会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Composite center module housing using specifically shaped segments to
form fluid channels
    • 复合中心模块外壳采用特殊形状的部分形成流体通道
    • US5072145A
    • 1991-12-10
    • US577534
    • 1990-09-05
    • Timothy A. DavisDavid A. StarkScott M. ThomsonGary W. WigellDuncan LawrieEugene V. Czerniewski
    • Timothy A. DavisDavid A. StarkScott M. ThomsonGary W. WigellDuncan LawrieEugene V. Czerniewski
    • H02K5/20H02K9/19
    • H02K5/20H02K9/19
    • A generator housing including a housing module having at least one relatively complex internal passage formed therein and housing flow control components for circulating a fluid coolant through the generator. The housing module is formed by forming a plurality of sub-components each having at least one relatively simple passage formed therein for defining part of the at least one relatively complex internal passage. The sub-components are combined together as by bonding to form the housing module with at least one relatively complex internal passage. The flow control components are contained in bores within the housing module in fluid communication with the relatively complex internal passage therein. The housing module if formed of a relatively lightweight, non-metallic material to enable reduction in the weight of the generator housing in cost-effective and technically accepted manner thereby providing an improved generator which can be used in aircraft.
    • 发电机壳体包括具有形成在其中的至少一个相对复杂的内部通道的壳体模块,并且容纳用于使流体冷却剂循环通过发电机的流量控制部件。 壳体模块通过形成多个子部件形成,每个子部件具有形成在其中的至少一个相对简单的通道,用于限定至少一个相对复杂的内部通道的一部分。 这些子部件通过粘接结合在一起,以形成具有至少一个相对复杂的内部通道的壳体模块。 流量控制部件包含在壳体模块内的孔中,与其中相对复杂的内部通道流体连通。 壳体模块如果由相对轻质的非金属材料形成,以便以成本有效和技术上可接受的方式降低发电机壳体的重量,从而提供可在飞行器中使用的改进的发电机。
    • 6. 发明授权
    • Versatile system for conditioning slurry in CMP process
    • 用于CMP工艺中调节浆料的多功能系统
    • US07695589B2
    • 2010-04-13
    • US10897286
    • 2004-07-21
    • David A. StarkLaurence D. SchultzNeal T. Murphy
    • David A. StarkLaurence D. SchultzNeal T. Murphy
    • C23F1/00C09K3/14H01L21/306
    • B24B57/02B24B37/04Y10S134/902
    • The present invention provides a system (100) for conditioning multi-component slurries utilized in chemical mechanical polishing (CMP) of semiconductor wafers (140). The system provides a first slurry component (108), and a second slurry component (120). A conditioning component (102) has first and second inlets, and an outlet operatively coupled to a dispensing system (138). First and second flow control components (116, 126) are operably intercoupled between the first and second inlets and the first and second slurry components, respectively. The system further provides a megasonic energy source (106), adapted to generate an energy field (118) across the conditioning component. A conveyance component (114) conducts the slurry components from the inlets through the energy field, and delivers a final mixture (136) of multi-component slurry to the outlet.
    • 本发明提供一种用于调节在半导体晶片(140)的化学机械抛光(CMP)中使用的多组分浆料的系统(100)。 该系统提供第一浆料组分(108)和第二浆料组分(120)。 调节部件(102)具有第一和第二入口以及可操作地联接到分配系统(138)的出口。 第一和第二流量控制部件(116,126)分别可操作地相互配合在第一和第二入口以及第一和第二浆料组分之间。 该系统进一步提供了一种适于在整个调节部件上产生能量场(118)的兆声波能量源(106)。 输送部件(114)将来自入口的浆料成分导入能量场,并将多组分浆料的最终混合物(136)输送到出口。
    • 7. 发明授权
    • Chemical mechanical polishing system
    • 化学机械抛光系统
    • US07134947B2
    • 2006-11-14
    • US10696623
    • 2003-10-29
    • David A. StarkChristopher Schutte
    • David A. StarkChristopher Schutte
    • B24B7/00B24B1/00
    • B24B37/16B24B57/02
    • According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface adapted to couple a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion encloses an area and has an attachment surface area that is less than the area enclosed by the generally circular center portion. The attachment surface area is adapted to couple an inner portion of the polishing pad to the platen.According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface coupling a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion encloses an area and has an attachment surface area that is less than the area enclosed by the generally circular center portion. The attachment surface area is coupling an inner portion of the polishing pad to the platen.
    • 根据本发明的一个实施例,化学机械抛光系统包括具有适于将抛光垫连接到其上的第一表面的压板。 第一表面包括大致圆形的中心部分和围绕大致圆形中心部分的环形部分。 大致圆形的中心部分包​​围一个区域,并具有小于由大致圆形中心部分包​​围的区域的附着表面积。 附接表面区域适于将抛光垫的内部部分联接到压板。 根据本发明的一个实施例,化学机械抛光系统包括具有将抛光垫连接到其上的第一表面的压板。 第一表面包括大致圆形的中心部分和围绕大致圆形中心部分的环形部分。 大致圆形的中心部分包​​围一个区域,并具有小于由大致圆形中心部分包​​围的区域的附着表面积。 附着表面区域将抛光垫的内部部分联接到压板上。