专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100101103A1 TILT SENSOR AND METHOD FOR MAKING THE SAME 有权
标题翻译：倾斜传感器及其制造方法
公开(公告)号：US20100101103A1
公开(公告)日：2010-04-29
申请号：US12605047
申请日：2009-10-23
申请人： Tomoharu Horio , Satoshi Fujitani
发明人： Tomoharu Horio , Satoshi Fujitani
IPC分类号： G01C9/06 , B05D5/12 , C25F1/00
CPC分类号： G01C9/06 , C25D5/022 , C25D5/12 , G01C9/10 , G01C2009/066
摘要： A tilt sensor includes a light emitting element and two light receiving elements accommodated in a case. The case is formed with an inner space in which a rolling member is provided in a freely movable manner by the pulling force of gravity. A cover plate is fixed to the case to close the inner space. The cover plate is provided with an irregular, inner ceiling surface that is exposed to the inner surface so as to come into sliding contact with the rolling member.
摘要翻译：倾斜传感器包括发光元件和容纳在壳体中的两个光接收元件。壳体形成有内部空间，其中滚动构件以可重力的方式以可自由移动的方式设置。盖板固定在壳体上以封闭内部空间。盖板设置有暴露于内表面以与滚动构件滑动接触的不规则的内部天花板表面。

2. 发明授权

US07950162B2 Tilt sensor and method for making the same 有权
标题翻译：倾斜传感器及其制作方法
公开(公告)号：US07950162B2
公开(公告)日：2011-05-31
申请号：US12605047
申请日：2009-10-23
申请人： Tomoharu Horio , Satoshi Fujitani
发明人： Tomoharu Horio , Satoshi Fujitani
IPC分类号： G01C9/06 , G01C9/10
CPC分类号： G01C9/06 , C25D5/022 , C25D5/12 , G01C9/10 , G01C2009/066
摘要： A tilt sensor includes a light emitting element and two light receiving elements accommodated in a case. The case is formed with an inner space in which a rolling member is provided in a freely movable manner by the pulling force of gravity. A cover plate is fixed to the case to close the inner space. The cover plate is provided with an irregular, inner ceiling surface that is exposed to the inner surface so as to come into sliding contact with the rolling member.
摘要翻译：倾斜传感器包括发光元件和容纳在壳体中的两个光接收元件。壳体形成有内部空间，其中滚动构件以可重力的方式以可自由移动的方式设置。盖板固定在壳体上以封闭内部空间。盖板设置有暴露于内表面以与滚动构件滑动接触的不规则的内部天花板表面。

3. 发明授权

US08089621B2 Tilt sensor 有权
标题翻译：倾斜传感器
公开(公告)号：US08089621B2
公开(公告)日：2012-01-03
申请号：US12696752
申请日：2010-01-29
申请人： Tomoharu Horio
发明人： Tomoharu Horio
IPC分类号： G01C11/26
CPC分类号： G01C9/06 , G01C9/10 , G01C2009/066 , G01C2009/107
摘要： A tilt sensor capable of detecting more diverse orientations is to be provided. The tilt sensor includes a light emitting element and a plurality of photodetectors, a rolling element, and a hollow portion that accommodates the rolling element so as to allow the rolling element to roll in all of x-, y-, and z-direction, and to locate the rolling element, according to a direction of the gravity, at one of detecting positions including a complete blocking position that inhibits light from the light emitting element from reaching any of the photodetectors, a plurality of partial blocking positions that inhibits the light from the light emitting element from reaching at least one but not all of the photodetectors, and a nonblocking position that permits the light from the light emitting element to reach all of the photodetectors, and two of the detecting positions are each located on a respective end portion of the hollow portion in the x-, y-, and z-direction.
摘要翻译：提供能够检测更多不同取向的倾斜传感器。倾斜传感器包括发光元件和多个光电检测器，滚动元件和中空部分，其容纳滚动元件，以允许滚动元件在x，y和z方向上全部滚动，并且根据重力方向将滚动元件定位在包括阻止来自发光元件的光到达任何光电检测器的完全阻挡位置的检测位置之一处，抑制光的多个部分阻挡位置从发光元件到达至少一个但不是全部的光电检测器，以及非阻挡位置，其允许来自发光元件的光到达所有的光电检测器，并且两个检测位置各自位于相应的端中空部分在x，y和z方向上的部分。

