专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06884661B1 Method of fabricating posts over integrated heat sink metallization to enable flip chip packaging of GaAs devices 有权
标题翻译：通过集成散热器金属化制造焊点以实现GaAs器件的倒装芯片封装的方法
公开(公告)号：US06884661B1
公开(公告)日：2005-04-26
申请号：US10701754
申请日：2003-11-04
申请人： Thomas Scott Morris , Milind Shah , Jon Jorgenson
发明人： Thomas Scott Morris , Milind Shah , Jon Jorgenson
IPC分类号： H01L21/60 , H01L23/367 , H01L23/485 , H01L21/48
CPC分类号： H01L24/13 , H01L23/367 , H01L23/3677 , H01L24/11 , H01L2224/05001 , H01L2224/05027 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2924/0001 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/3011 , H01L2924/00014
摘要： The present invention provides for attaching a Gallium Arsenide (GaAs) semiconductor die to a package using bumps formed over a metallic heat sink covering the output transistor area of the semiconductor die. In general, one or more bumps are formed on the metallic heat sink, thereby eliminating stress on the bumps caused by stress risers on the surface of the semiconductor die. In addition, the upper and lower surfaces of the bumps are substantially planar, thereby maximizing contact with the semiconductor die and the package and allowing maximum heat transfer. The planarization is due to the conforming contact surface of the solder. The combination of the bumps and the metallic heat sink provide an efficient way to reduce the thermal and electrical impedance of the die. In one embodiment, the bumps are substantially copper. In another embodiment, the bumps are substantially gold.
摘要翻译：本发明提供了使用覆盖半导体管芯的输出晶体管区域的金属散热器上形成的凸块来将砷化镓（GaAs）半导体管芯附着到封装上。通常，在金属散热器上形成一个或多个凸块，从而消除由半导体管芯的表面上的应力梯度引起的凸点上的应力。此外，凸块的上表面和下表面基本上是平面的，从而使与半导体管芯和封装件的接触最大化并允许最大的热传递。平坦化是由于焊料的一致的接触表面。凸块和金属散热器的组合提供了降低模具的热和电阻抗的有效方式。在一个实施例中，凸块基本上是铜。在另一个实施例中，凸块基本上是金。

2. 发明授权

US07474189B1 Circuit board embedded inductor 有权
标题翻译：电路板嵌入式电感
公开(公告)号：US07474189B1
公开(公告)日：2009-01-06
申请号：US11301039
申请日：2005-12-12
申请人： David Dening , Steve Dorn , Milind Shah , Yang Rao , Michael Kay , Jon Jorgenson
发明人： David Dening , Steve Dorn , Milind Shah , Yang Rao , Michael Kay , Jon Jorgenson
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F2017/002 , H01F2017/048 , H05K1/165 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0187 , H05K2201/0209 , H05K2201/086 , Y10T29/4902
摘要： A circuit board having an embedded inductor and a process for making the circuit board is provided. In general, the process begins by providing a core structure including a dielectric core layer and a first metal layer on a top surface of the dielectric core layer. The first metal layer is etched to form first inductor windings. A material, such as an epoxy material, including magnetic filler material is deposited over the first inductor windings. Thereafter, a prepreg layer is placed over and attached to the material deposited over the first inductor windings to form the circuit board having the embedded inductor.
摘要翻译：提供具有嵌入式电感器的电路板和制造电路板的工艺。通常，该方法开始于在介质芯层的顶表面上提供包括介电芯层和第一金属层的芯结构。第一金属层被蚀刻以形成第一电感器绕组。包括磁性填充材料在内的诸如环氧材料的材料沉积在第一电感器绕组上。此后，将预浸料层放置在沉积在第一电感器绕组上的材料上并附着到形成具有嵌入式电感器的电路板。

3. 发明授权

US06996892B1 Circuit board embedded inductor 有权
公开(公告)号：US06996892B1
公开(公告)日：2006-02-14
申请号：US11089297
申请日：2005-03-24
申请人： David Dening , Steve Dorn , Milind Shah , Yang Rao , Michael Kay , Jon Jorgenson
发明人： David Dening , Steve Dorn , Milind Shah , Yang Rao , Michael Kay , Jon Jorgenson
IPC分类号： H01F7/06
CPC分类号： H01F17/0013 , H01F2017/002 , H01F2017/048 , H05K1/165 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0187 , H05K2201/0209 , H05K2201/086 , Y10T29/4902
摘要： A circuit board having an embedded inductor and a process for making the circuit board is provided. In general, the process begins by providing a core structure including a dielectric core layer and a first metal layer on a top surface of the dielectric core layer. The first metal layer is etched to form first inductor windings. A material, such as an epoxy material, including magnetic filler material is deposited over the first inductor windings. Thereafter, a prepreg layer is placed over and attached to the material deposited over the first inductor windings to form the circuit board having the embedded inductor.

