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1. 发明授权

US07474189B1 Circuit board embedded inductor 有权
标题翻译：电路板嵌入式电感
公开(公告)号：US07474189B1
公开(公告)日：2009-01-06
申请号：US11301039
申请日：2005-12-12
申请人： David Dening , Steve Dorn , Milind Shah , Yang Rao , Michael Kay , Jon Jorgenson
发明人： David Dening , Steve Dorn , Milind Shah , Yang Rao , Michael Kay , Jon Jorgenson
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F2017/002 , H01F2017/048 , H05K1/165 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0187 , H05K2201/0209 , H05K2201/086 , Y10T29/4902
摘要： A circuit board having an embedded inductor and a process for making the circuit board is provided. In general, the process begins by providing a core structure including a dielectric core layer and a first metal layer on a top surface of the dielectric core layer. The first metal layer is etched to form first inductor windings. A material, such as an epoxy material, including magnetic filler material is deposited over the first inductor windings. Thereafter, a prepreg layer is placed over and attached to the material deposited over the first inductor windings to form the circuit board having the embedded inductor.
摘要翻译：提供具有嵌入式电感器的电路板和制造电路板的工艺。通常，该方法开始于在介质芯层的顶表面上提供包括介电芯层和第一金属层的芯结构。第一金属层被蚀刻以形成第一电感器绕组。包括磁性填充材料在内的诸如环氧材料的材料沉积在第一电感器绕组上。此后，将预浸料层放置在沉积在第一电感器绕组上的材料上并附着到形成具有嵌入式电感器的电路板。

2. 发明授权

US06996892B1 Circuit board embedded inductor 有权
公开(公告)号：US06996892B1
公开(公告)日：2006-02-14
申请号：US11089297
申请日：2005-03-24
申请人： David Dening , Steve Dorn , Milind Shah , Yang Rao , Michael Kay , Jon Jorgenson
发明人： David Dening , Steve Dorn , Milind Shah , Yang Rao , Michael Kay , Jon Jorgenson
IPC分类号： H01F7/06
CPC分类号： H01F17/0013 , H01F2017/002 , H01F2017/048 , H05K1/165 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0187 , H05K2201/0209 , H05K2201/086 , Y10T29/4902
摘要： A circuit board having an embedded inductor and a process for making the circuit board is provided. In general, the process begins by providing a core structure including a dielectric core layer and a first metal layer on a top surface of the dielectric core layer. The first metal layer is etched to form first inductor windings. A material, such as an epoxy material, including magnetic filler material is deposited over the first inductor windings. Thereafter, a prepreg layer is placed over and attached to the material deposited over the first inductor windings to form the circuit board having the embedded inductor.

3. 发明申请

US20130341398A1 FINGER SENSING DEVICE INCLUDING FINGER SENSING INTEGRATED CIRCUIT DIE WITHIN A RECESS IN A MOUNTING SUBSTRATE AND RELATED METHODS 有权
标题翻译：手指传感装置，包括安装在安装基板中的手指感应集成电路和相关方法
公开(公告)号：US20130341398A1
公开(公告)日：2013-12-26
申请号：US13529170
申请日：2012-06-21
申请人： Yang Rao
发明人： Yang Rao
IPC分类号： G06K7/01 , H01L21/02
CPC分类号： G06K9/0002
摘要： A finger sensing device may include a mounting substrate having a recess in a top surface thereof and having conductive through-vias extending from the top surface to a bottom surface. The conductive through-vias may extend laterally adjacent to the recess. The finger sensing device may also include a finger sensing integrated circuit (IC) die within the recess and may include a finger sensing area on a top surface thereof and bond pads on the top surface laterally adjacent the finger sensing area. The finger sensing device may also include a dielectric layer over the mounting substrate and the finger sensing IC die. The finger sensing device may further include a conductive pattern carried by the dielectric layer and coupling the conductive through-vias to respective ones of the bond pads.
摘要翻译：手指感测装置可以包括在其顶表面中具有凹部并具有从顶表面延伸到底表面的导电通孔的安装基板。导电通孔可以相对于凹部横向延伸。手指感测装置还可以包括在凹部内的手指感测集成电路（IC）芯片，并且可以在其顶表面上包括手指感测区域，并且在顶表面上的与手指感测区域横向相邻的接合焊盘。手指感测装置还可以包括在安装基板上的电介质层和手指感测IC芯片。手指感测装置还可以包括由电介质层承载的导电图案，并将导电通孔耦合到相应的接合焊盘。