4. 发明申请

US20100188654A1 TILT SENSOR 有权
标题翻译：倾斜传感器
公开(公告)号：US20100188654A1
公开(公告)日：2010-07-29
申请号：US12696752
申请日：2010-01-29
申请人： Tomoharu Horio
发明人： Tomoharu Horio
IPC分类号： G01B11/26
CPC分类号： G01C9/06 , G01C9/10 , G01C2009/066 , G01C2009/107
摘要： A tilt sensor capable of detecting more diverse orientations is to be provided. The tilt sensor includes a light emitting element and a plurality of photodetectors, a rolling element, and a hollow portion that accommodates the rolling element so as to allow the rolling element to roll in all of x-, y-, and z-direction, and to locate the rolling element, according to a direction of the gravity, at one of detecting positions including a complete blocking position that inhibits light from the light emitting element from reaching any of the photodetectors, a plurality of partial blocking positions that inhibits the light from the light emitting element from reaching at least one but not all of the photodetectors, and a nonblocking position that permits the light from the light emitting element to reach all of the photodetectors, and two of the detecting positions are each located on a respective end portion of the hollow portion in the x-, y-, and z-direction.
摘要翻译：提供能够检测更多不同取向的倾斜传感器。倾斜传感器包括发光元件和多个光电检测器，滚动元件和中空部分，其容纳滚动元件，以允许滚动元件在x，y和z方向上全部滚动，并且根据重力方向将滚动元件定位在包括阻止来自发光元件的光到达任何光电检测器的完全阻挡位置的检测位置之一处，抑制光的多个部分阻挡位置从发光元件到达至少一个但不是全部的光电检测器，以及非阻挡位置，其允许来自发光元件的光到达所有的光电检测器，并且两个检测位置各自位于相应的端中空部分在x，y和z方向上的部分。

5. 发明申请

US20080315215A1 Semiconductor Module 有权
标题翻译：半导体模块
公开(公告)号：US20080315215A1
公开(公告)日：2008-12-25
申请号：US10584336
申请日：2004-12-20
申请人： Tomoharu Horio , Nobuo Asada
发明人： Tomoharu Horio , Nobuo Asada
IPC分类号： H01L33/00 , H01L31/12 , H01L23/552
CPC分类号： H01L23/552 , H01L24/48 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor module (A1) comprises a semiconductor device (10) provided with a semiconductor chip, and a conductive cover (6) for electromagnetic shielding bonded to the semiconductor device (10) via an adhesive coat (8). The conductive cover (6) includes a surface facing the adhesive coat (8), and the surface is formed with a convex portion (6a) protruding toward the adhesive coat (8). Around the convex portion (6a), a space (7) is formed for filling in adhesive to form the adhesive coat (8).
摘要翻译：半导体模块（A1）包括设置有半导体芯片的半导体器件（10）和经由粘合剂涂层（8）与半导体器件（10）结合的用于电磁屏蔽的导电盖（6）。导电盖（6）包括面向粘合剂涂层（8）的表面，并且该表面形成有朝向粘合剂涂层（8）突出的凸部（6a）。围绕凸部（6a），形成用于填充粘合剂以形成粘合剂涂层（8）的空间（7）。

6. 发明授权

US08053800B2 Reflection-type photointerrupter 有权
标题翻译：反射式光断续器
公开(公告)号：US08053800B2
公开(公告)日：2011-11-08
申请号：US12611347
申请日：2009-11-03
申请人： Tomoharu Horio
发明人： Tomoharu Horio
IPC分类号： H01L31/12 , H01L31/16
CPC分类号： H01L31/167 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A reflection-type photointerrupter of the present invention includes a substrate, a light emitting element and a light receiving element. The substrate includes a first surface, a second surface opposite the first surface, and a first and a second recesses that are open in the first surface side. The light emitting element is arranged in the first recess, while the light receiving element is arranged in the second recess. The light emitting element is capable of emitting light. The light receiving element is capable of receiving the light emitted from the light emitting element and reflected by an object to be detected.
摘要翻译：本发明的反射型光电断路器包括基板，发光元件和受光元件。基板包括第一表面，与第一表面相对的第二表面，以及在第一表面侧开口的第一和第二凹槽。发光元件布置在第一凹部中，而光接收元件布置在第二凹部中。发光元件能够发光。光接收元件能够接收从发光元件发射并被待检测物体反射的光。

7. 发明授权

US07608816B2 Light receiving module incorporating shield cover 有权
标题翻译：光接收模块包含屏蔽罩
公开(公告)号：US07608816B2
公开(公告)日：2009-10-27
申请号：US11973031
申请日：2007-10-05
申请人： Tomoharu Horio , Hironori Daikoku
发明人： Tomoharu Horio , Hironori Daikoku
IPC分类号： H01J40/14 , H01J5/02
CPC分类号： H01L31/0203 , H01L31/02325
摘要： A light receiving module includes a substrate, a light receiving element mounted on the substrate, a resin package covering the light receiving element, and a shield cover into which the resin package is inserted in an insertion direction. The shield cover includes first and second press plates configured to press the resin package in two different directions that are perpendicular to the insertion direction. The first press plate and the second press plate include a first end and a second end, respectively, which are adjacent but different in position in the insertion direction.
摘要翻译：光接收模块包括基板，安装在基板上的光接收元件，覆盖光接收元件的树脂封装以及树脂封装沿插入方向插入的屏蔽盖。屏蔽罩包括构造成在垂直于插入方向的两个不同方向上按压树脂封装件的第一和第二压板。第一压板和第二压板分别包括在插入方向上相邻但不同位置的第一端和第二端。

