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1. 发明授权

US5917149A Flexible circuit board interconnect with strain relief 失效
公开(公告)号：US5917149A
公开(公告)日：1999-06-29
申请号：US856713
申请日：1997-05-15
申请人： Tina Barcley , Norman J. Roth , Vasil Germanski , Edward T. Pokriefka , Robert A. Isola
发明人： Tina Barcley , Norman J. Roth , Vasil Germanski , Edward T. Pokriefka , Robert A. Isola
IPC分类号： H05K1/02 , H05K1/11 , H05K3/34 , H05K3/36 , H05K9/00
CPC分类号： H05K1/118 , H05K1/0281 , H05K3/3452 , H05K3/363 , H05K1/0224 , H05K2201/0715 , H05K2201/09681 , H05K2201/09709 , H05K2201/09909 , H05K2201/10666 , H05K2201/2009 , H05K2203/0195
摘要： A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof. The vias are arranged to be offset from the vias on adjacent conductor strips such that a perforation-type tear line is avoided and such that when a hot bar soldering is used, at least one via remains uncovered for receiving soldering wicking, thus reducing the likelihood of solder bridging across conductor strips.

2. 发明授权

US5924873A Flexible circuit board interconnect with strain relief 失效
公开(公告)号：US5924873A
公开(公告)日：1999-07-20
申请号：US857122
申请日：1997-05-15
申请人： Tina Barcley , Robert A. Isola , Edward T. Pokriefka , Norman J. Roth , Vasil Germanski
发明人： Tina Barcley , Robert A. Isola , Edward T. Pokriefka , Norman J. Roth , Vasil Germanski
IPC分类号： H01R12/62 , H05K1/02 , H05K1/11 , H05K3/28 , H05K3/36 , H05K9/00 , H02R9/09
CPC分类号： H05K9/0039 , H05K1/0224 , H05K1/118 , H05K3/363 , H05K1/0253 , H05K2201/0715 , H05K2201/09481 , H05K2201/09681 , H05K2201/09709 , H05K2201/10666 , H05K2203/0195 , H05K3/281
摘要： A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof. The vias are arranged to be offset from the vias on adjacent conductor strips such that a perforation-type tear line is avoided and such that when a hot bar soldering is used, at least one via remains uncovered for receiving soldering wicking, thus reducing the likelihood of solder bridging across conductor strips.

3. 发明授权

US5981870A Flexible circuit board interconnect with strain relief 失效
标题翻译：柔性电路板与应变消除互连
公开(公告)号：US5981870A
公开(公告)日：1999-11-09
申请号：US857121
申请日：1997-05-15
申请人： Tina Barcley , Robert A. Isola , Edward T. Pokriefka , Norman J. Roth , Vasil Germanski
发明人： Tina Barcley , Robert A. Isola , Edward T. Pokriefka , Norman J. Roth , Vasil Germanski
IPC分类号： H05K1/00 , H05K1/02 , H05K1/11 , H05K3/28 , H05K9/00
CPC分类号： H05K1/028 , H05K1/0224 , H05K1/118 , H05K9/0039 , H05K1/0253 , H05K2201/0715 , H05K2201/09681 , H05K3/28
摘要： A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof. The vias are arranged to be offset from the vias on adjacent conductor strips such that a perforation-type tear line is avoided and such that when a hot bar soldering is used, at least one via remains uncovered for receiving soldering wicking, thus reducing the likelihood of solder bridging across conductor strips.
摘要翻译：柔性电路板互连提供了柔性应变消除功能。柔性电路板互连包括聚酰胺或聚酰亚胺（均为尼龙）衬底层，接地平面层和导体带层。接地平面层沿其相对侧设置有扇形边。接地平面提供屏蔽，用于防止对穿过导体条的信号产生射频干扰。地平面层和导体条至少部分由一对带有扇形边缘的焊接掩模层覆盖。焊接层和接地面上的扇形边缘防止在柔性电路板互连表面产生折痕或折线。每个导体条在其相对端上设置有一对通孔。通孔布置成偏离相邻导体条上的通孔，使得避免穿孔型撕裂线，并且使得当使用热棒焊接时，至少一个通孔保持未覆盖以接收焊接芯吸，从而降低可能性焊接桥接在导体条上。

