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1. 发明授权

US07259548B2 Testing circuits on substrate 有权
标题翻译：测试电路在基板上
公开(公告)号：US07259548B2
公开(公告)日：2007-08-21
申请号：US11033349
申请日：2005-01-07
申请人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
发明人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2893 , G01R31/2867 , G01R31/2887 , G01R31/2891
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译：本发明提供一种测试衬底上电路的方法。一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子从触点脱离，并且将基板从测试卡盘移除。

2. 发明授权

US06771060B1 Testing circuits on substrates 失效
标题翻译：测试基板上的电路
公开(公告)号：US06771060B1
公开(公告)日：2004-08-03
申请号：US10035482
申请日：2001-10-22
申请人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
发明人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
IPC分类号： G01R3126
CPC分类号： G01R31/2868 , G01R31/2851 , G01R31/2887 , G01R31/2893 , G01R31/311
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译：本发明提供一种测试衬底上电路的方法。一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子从触点脱离，并且将基板从测试卡盘移除。

3. 发明授权

US07180284B2 Testing circuits on substrates 失效
标题翻译：在基板上测试电路
公开(公告)号：US07180284B2
公开(公告)日：2007-02-20
申请号：US11244334
申请日：2005-10-04
申请人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
发明人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
IPC分类号： G01R31/26 , G01R31/02
CPC分类号： G01R31/2868 , G01R31/2851 , G01R31/2887 , G01R31/2893 , G01R31/311
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译：本发明提供一种测试衬底上电路的方法。一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子从触点脱离，并且将基板从测试卡盘移除。

4. 发明授权

US06781394B1 Testing circuits on substrate 失效
标题翻译：测试电路在基板上
公开(公告)号：US06781394B1
公开(公告)日：2004-08-24
申请号：US10035457
申请日：2001-10-22
申请人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
发明人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
IPC分类号： G01R3102
CPC分类号： G01R31/01 , G01R31/2886
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译：本发明提供一种测试衬底上电路的方法。一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子从触点脱离，并且将基板从测试卡盘移除。

5. 发明授权

US07453260B2 Testing circuits on substrate 失效
标题翻译：测试电路在基板上
公开(公告)号：US07453260B2
公开(公告)日：2008-11-18
申请号：US11492509
申请日：2006-07-24
申请人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
发明人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2893 , G01R31/2867 , G01R31/2887 , G01R31/2891
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译：本发明提供一种测试衬底上电路的方法。一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子从触点脱离，并且将基板从测试卡盘移除。

6. 发明授权

US07098649B2 Testing circuits on substrates 有权
公开(公告)号：US07098649B2
公开(公告)日：2006-08-29
申请号：US10871630
申请日：2004-06-17
申请人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
发明人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2893 , G01R31/2867 , G01R31/2887 , G01R31/2891
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

7. 发明授权

US07002337B2 Testing circuits on substrates 有权
标题翻译：测试基板上的电路
公开(公告)号：US07002337B2
公开(公告)日：2006-02-21
申请号：US10900899
申请日：2004-07-27
申请人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
发明人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
IPC分类号： G01R31/26
CPC分类号： G01R31/2868 , G01R31/2851 , G01R31/2887 , G01R31/2893 , G01R31/311
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译：本发明提供一种测试衬底上电路的方法。一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子从触点脱离，并且将基板从测试卡盘移除。

8. 发明授权

US06861859B1 Testing circuits on substrates 失效
标题翻译：测试基板上的电路
公开(公告)号：US06861859B1
公开(公告)日：2005-03-01
申请号：US10035508
申请日：2001-10-22
申请人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
发明人： Timothy J. Boyle , Wayne E. Richter , Ladd T. Johnson , Lawrence A. Tom
IPC分类号： G01R31/28 , H01L21/66 , H01L21/677 , G01R31/02 , G01R31/26
CPC分类号： G01R31/2893 , G01R31/2867 , G01R31/2887 , G01R31/2891
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contracts, and the substrate is removed from the test chuck.
摘要翻译：本发明提供一种测试衬底上电路的方法。一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子从合同脱离，并且将基板从测试卡盘移除。

9. 发明授权

US5271787A Method of making and using a label-equipped form 失效
标题翻译：制作和使用标签配套形式的方法
公开(公告)号：US5271787A
公开(公告)日：1993-12-21
申请号：US882433
申请日：1992-05-13
申请人： Donald J. Hoffmann , Wayne E. Richter
发明人： Donald J. Hoffmann , Wayne E. Richter
IPC分类号： G09F3/02 , B32B31/00
CPC分类号： G09F3/02 , G09F2003/0201 , G09F2003/0222 , G09F2003/0226 , G09F2003/0267 , G09F2003/0269 , Y10S283/901 , Y10T156/1052 , Y10T156/1056 , Y10T156/1064 , Y10T156/1082 , Y10T156/17 , Y10T156/171
摘要： A method of making a label-equipped sheet and product wherein the label is die-cut from base stock constituting the sheet and held in place by a pressure-sensitive adhesive-equipped release liner, the web patch constituting the release liner having a pattern of coatings thereon including a first pattern of release material so as to leave an uncoated perimeter and thereafter overcoated with pressure-sensitive adhesive.
摘要翻译：一种制备标签的片材和产品的方法，其中标签从构成片材的基材上冲切并通过带有压敏粘合剂的剥离衬垫保持在适当位置，构成剥离衬垫的网状贴片具有涂层，其上包括第一图案的剥离材料，以便留下未涂覆的周边，然后用压敏粘合剂涂覆。

10. 发明授权

US5591290A Method of making a laminate having variable adhesive properties 失效
标题翻译：制造具有可变粘合性能的层压体的方法
公开(公告)号：US5591290A
公开(公告)日：1997-01-07
申请号：US376742
申请日：1995-01-23
申请人： Peter A. Walter , Wayne E. Richter
发明人： Peter A. Walter , Wayne E. Richter
IPC分类号： C09J7/02 , B32B31/16 , C09J5/00
CPC分类号： C09J7/0232 , C09J7/0207 , C09J2201/28 , C09J2483/005 , Y10T156/1195
摘要： The adhesive bonding strength of a pressure sensitive adhesive on a laminate is selectively modified by applying a discontinuous layer of a non-adhesive material to the pressure sensitive adhesive. Preferably, the laminate is a preformed, label stock, including a label or substrate having a pressure sensitive adhesive on one surface thereof and a release sheet overlying the adhesive. The label is first delaminated from the release sheet to expose the oppositely facing surface of the label and the release sheet. A discontinuous layer of the non-adhesive material is then printed on either the release sheet or the adhesive. The release sheet is relaminated back onto the label to form a modified laminate with new adhesive properties. When the label is then separated from the release layer, the non-adhesive material adheres to the pressure sensitive adhesive to reduce the exposed surface area of the adhesive.
摘要翻译：通过将非粘合材料的不连续层施加到压敏粘合剂上，对层压体上的压敏粘合剂的粘合强度进行选择性地改性。优选地，层压体是预成型的标签原料，包括在其一个表面上具有压敏粘合剂的标签或基材和覆盖粘合剂的剥离片。标签首先从剥离片剥离，露出标签和剥离片的相对面。然后将非粘性材料的不连续层印刷在剥离片或粘合剂上。将剥离片材再次回到标签上以形成具有新粘合剂性质的改性层压材料。当标签然后从剥离层分离时，非粘合材料粘附到压敏粘合剂上以减少粘合剂的暴露表面积。

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