4. 发明申请

US20070086634A1 FINGER SENSOR INCLUDING ENHANCED ESD PROTECTION AND ASSOCIATED METHODS 有权
标题翻译：指尖传感器，包括增强的ESD保护和相关方法
公开(公告)号：US20070086634A1
公开(公告)日：2007-04-19
申请号：US11550690
申请日：2006-10-18
申请人： Dale Setlak , Matthew Salatino , Philip Spletter , Yang Rao
发明人： Dale Setlak , Matthew Salatino , Philip Spletter , Yang Rao
IPC分类号： G06K9/00
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. More particularly, the flexible circuit may include a flexible layer, and at least one conductive trace carried thereby and coupled to the at least one bond pad. The sensor may also include at least one Electrostatic Discharge (ESD) electrode carried by the flexible layer. The ESD electrode may be positioned adjacent a beveled edge, for example, of an IC carrier and thereby exposed through a small gap between an adjacent portion of a frame.
摘要翻译：手指传感器可以包括手指感测集成电路（IC），其具有手指感测区域和与其相邻的至少一个接合垫，以及耦合到IC手指传感器的柔性电路。更具体地，柔性电路可以包括柔性层，以及由此承载的至少一个导电迹线并耦合到至少一个接合焊盘。传感器还可以包括由柔性层承载的至少一个静电放电（ESD）电极。 ESD电极可以位于例如IC载体的倾斜边缘附近，并且由此暴露在框架的相邻部分之间的小间隙。

5. 发明授权

US08085998B2 Finger sensor including enhanced ESD protection and associated methods 有权
标题翻译：手指传感器包括增强型ESD保护及相关方法
公开(公告)号：US08085998B2
公开(公告)日：2011-12-27
申请号：US11550690
申请日：2006-10-18
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： G06K9/00
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. More particularly, the flexible circuit may include a flexible layer, and at least one conductive trace carried thereby and coupled to the at least one bond pad. The sensor may also include at least one Electrostatic Discharge (ESD) electrode carried by the flexible layer. The ESD electrode may be positioned adjacent a beveled edge, for example, of an IC carrier and thereby exposed through a small gap between an adjacent portion of a frame.
摘要翻译：手指传感器可以包括手指感测集成电路（IC），其具有手指感测区域和与其相邻的至少一个接合垫，以及耦合到IC手指传感器的柔性电路。更具体地，柔性电路可以包括柔性层，以及由此承载的至少一个导电迹线并耦合到至少一个接合焊盘。传感器还可以包括由柔性层承载的至少一个静电放电（ESD）电极。 ESD电极可以位于例如IC载体的倾斜边缘附近，并且由此暴露在框架的相邻部分之间的小间隙。