4. 发明授权

US06477052B1 Multiple layer thin flexible circuit board 有权
标题翻译：多层薄柔性电路板
公开(公告)号：US06477052B1
公开(公告)日：2002-11-05
申请号：US09630221
申请日：2000-08-01
申请人： Tina Barcley
发明人： Tina Barcley
IPC分类号： H05K720
CPC分类号： H05K1/0278 , H05K1/0206 , H05K1/189 , H05K3/0061 , H05K3/341 , H05K3/429 , H05K2201/0281 , H05K2201/09063 , H05K2201/09572 , H05K2201/0969 , H05K2201/10969 , H05K2201/2036 , H05K2203/302
摘要： A printed circuit board, containing thermal pads, is adhered to a rigidizer plate whereupon the entire unit can then be bent over itself to create a compact assembly which can be substantially smaller, but contain the same number of traces and electrical components, as an unbent printed circuit board of the same surface area. Further, a complete housing assembly is formed which is sealed on each edge of the rigidizer by inserting the edge into a panel with a groove. This assembly provides a secure fit that provides great stability with a relatively low weight and volume. The assembly also provides a better RF non-mechanical connection and much better thermal performance.
摘要翻译：包含热垫的印刷电路板被粘附到刚性板上，随后整个单元可以自身弯曲，以形成一个紧凑的组件，其可以显着地更小，但是包含相同数量的迹线和电气部件印刷电路板的表面积相同。此外，通过将边缘插入具有凹槽的面板中，形成完整的壳体组件，其被密封在刚性化器的每个边缘上。该组件提供了具有相对较低重量和体积的极好稳定性的安全配合。该组件还提供更好的RF非机械连接和更好的热性能。

5. 发明申请

US20050063162A1 ELECTRICAL ASSEMBLAGE AND METHOD FOR REMOVING HEAT LOCALLY GENERATED THEREFROM 失效
标题翻译：电气组装和方法，用于去除本地生成的热量
公开(公告)号：US20050063162A1
公开(公告)日：2005-03-24
申请号：US10327839
申请日：2002-12-23
申请人： Tina Barcley
发明人： Tina Barcley
IPC分类号： H05K1/02 , H05K7/20
CPC分类号： H05K7/205 , H05K1/0206 , H05K2201/09572 , H05K2201/0959 , H05K2201/09781
摘要： A densely packed electronic assemblage has a substrate media for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the at least one heat generating component by absorbing heat from the at least one heat generating component.
摘要翻译：密集封装的电子组件具有用于支撑至少一个发热部件的基板介质和用于降低至少一个发热部件的温度的装置。散热器与除热元件配合，用于通过从至少一个发热部件吸收热量来减少至少一个发热部件的热量。

6. 发明申请

US20050284607A1 Cooling-assisted, heat-generating electrical component and method of manufacturing same 审中-公开
标题翻译：冷却辅助发热电气部件及其制造方法
公开(公告)号：US20050284607A1
公开(公告)日：2005-12-29
申请号：US10184290
申请日：2002-06-27
申请人： Tina Barcley
发明人： Tina Barcley
IPC分类号： F28F7/00 , H05K1/02 , H05K1/11 , H05K3/34
CPC分类号： H05K1/113 , H05K1/0206 , H05K1/114 , H05K3/3442 , H05K2201/062 , H05K2201/0969 , H05K2201/09781 , H05K2201/10636 , Y02P70/611
摘要： A cooling-assisted, heat-generating electrical component reduces heat generated during operation. The electrical component, typically a resistor, has a least one heat-removing element electrically associated therewith. Heat-removing element comprises a plurality of thermal vias therein and is fixedly attached to an end portion of the electrical component, typically on opposed end portions. Heat absorbed by the heat-removing element can be transported away from the electrical component during service.
摘要翻译：冷却辅助的发热电气部件减少了操作过程中产生的热量。电气部件（通常为电阻器）具有与其电连接的至少一个除热元件。除热元件在其中包括多个热通孔，并且固定地附接到电气部件的端部，通常在相对的端部上。散热元件吸收的热量可在使用过程中从电气部件运输。

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