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1. 发明授权

US5780925A Lead frame package for electronic devices 失效
标题翻译：电子设备引线框架封装
公开(公告)号：US5780925A
公开(公告)日：1998-07-14
申请号：US569561
申请日：1995-12-08
申请人： Thomas Mario Cipolla , Paul William Coteus
发明人： Thomas Mario Cipolla , Paul William Coteus
IPC分类号： H01L21/60 , H01L23/495 , H01L23/50 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/06 , H01L23/49503 , H01L23/4951 , H01L23/49541 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2225/06562 , H01L2924/00014 , H01L2924/01014 , H01L2924/01031 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15183 , H01L2924/15787 , H01L2924/181 , H01L2924/30107
摘要： An electronic device packaging structure is described which contains a lead frame on which the electronic device is disposed. The electronic device has contact locations at one edge thereof. The lead frame has leads which extend under the electronic device and inwardly from the opposite direction. Wires are wire bonded between electronic device contact locations and the beam leads which extend under the electronic device and the ends of the leads which extend inwardly from the opposite direction. Two electronic devices are stacked in at an offset with respect to each to expose contact locations on the surface of each electronic device at an edge of each electronic device to form a stepped surface exposing a plurality of electronic device contact locations. Preferably, the chips are identical and rotated 180.degree. with respect to each other. Some of the leads of the lead frame for the double dense memory extend continuously under the stack to provide signal inputs through bit, address, control, power and ground inputs to the electronic devices. These inputs are common between the adjacent chips. Wires are bonded from contact locations on each chip to common leads. If a lead is common and cannot be mixed with another common lead, for example, a control line, it is located at the center of the lead frame. Other leads are provided which are not common between the two chips, for example chip select lines. Wires are bonded between the contact locations on each chip and at least one of the common leads of the lead frame.
摘要翻译：描述了一种电子设备包装结构，其包含设置电子设备的引线框架。电子设备在其一个边缘处具有接触位置。引线框架具有在电子设备下方延伸并且从相反方向向内延伸的引线。导线在电子器件接触位置之间被引线接合，并且在电子器件下面延伸的光束引线和从相反方向向内延伸的引线的端部。两个电子器件相对于每个电子器件以偏移方式堆叠以暴露每个电子器件的边缘处的每个电子器件的表面上的接触位置，以形成露出多个电子器件接触位置的台阶表面。优选地，芯片相同并相对于彼此旋转180度。双密度存储器的引线框架的一些引线在堆叠下连续延伸，以通过位，地址，控制，电源和接地输入向电子设备提供信号输入。这些输入在相邻芯片之间是共同的。电线从每个芯片上的接触位置连接到公共导线。如果引线是常见的，并且不能与另一个公共引线（例如，控制线）混合，则它位于引线框架的中心。提供了在两个芯片之间不常见的其它引线，例如芯片选择线。电线结合在每个芯片上的接触位置和引线框架的至少一个公共引线之间。

2. 发明授权

US5688147A Interchangeable key card edge connecting 失效
标题翻译：可互换的钥匙卡边缘连接
公开(公告)号：US5688147A
公开(公告)日：1997-11-18
申请号：US760728
申请日：1996-12-05
申请人： Paul William Coteus , Thomas Mario Cipolla
发明人： Paul William Coteus , Thomas Mario Cipolla
IPC分类号： H01S3/08 , B01D53/28 , B01J20/18 , H01L33/48 , H01M2/04 , H01M2/12 , H01R12/70 , H01R12/72 , H01R13/645 , H01S3/02 , H01S3/03 , H01S3/06 , H01S3/094 , H01S3/14 , H01S5/022 , H05K7/10 , H01R13/64
CPC分类号： H01R12/7005 , H01L33/483 , H01R12/721 , H01R13/645 , H01S5/02204 , H01S5/02284
摘要： A system of using a rotatable key in the insertion of a conductor bearing card edge into a slotted supporting connector to accommodate a large number of different cards. A rotatable key opening in the slot face of the slotted supporting connector together with a specific card feature accommodating key positioned in the opening are arranged so that the key can be in one of several positions controlled by the opening with the shape of the key providing an interruption to the continuity of the slot at different distances along the slot length. The card has at least one notch in the insertion edge positioned to be at the slot interruption distance for the particular position of the key. A large number of unique distances are achievable with a single key part.
摘要翻译：一种在将导体轴承卡缘插入开槽支撑连接器以容纳大量不同卡片时使用可旋转键的系统。开槽支撑连接器的槽面中的可旋转的键开口与位于开口中的特定的卡特征容纳键一起被布置成使得钥匙可以处于由开口控制的几个位置之一，其中钥匙的形状提供一个中断插槽长度沿不同距离的连续性。该卡在插入边缘中具有至少一个凹口，其被定位成处于键的特定位置处的狭槽中断距离处。单个关键部件可实现大量独特的距离。