6. 发明授权

US08616451B1 Finger sensing device including finger sensing integrated circuit die within a recess in a mounting substrate and related methods 有权
标题翻译：手指感测装置包括手指感测集成电路模具在安装衬底的凹槽内和相关方法
公开(公告)号：US08616451B1
公开(公告)日：2013-12-31
申请号：US13529170
申请日：2012-06-21
申请人： Yang Rao
发明人： Yang Rao
IPC分类号： G06K7/00
CPC分类号： G06K9/0002
摘要： A finger sensing device may include a mounting substrate having a recess in a top surface thereof and having conductive through-vias extending from the top surface to a bottom surface. The conductive through-vias may extend laterally adjacent to the recess. The finger sensing device may also include a finger sensing integrated circuit (IC) die within the recess and may include a finger sensing area on a top surface thereof and bond pads on the top surface laterally adjacent the finger sensing area. The finger sensing device may also include a dielectric layer over the mounting substrate and the finger sensing IC die. The finger sensing device may further include a conductive pattern carried by the dielectric layer and coupling the conductive through-vias to respective ones of the bond pads.
摘要翻译：手指感测装置可以包括在其顶表面中具有凹部并具有从顶表面延伸到底表面的导电通孔的安装基板。导电通孔可以相对于凹部横向延伸。手指感测装置还可以包括在凹部内的手指感测集成电路（IC）芯片，并且可以在其顶表面上包括手指感测区域，并且在顶表面上的与手指感测区域横向相邻的接合焊盘。手指感测装置还可以包括在安装基板上的电介质层和手指感测IC芯片。手指感测装置还可以包括由电介质层承载的导电图案，并将导电通孔耦合到相应的键合焊盘。

7. 发明申请

US20120112764A1 METHOD OF MAKING A FINGER SENSOR PACKAGE AND ASSOCIATED DEVICES 有权
标题翻译：制造手指传感器包装和相关装置的方法
公开(公告)号：US20120112764A1
公开(公告)日：2012-05-10
申请号：US12940555
申请日：2010-11-05
申请人： Michael P. Goldenberg , Roger Schenk , Phil Spletter , Yang Rao
发明人： Michael P. Goldenberg , Roger Schenk , Phil Spletter , Yang Rao
IPC分类号： G01R27/04 , H01L21/50
CPC分类号： H01L23/24 , H01L21/56 , H01L2924/0002 , H01L2924/00
摘要： A method of making finger sensor packages may include advancing a flexible circuit tape along a predetermined path of travel. The flexible circuit tape may include a flexible layer and conductive traces thereon defining individual flexible circuits. The method may include, as the flexible circuit tape is advanced along the path of travel, securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define finger sensor packages, and stamping out the finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.
摘要翻译：制造手指传感器封装的方法可以包括沿着预定行进路径推进柔性电路带。柔性电路带可以包括柔性层及其上的导电迹线，限定各个柔性电路。该方法可以包括，随着柔性电路带沿着行进路径前进，将相应的手指感测集成电路（IC）和周围的传感器封装框架固定到每个柔性电路，在每个手指传感器IC附近施加至少一个流体填充材料同时使用相应的传感器封装框架作为大坝，从而限定手指传感器封装，并且从柔性电路带压出手指传感器封装以形成每个传感器封装框架和单独的柔性电路的至少一个齐平公共边缘。

8. 发明授权

US07894643B2 Finger sensor including flexible circuit and associated methods 有权
标题翻译：手指传感器包括灵活电路及相关方法
公开(公告)号：US07894643B2
公开(公告)日：2011-02-22
申请号：US11550669
申请日：2006-10-18
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： G06K9/00 , G01R27/26
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. The flexible circuit may include a flexible layer covering both the finger sensing area and the at least one bond pad, and at least one conductive trace carried by the flexible layer and coupled to the at least one bond pad. The flexible layer may permit finger sensing therethrough. The flexible circuit may include at least one connector portion extending beyond the finger sensing area and the at least one bond pad. For example, the connector portion may include a tab connector portion and/or a ball grid array connector portion. A fill material, such as an epoxy, may be provided between the IC finger sensor and the flexible circuit.
摘要翻译：手指传感器可以包括手指感测集成电路（IC），其具有手指感测区域和与其相邻的至少一个接合垫，以及耦合到IC手指传感器的柔性电路。柔性电路可以包括覆盖手指感测区域和至少一个接合焊盘的柔性层以及由柔性层承载并耦合到至少一个接合焊盘的至少一个导电迹线。柔性层可以允许通过其中的手指感测。柔性电路可以包括延伸超过手指感测区域和至少一个接合焊盘的至少一个连接器部分。例如，连接器部分可以包括突片连接器部分和/或球栅阵列连接器部分。可以在IC手指传感器和柔性电路之间设置填充材料，例如环氧树脂。