4. 发明申请

US20050176209A1 Embedded passive components 审中-公开
标题翻译：嵌入式无源元件
公开(公告)号：US20050176209A1
公开(公告)日：2005-08-11
申请号：US10366924
申请日：2003-02-14
申请人： Jon Jorgenson , Milind Shah , Victor Steel
发明人： Jon Jorgenson , Milind Shah , Victor Steel
IPC分类号： H05K1/16 , H05K3/46 , H01L21/20 , G06F17/50 , H01L29/00
CPC分类号： H05K1/162 , H05K1/165 , H05K1/167 , H05K3/4652 , H05K2201/0347 , H05K2201/0355 , H05K2201/0959 , H05K2201/09763
摘要： The present invention embeds passive components within a multilayer substrate used for mounting integrated circuits and other electronic components to form an electronic module or circuit board. During construction of the multilayer substrate, passive components are attached to an inside surface of a metallic foil layer. The inside surface of the metallic foil layer is then laminated to another metallic foil layer, such that the foil layers are parallel to but separated from each other. As such, the passive component is embedded within the multilayer substrate. Contacts are formed for the passive component by etching away portions of the foil layer on which the passive component resides. Electrical connections can be routed in the foil to effectively couple the passive component to a circuit formed on the multilayer substrate as desired. The embedded passive components can take various forms, such as capacitors, inductors, and resistors.
摘要翻译：本发明将无源部件嵌入用于安装集成电路和其他电子部件的多层基板中，以形成电子模块或电路板。在多层基板的构造期间，将无源部件附着到金属箔层的内表面。然后将金属箔层的内表面层压到另一金属箔层上，使得箔层彼此平行但分开。因此，被动部件嵌入在多层基板内。通过蚀刻去除被动部件所在的箔层的部分，为无源部件形成触点。电连接可以在箔中布线以有效地将无源部件耦合到根据需要在多层基板上形成的电路。嵌入式无源器件可以采取各种形式，如电容器，电感器和电阻器。

5. 发明授权

US09137934B2 Compartmentalized shielding of selected components 有权
标题翻译：所选组件的隔室屏蔽
公开(公告)号：US09137934B2
公开(公告)日：2015-09-15
申请号：US13189838
申请日：2011-07-25
申请人： Thomas Scott Morris , Ulrik Riis Madsen , Brian D. Sawyer , Milind Shah , John Robert Siomkos , Mark Alan Crandall , Dan Carey
发明人： Thomas Scott Morris , Ulrik Riis Madsen , Brian D. Sawyer , Milind Shah , John Robert Siomkos , Mark Alan Crandall , Dan Carey
IPC分类号： H05K3/30 , H05K9/00 , H05K1/02 , H05K3/28
CPC分类号： H05K9/0024 , H05K1/0218 , H05K3/284 , H05K2201/0715 , H05K2201/09972 , Y10T29/49155
摘要： Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.
摘要翻译：实施例包括用于制造具有第一屏蔽室和第二屏蔽隔室的模块的装置和方法，其中第一屏蔽室与第二屏蔽室电隔离。控制电导率的方式是使屏蔽电路之间的电流流动被引导以减少或消除能量耦合在同一模块上的一个或多个屏蔽隔间之间。每个模块可以具有多个单独的屏蔽隔室，其中每个隔间具有专用的接地平面。每个隔间的护罩可以连接到隔间的专用接地平面。由于专用接地层并未连接在一起，模块上的每个屏蔽隔间都与模块上所有其他屏蔽隔离隔离。在具有多个屏蔽隔室的一些实施例中，根据模块的设计需要，存在至少一个隔离隔离室。

6. 发明授权

US08434220B2 Heat sink formed with conformal shield 有权
标题翻译：散热片用保形罩形成
公开(公告)号：US08434220B2
公开(公告)日：2013-05-07
申请号：US11952617
申请日：2007-12-07
申请人： Jayanti Jaganatha Rao , Thomas Scott Morris , Milind Shah
发明人： Jayanti Jaganatha Rao , Thomas Scott Morris , Milind Shah
IPC分类号： H05K3/20 , H05K3/30 , H05K3/34
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个组分区域的金属结构的至少一部分暴露于身体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

