会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明申请
    • Grinding apparatus and method
    • 研磨设备和方法
    • US20070128983A1
    • 2007-06-07
    • US11548213
    • 2006-10-10
    • Thomas WalshSalman Kassir
    • Thomas WalshSalman Kassir
    • B24B51/00B24B1/00
    • B24B49/16B24B7/22
    • The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of the portion of the face according to a control algorithm. This control algorithm can comprise determining a force applied to the work piece during the removing of the portion of the face, adjusting a feed rate of the first grind spindle when the force applied to the work piece has a predefined relationship with a first threshold level; and dressing a portion of the first grinding portion when the force applied to the work piece has a predefined relationship with a second threshold level that is greater than the first threshold.
    • 本实施例提供了用于研磨诸如晶片的工件的方法,系统和装置。 一些实施例提供了一种方法,其定位研磨主轴以使第一研磨主轴接触工件的表面,去除面部的一部分,并且根据控制算法控制面部的部分的移除。 该控制算法可以包括确定在去除面部的部分期间施加到工件的力,当施加到工件的力具有与第一阈值水平的预定关系时,调节第一研磨主轴的进给速度; 以及当施加到所述工件上的力具有与大于所述第一阈值的第二阈值水平的预定关系时,修整所述第一研磨部的一部分。
    • 9. 发明申请
    • Wafer Carrier Pivot Mechanism
    • 晶圆托架枢轴机构
    • US20070105491A1
    • 2007-05-10
    • US11619088
    • 2007-01-02
    • Thomas WalshWilliam Kalenian
    • Thomas WalshWilliam Kalenian
    • B24B47/02
    • B24B37/30
    • A pivoting wafer carrier having a minimum of internal friction and a smooth, continuous pivoting motion. The pivot mechanism includes a lower ring mounted on a pressure plate, an upper ring mounted on a housing upper plate and ball transfer units disposed on the lower ring. Corresponding bearing wedges depend downwardly from the upper ring. As the pressure plate tilts during the polishing process, the load balls of the ball transfer units roll against the corresponding wedges, thus producing a smooth, continuous pivoting motion. A universal joint may be provided to the carrier to effect the rotation of the carrier and to aid the smooth, continuous pivoting motion of the wafer carrier.
    • 具有最小内摩擦和平滑,连续的枢转运动的枢转晶片载体。 枢转机构包括安装在压板上的下环,安装在壳体上板上的上环和设置在下环上的球传递单元。 相应的轴承楔块从上环向下取向。 当在抛光过程中压板倾斜时,球传送装置的载荷球相对于相应的楔形物滚动,从而产生平滑,连续的旋转运动。 可以向载体提供万向接头以实现载体的旋转并且有助于晶片载体的平滑,连续的枢转运动。