconductor chip and less than a coefficient of thermal expansion of copper. Accordingly, a circuit board that is suitable for mounting power devices, requires no heat sink or heat spreader is provides. Further, the number of components for assembling a module is reduced.
摘要翻译：电路板包括具有排热功能的基板。在基板上设置金属复合材料的布线层，其间具有绝缘层。金属复合材料的热膨胀系数大于硅半导体芯片的热膨胀系数，小于铜的热膨胀系数。因此，适用于安装功率器件的电路板不需要散热器或散热器。此外，用于组装模块的部件的数量减少。

6. 发明申请

US20060046035A1 Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate 失效
标题翻译：基板电路板的制造方法，电路基板，基板的电路基板的制造方法
公开(公告)号：US20060046035A1
公开(公告)日：2006-03-02
申请号：US11185633
申请日：2005-07-19
申请人： Katsufumi Tanaka , Kyoichi Kinoshita , Tomohei Sugiyama , Eiji Kono
发明人： Katsufumi Tanaka , Kyoichi Kinoshita , Tomohei Sugiyama , Eiji Kono
IPC分类号： B32B3/00 , B32B9/00
CPC分类号： H05K1/05 , H01L21/4871 , H01L23/3735 , H01L2224/32225 , H05K2201/0209 , H05K2201/0355 , H05K2203/128 , Y10T428/12493 , Y10T428/12576 , Y10T428/24917 , Y10T428/31678
摘要： First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al—Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.
摘要翻译：首先，将含有Si的Al合金的熔体或含有Si的Al合金的熔体注入填充有SiC粉末的模具中并铸造以形成由Al / SiC复合材料制成的板构件。接着，将由Al-Mg系合金构成的铝箔构件通过热压与板构件的表面接合。结果，Al箔构件的一部分在板构件的表面上进入浇注气孔以填充铸造气孔。此外，在板构件的表面上形成Al-Mg基合金层。因此，制造具有接近平坦表面的基板。

7. 发明授权

US07364632B2 Radiator member for electronic appliances and processes for producing the same 失效
标题翻译：用于电子设备的散热器构件及其制造方法
公开(公告)号：US07364632B2
公开(公告)日：2008-04-29
申请号：US10472802
申请日：2002-03-14
申请人： Katsufumi Tanaka , Tomohei Sugiyama , Kyoichi Kinoshita , Eiji Kono , Naohisa Nishino
发明人： Katsufumi Tanaka , Tomohei Sugiyama , Kyoichi Kinoshita , Eiji Kono , Naohisa Nishino
IPC分类号： C22C21/00 , C22C29/02
CPC分类号： C22C29/065 , B22F2999/00 , C22C1/1036 , C22C32/0063 , C22C2001/1073 , H01L23/3733 , H01L2924/0002 , Y10T428/12736 , B22F1/0014 , H01L2924/00
摘要： The present invention is a process for producing a radiator member for electronic appliances, and is characterized in that, in a process for producing a radiator member for electronic appliances, the radiator member comprising a composite material in which SiC particles are dispersed in a matrix metal whose major component is Al, it comprises a filling step of filling an SiC powder into a mold, a pre-heating step of pre-heating the mold after the filling step to a pre-heating temperature which falls in a range of from a melting point or more of said matrix metal to less than a reaction initiation temperature at which a molten metal of the matrix metal and SiC particles in the SiC powder start to react, and a pouring step of pouring the molten matrix metal whose molten-metal temperature falls in a range of from the melting point or more of the matrix metal to less than the reaction initiation temperature, into the mold after the pre-heating step, and impregnating the SiC powder with the molten metal by pressurizing.When the molten-metal temperature and the pre-heating temperature are from the melting point or more of the matrix metal to less than the reaction initiator temperature, it is possible to inhibit the generation of low thermal conductive materials while securing the impregnation of the molten metal into the SiC powder.
摘要翻译：本发明是一种电子电器用散热构件的制造方法，其特征在于，在电子电器用散热构件的制造方法中，散热构件包括SiC颗粒分散在基体金属中的复合材料其主要成分是Al，其包括将SiC粉末填充到模具中的填充步骤，在填充步骤之后将模具预加热到预热温度的预热步骤，该预热温度落在熔化范围内所述基体金属的一个或多个点小于SiC粉末中的基体金属和SiC颗粒的熔融金属开始反应的反应引发温度，以及将熔融金属温度下降的熔融基质金属倒出的倾倒步骤在从基体金属的熔点以上到小于反应开始温度的范围内，在预热工序后进入模具，并将SiC粉末浸渍在通过加压熔融金属。当熔融金属温度和预热温度从基体金属的熔点或更高温度到小于反应引发剂温度时，可以在确保浸渍熔融金属的温度的同时，抑制低导热材料的产生金属进入SiC粉末。