7. 发明授权

US08415567B1 Forming soldering surfaces without requiring a solder mask 有权
标题翻译：形成焊接面，无需焊接面
公开(公告)号：US08415567B1
公开(公告)日：2013-04-09
申请号：US12700512
申请日：2010-02-04
申请人： Brian D. Sawyer , Thomas Scott Morris , Milind Shah
发明人： Brian D. Sawyer , Thomas Scott Morris , Milind Shah
IPC分类号： H05K1/16 , H05K3/34
CPC分类号： H05K3/3452 , H05K3/22 , H05K3/244 , H05K2203/0315 , H05K2203/1173 , Y10T29/49144
摘要： The present invention relates to a multi-layer laminate or substrate manufacturing process for forming soldering surfaces on a substrate of a module without requiring a solder mask. In one embodiment, a substrate is provided having a substrate body, soldering pads, and a metal segment. A patterned mask is formed over the substrate such that soldering surfaces of the soldering pads remain exposed. The soldering surfaces of the soldering pads are plated to create plated soldering surfaces over the soldering pads. The plated soldering surfaces are the regions for solder placement. The patterned mask is then removed from the substrate. Next, an anti-wetting treatment is applied to the substrate such that any unplated metal surfaces react to the anti-wetting treatment to form treated surfaces. As such, the plated soldering surfaces will wet solder while the treated surface will not wet solder. In a preferred embodiment, the anti-wetting treatment is an oxidation process.
摘要翻译：本发明涉及在不需要焊接掩模的情况下在模块的基板上形成焊接表面的多层叠层或基板制造工艺。在一个实施例中，提供了具有基板主体，焊盘和金属部分的基板。在衬底上形成图案化掩模，使得焊盘的焊接表面保持暴露。焊盘的焊接表面进行电镀，以在焊盘上形成电镀焊接表面。电镀焊接表面是用于焊料放置的区域。然后将图案化的掩模从基底上除去。接下来，将抗潮湿处理施加到基底上，使得任何未镀覆的金属表面与抗潮湿处理反应以形成经处理的表面。因此，电镀焊接表面将湿焊料，而处理过的表面不会湿焊料。在优选的实施方案中，抗潮湿处理是氧化过程。

8. 发明授权

US08296941B2 Conformal shielding employing segment buildup 有权
标题翻译：使用段积累的保形屏蔽
公开(公告)号：US08296941B2
公开(公告)日：2012-10-30
申请号：US13117284
申请日：2011-05-27
申请人： David J. Hiner , Waite R. Warren, Jr. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
发明人： David J. Hiner , Waite R. Warren, Jr. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
IPC分类号： H01L24/97 , H01L23/552 , H05K3/30
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

9. 发明申请

US20120044653A1 COMPARTMENTALIZED SHIELDING OF SELECTED COMPONENTS 有权
标题翻译：选择组件的隔离屏蔽
公开(公告)号：US20120044653A1
公开(公告)日：2012-02-23
申请号：US13189838
申请日：2011-07-25
申请人： Thomas Scott Morris , Ulrik Riis Madsen , Brian D. Sawyer , Milind Shah , John Robert Siomkos , Mark Alan Crandall , Dan Carey
发明人： Thomas Scott Morris , Ulrik Riis Madsen , Brian D. Sawyer , Milind Shah , John Robert Siomkos , Mark Alan Crandall , Dan Carey
IPC分类号： H05K7/00 , H05K13/00
CPC分类号： H05K9/0024 , H05K1/0218 , H05K3/284 , H05K2201/0715 , H05K2201/09972 , Y10T29/49155
摘要： Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.
摘要翻译：实施例包括用于制造具有第一屏蔽室和第二屏蔽隔室的模块的装置和方法，其中第一屏蔽室与第二屏蔽室电隔离。控制电导率的方式是使屏蔽电路之间的电流流动被引导以减少或消除能量耦合在同一模块上的一个或多个屏蔽隔间之间。每个模块可以具有多个单独的屏蔽隔室，其中每个隔间具有专用的接地平面。每个隔间的护罩可以连接到隔间的专用接地平面。由于专用接地层并未连接在一起，模块上的每个屏蔽隔间都与模块上所有其他屏蔽隔离隔离。在具有多个屏蔽隔室的一些实施例中，根据模块的设计需要，存在至少一个隔离隔离室。

10. 发明申请

US20110225803A1 CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP 有权
标题翻译：符合条件的建筑施工
公开(公告)号：US20110225803A1
公开(公告)日：2011-09-22
申请号：US13117284
申请日：2011-05-27
申请人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
发明人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
IPC分类号： H05K13/00
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似的操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式