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    • 8. 发明授权
    • DRAM cell circuit
    • DRAM单元电路
    • US06362502B1
    • 2002-03-26
    • US09692118
    • 2000-10-19
    • Wolfgang RösnerThomas SchulzLothar RischFranz Hofmann
    • Wolfgang RösnerThomas SchulzLothar RischFranz Hofmann
    • H01L27108
    • H01L27/1203H01L27/108H01L27/10876
    • A memory cell contains a memory transistor and a transfer transistor. A gate electrode of the transfer transistor and a control gate electrode of the memory transistor are connected to a word line. The memory transistor has a floating gate electrode that is isolated from a channel region of the memory transistor by a first dielectric layer and is connected to a first source/drain region of the transfer transistor. The control gate electrode is isolated from the floating gate electrode by a second dielectric layer. A first source/drain region of the memory transistor is connected to a bit line. The memory and transfer transistors are preferably of different conductivity types. During the writing of information, the transfer transistor is in the on-state and the memory transistor is in the off-state. During the reading-out of information, the transfer transistor is in the off-state and the memory transistor is in the on-state.
    • 存储单元包含存储晶体管和转移晶体管。 转移晶体管的栅电极和存储晶体管的控制栅电极连接到字线。 存储晶体管具有通过第一介电层与存储晶体管的沟道区隔离并与转移晶体管的第一源极/漏极区连接的浮栅电极。 控制栅电极通过第二电介质层与浮置栅电极隔离。 存储晶体管的第一源/漏区连接到位线。 存储器和转移晶体管优选地具有不同的导电类型。 在写入信息期间,传输晶体管处于导通状态,并且存储晶体管处于截止状态。 在读出信息期间,传输晶体管处于截止状态,并且存储晶体管处于导通状态。
    • 9. 发明授权
    • Method of producing a vertical MOS transistor
    • 制造垂直MOS晶体管的方法
    • US06337247B1
    • 2002-01-08
    • US09487411
    • 2000-01-18
    • Thomas SchulzThomas ÄugleWolfgang RösnerLothar Risch
    • Thomas SchulzThomas ÄugleWolfgang RösnerLothar Risch
    • H01L21336
    • H01L29/66666H01L29/7827H01L29/7834
    • A spacer is used as a mask in an etching step during which a layer structure is produced for a channel layer and for a first source/drain region. After the layer structure has been produced, the first source/drain region and a second source/drain region can be produced by implantation. The second source/drain region is self-aligned on two mutually opposite flanks of the layer structure. A gate electrode can be produced in the form of a spacer on the two flanks. In order to avoid a capacitance formed by a first contact of the gate electrode and the first source/drain region, a part of the first source/drain region may be removed. If the layer structure is produced along edges of an inner area, then a third contact of the second source/drain region may be produced inside the inner area in order to reduce the surface area of the transistor.
    • 在蚀刻步骤中使用间隔物作为掩模,在该步骤中,为沟道层和第一源极/漏极区域产生层结构。 在生成层结构之后,可以通过注入产生第一源极/漏极区域和第二源极/漏极区域。 第二源极/漏极区域在层结构的两个相互相对的侧面上自对准。 可以在两个侧面上以间隔物的形式制造栅电极。 为了避免由栅极电极和第一源极/漏极区域的第一接触形成的电容,可以去除第一源极/漏极区域的一部分。 如果沿着内部区域的边缘产生层结构,则可以在内部区域内产生第二源极/漏极区域的第三接触,以便减小晶体管的表面积。