8. 发明授权

US06753093B2 Heat dissipating material and manufacturing method thereof 失效
标题翻译：散热材料及其制造方法
公开(公告)号：US06753093B2
公开(公告)日：2004-06-22
申请号：US10247953
申请日：2002-09-20
申请人： Katsufumi Tanaka , Kyoichi Kinoshita , Takashi Yoshida , Tomohei Sugiyama , Eiji Kono
发明人： Katsufumi Tanaka , Kyoichi Kinoshita , Takashi Yoshida , Tomohei Sugiyama , Eiji Kono
IPC分类号： B32B702
CPC分类号： B32B15/015 , B22D19/14 , C22C1/0475 , H01L21/4871 , H01L23/3735 , H01L24/32 , Y10T428/12063 , Y10T428/12069 , Y10T428/12493 , Y10T428/12528 , Y10T428/12951
摘要： A heat spreader includes an electromagnetic soft iron sheet and a plating layer formed on the surface of the sheet. The plate is made of a rustproof metal. An electronic component is mounted on an aluminum base with an HITT substrate and the heat spreader in between. The heat spreader is manufactured at low cost and has a favorable property as a heat dissipating material.
摘要翻译：散热器包括电磁软铁片和形成在片材表面上的镀层。该板由防锈金属制成。电子部件安装在具有HITT基板的铝基座和散热器之间。散热器以低成本制造并且具有作为散热材料的有利特性。

9. 发明授权

US07323255B2 Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate 失效
标题翻译：基板电路板的制造方法，电路基板，基板的电路基板的制造方法
公开(公告)号：US07323255B2
公开(公告)日：2008-01-29
申请号：US11185633
申请日：2005-07-19
申请人： Katsufumi Tanaka , Kyoichi Kinoshita , Tomohei Sugiyama , Eiji Kono
发明人： Katsufumi Tanaka , Kyoichi Kinoshita , Tomohei Sugiyama , Eiji Kono
IPC分类号： B32B15/00 , H01L23/06 , H05K1/00 , H05K7/20
CPC分类号： H05K1/05 , H01L21/4871 , H01L23/3735 , H01L2224/32225 , H05K2201/0209 , H05K2201/0355 , H05K2203/128 , Y10T428/12493 , Y10T428/12576 , Y10T428/24917 , Y10T428/31678
摘要： First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al—Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.
摘要翻译：首先，将含有Si的Al合金的熔体或含有Si的Al合金的熔体注入填充有SiC粉末的模具中并铸造以形成由Al / SiC复合材料制成的板构件。接着，将由Al-Mg系合金构成的铝箔构件通过热压与板构件的表面接合。结果，Al箔构件的一部分在板构件的表面上进入浇注气孔以填充铸造气孔。此外，在板构件的表面上形成Al-Mg基合金层。因此，制造具有接近平坦表面的基板。

10. 发明申请

US20050031889A1 Low-expansion unit, method of manufacturing the same and semiconductor provided with the same 失效
标题翻译：低膨胀单元，其制造方法和具有该膨胀单元的半导体装置
公开(公告)号：US20050031889A1
公开(公告)日：2005-02-10
申请号：US10655278
申请日：2003-09-03
申请人： Takashi Yoshida , Kyoichi Kinoshita , Katsufumi Tanaka , Tomohei Sugiyama , Hidehiro Kudo , Eiji Kono
发明人： Takashi Yoshida , Kyoichi Kinoshita , Katsufumi Tanaka , Tomohei Sugiyama , Hidehiro Kudo , Eiji Kono
IPC分类号： H01L23/373 , B32B15/18
CPC分类号： H01L23/3735 , H01L2924/0002 , Y10T428/12458 , Y10T428/12528 , Y10T428/12937 , Y10T428/12951 , Y10T428/12958 , H01L2924/00
摘要： A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate member has a relatively large thermal expansion coefficient, the iron-nickel layers, which are formed on and/or in the upper and lower surface layers of the plate member, have a relatively small thermal expansion coefficient. Therefore, thermal expansion coefficient of the low-expansion unit is as a whole restrained to a relatively small value. Also, the plate member includes pure iron whose thermal conductivity is relatively high. Meanwhile, the iron-nickel layers, which are formed on the plate member, are relatively thin. Therefore, the low-expansion unit has a relatively large thermal conductivity in a direction of thickness thereof.
摘要翻译：低膨胀单元包括板构件和铁镍层。板构件的上表面和下表面各自在其上和/或其中具有铁 - 镍层。虽然板构件具有相对较大的热膨胀系数，但是形成在板构件的上表面层和/或下表面层中的铁镍层具有相对较小的热膨胀系数。因此，低膨胀单元的热膨胀系数整体被抑制到相对较小的值。此外，板构件包括热导率相对较高的纯铁。同时，形成在板构件上的铁镍层相对较薄。因此，低膨胀单元在其厚度方向上具有相对较大的热导率。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式