9. 发明申请

US20090003664A1 FINGER SENSING WITH ENHANCED MOUNTING AND ASSOCIATED METHODS 有权
标题翻译：手指感知与增强安装和相关方法
公开(公告)号：US20090003664A1
公开(公告)日：2009-01-01
申请号：US12206183
申请日：2008-09-08
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： G06K9/00
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area, an IC carrier having a cavity receiving the finger sensing IC therein and having at least one beveled upper edge, and a frame surrounding at least a portion of an upper perimeter of the IC carrier and having at least one inclined surface corresponding to the at least one beveled upper edge of the IC carrier. The finger sensor may also include a biasing member for biasing the IC carrier into alignment within the frame. The biasing member may include at least one resilient body for biasing the IC carrier upward within the frame. In other embodiments, the finger sensor may include an IC carrier having a cavity receiving the finger sensing IC therein and having at least one laterally extending projection. The frame may surround at least a portion of an upper perimeter of the IC carrier and have at least one shoulder cooperating with the at least one laterally extending projection of the IC carrier to define at least one upward stop.
摘要翻译：手指传感器可以包括具有手指感测区域的手指感测集成电路（IC），具有在其中容纳手指感测IC的空腔的IC载体，并且具有至少一个倾斜的上边缘，以及围绕至少一部分 IC载体的上周边具有与IC载体的至少一个倾斜的上边缘对应的至少一个倾斜表面。手指传感器还可以包括用于将IC载体偏置在框架内对准的偏置构件。偏置构件可以包括用于在框架内向上偏压IC载体的至少一个弹性体。在其他实施例中，手指传感器可以包括具有在其中接收手指感测IC的空腔的IC载体，并具有至少一个横向延伸的突起。所述框架可围绕所述IC载体的上周边的至少一部分，并且具有与所述IC载体的所述至少一个侧向延伸突起配合的至少一个肩部，以限定至少一个向上止动件。

10. 发明授权

US06864306B2 High dielectric polymer composites and methods of preparation thereof 有权
标题翻译：高介电聚合物复合材料及其制备方法
公开(公告)号：US06864306B2
公开(公告)日：2005-03-08
申请号：US10135744
申请日：2002-04-30
申请人： Yang Rao , Ching-Ping Wong , Jianwen Xu
发明人： Yang Rao , Ching-Ping Wong , Jianwen Xu
IPC分类号： C08K3/04 , C08K3/08 , C08K7/06 , H05K1/16 , C08J3/00 , C08K5/04 , C08K5/09 , C08L75/00 , C08L83/00
CPC分类号： C08K7/06 , C08K3/04 , C08K3/08 , H05K1/162 , H05K2201/0209 , H05K2201/0215 , H05K2201/0323 , H05K2201/09309
摘要： Polymer composites and methods of making the polymer composites are presented. A representative polymer composite includes a polymer resin and a conductive material, wherein the polymer composite is characterized by a dielectric constant greater the 200. A representative method of making the polymer composite can be broadly summarized by the following steps: providing a polymer resin and a conductive material; mixing the polymer resin and the conductive material; and forming the polymer composite, wherein the polymer composite is characterized by a dielectric constant greater than 200.
摘要翻译：提出了聚合物复合材料和制备聚合物复合材料的方法。代表性的聚合物复合材料包括聚合物树脂和导电材料，其中聚合物复合材料的特征在于介电常数大于200.制备聚合物复合材料的代表性方法可以通过以下步骤大致概括：提供聚合物树脂和导电材料; 混合聚合物树脂和导电材料; 以及形成所述聚合物复合材料，其中所述聚合物复合材料的特征在于介电常数大于200。

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