8. 发明授权

US06625036B1 Infrared data communication module and method of making the same 有权
标题翻译：红外数据通信模块及其制作方法
公开(公告)号：US06625036B1
公开(公告)日：2003-09-23
申请号：US09653268
申请日：2000-08-31
申请人： Tomoharu Horio
发明人： Tomoharu Horio
IPC分类号： H05K702
CPC分类号： H01L24/97 , H01L31/0203 , H01L31/02325 , H01L31/12 , H01L31/18 , H01L2224/48091 , H01L2924/01029 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H05K3/0052 , H05K3/3442 , H05K3/403 , H05K2201/09181 , H05K2201/09954 , H05K2201/10106 , Y02P70/613 , H01L2924/00014 , H01L2924/00
摘要： A method of making an infrared data communication module includes the steps of: forming predetermined wiring patterns on an obverse and a reverse surfaces (10a, 10b) of a substrate (1); mounting, on one of the surfaces of the substrate (1), a group of components including plural sets of light emitting elements (2) and light receiving elements (3); resin-packaging the group of components mounted on the substrate (1); and dividing the resin-packaged components to provide a plurality of infrared data communication modules (4) each of which includes a respective set of light emitting element and light receiving element. The resin-packaging step includes forming a plurality of mutually separated resin packages (4) each of which collectively seals at least two sets of light emitting elements (2) and light receiving elements (3).
摘要翻译：制造红外线数据通信模块的方法包括以下步骤：在基板（1）的正面和反面（10a，10b）上形成预定布线图案; 在所述基板（1）的一个表面上安装包括多组发光元件（2）和光接收元件（3）的一组部件; 树脂封装安装在基板（1）上的组件组; 并且分割树脂封装的部件以提供多个红外线数据通信模块（4），每个红外线数据通信模块包括相应的一组发光元件和光接收元件。树脂封装步骤包括形成多个相互分离的树脂封装（4），它们共同地密封至少两组发光元件（2）和光接收元件（3）。

9. 发明授权

US5877937A Encapsulated semiconductor device and electronic circuit board mounting same 失效
标题翻译：封装半导体器件和电子电路板安装相同
公开(公告)号：US5877937A
公开(公告)日：1999-03-02
申请号：US773699
申请日：1996-12-27
申请人： Kazutaka Shibata , Tomoharu Horio
发明人： Kazutaka Shibata , Tomoharu Horio
IPC分类号： H01L23/28 , H01L23/495 , H01L23/50 , H05K1/02 , H05K1/18 , H05K3/34 , H05K7/20
CPC分类号： H01L23/49568 , H01L24/97 , H05K3/3426 , H01L2224/48247 , H01L2224/49171 , H01L2924/181 , H05K1/0201 , H05K3/3421 , Y02P70/613
摘要： A semiconductor device has a resin package containing a semiconductor chip, lead pins electrically connected to the chip, and a heat radiating plate for transmitting heat of the semiconductor chip to the exterior. The lead pins and the heat radiating plate protrude from a side wall of the resin package. The lead pins each have a planar end part attached by soldering to a wiring pattern on a circuit board. The heat radiating plate has a planar attachment part which is attached by soldering to a heat radiating pattern on the circuit board. The planar attachment part of the heat radiating plate is non-rectangular and is shaped such that when it is attached to a solder-coated area on a heat radiating pattern formed on a circuit board, the melted solder is more effectively prevented from flowing out.
摘要翻译：半导体器件具有包含半导体芯片的树脂封装，与芯片电连接的引线引脚和用于将半导体芯片的热传递到外部的散热板。引导销和散热板从树脂封装的侧壁突出。引脚各自具有通过焊接连接到电路板上的布线图案的平面端部。散热板具有通过焊接附接到电路板上的散热图案的平面安装部。散热板的平面安装部分是非矩形的并且被成形为使得当它被安装到形成在电路板上的散热图案上的焊料涂覆区域时，更有效地防止熔化的焊料流出。

10. 发明授权

US07737369B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US07737369B2
公开(公告)日：2010-06-15
申请号：US10584336
申请日：2004-12-20
申请人： Tomoharu Horio , Nobuo Asada
发明人： Tomoharu Horio , Nobuo Asada
IPC分类号： H05K9/00
CPC分类号： H01L23/552 , H01L24/48 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor module (A1) comprises a semiconductor device (10) provided with a semiconductor chip, and a conductive cover (6) for electromagnetic shielding bonded to the semiconductor device (10) via an adhesive coat (8). The conductive cover (6) includes a surface facing the adhesive coat (8), and the surface is formed with a convex portion (6a) protruding toward the adhesive coat (8). Around the convex portion (6a), a space (7) is formed for filling in adhesive to form the adhesive coat (8).
摘要翻译：半导体模块（A1）包括设置有半导体芯片的半导体器件（10）和经由粘合剂涂层（8）与半导体器件（10）结合的用于电磁屏蔽的导电盖（6）。导电盖（6）包括面向粘合剂涂层（8）的表面，并且该表面形成有朝向粘合剂涂层（8）突出的凸部（6a）。围绕凸部（6a），形成用于填充粘合剂以形成粘合剂涂层（8）的空间（7）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式