3. 发明授权

US06919515B2 Stress accommodation in electronic device interconnect technology for millimeter contact locations 有权
标题翻译：用于毫米接触位置的电子设备互连技术中的应力调节
公开(公告)号：US06919515B2
公开(公告)日：2005-07-19
申请号：US09768372
申请日：2001-01-23
申请人： Edmund David Blackshear , Thomas Mario Cipolla , Paul William Coteus
发明人： Edmund David Blackshear , Thomas Mario Cipolla , Paul William Coteus
IPC分类号： H05K3/12 , H05K3/34 , H05K1/16
CPC分类号： H05K3/3436 , H01L2224/0401 , H01L2224/05555 , H01L2224/13014 , H05K3/1216 , H05K3/3484 , H05K2201/09381 , Y02P70/613 , H01L2924/00012 , H01L2924/00014
摘要： The providing of an array interface of conductive joint members for use in forming interconnections between mating surfaces such as a pad on a surface mount electronic device and contacts on a circuit card where one portion of the conductive joint members are of a relatively elongated or oval outline and are oriented with the longer dimension in one direction to accommodate wiring spacing and another portion oriented in a different direction for accommodating expansion stress. In manufacturing when the relatively elongated shape is oriented with the longer dimension along the wiping motion direction in a screen type forming of the conductive joint members the slurry of material that is to be the conductive joint members fills the openings in the screen more reliably and the areas of the conductive members are more uniform. The invention provides the advantages of an increase in the number of wiring lines, an increase in uniformity of wiped screen deposition conductive joint member formation, ability to employ more than one out of chip and wiring levels in expansion mismatch stress relief, and ability by conductive joint member dimensional alignment to improve reliability and flexibility.
摘要翻译：提供用于在配合表面之间形成互连的导电接头构件的阵列接口，例如表面安装电子设备上的焊盘和电路卡上的触点，其中导电接头构件的一部分具有相对细长或椭圆形的轮廓并且在一个方向上具有更长的尺寸以适应布线间距，并且另一部分沿不同的方向定向以适应膨胀应力。在制造中，当形成导电接头部件的筛网形式中相对细长的形状沿着擦拭运动方向具有更长的尺寸时，作为导电接头部件的材料的浆料更可靠地填充筛网中的开口，并且导电构件的区域更均匀。本发明提供了布线数量增加，擦拭屏幕沉积导电接头构件形成的均匀性增加的优点，在扩展失配应力消除中使用多于一个芯片和布线水平的能力以及导电性能联合构件尺寸对齐以提高可靠性和灵活性。

4. 发明授权

US5771559A Removable heat sink assembly process for a chip package 失效
标题翻译：用于芯片封装的可移动散热器组装过程
公开(公告)号：US5771559A
公开(公告)日：1998-06-30
申请号：US642251
申请日：1996-05-02
申请人： Thomas Mario Cipolla , Paul William Coteus
发明人： Thomas Mario Cipolla , Paul William Coteus
IPC分类号： H01L23/367 , H01L23/40 , B23P11/02
CPC分类号： H01L23/40 , H01L23/3677 , H01L23/4093 , H01L2924/0002 , Y10S411/907 , Y10T24/309 , Y10T24/42 , Y10T29/49876
摘要： The process of the invention employs a post type fastening member that provides, at one end, an insertion friction connection to the circuit card and at the other end, extending through the heat sink, a compression spring means that urges the heat sink toward the cirduit card. A plurality of the post type fasteners are positioned around the periphery of the chip package to retain the heat sink parallel to the circuit card and compressing the chip package. The packaging structure of the invention permits larger area heat sinks than the chip package area to be supported by the circuit card with the only relationship with the chip being that of a compression thermal transfer contact and radiation shield.
摘要翻译：本发明的方法采用柱型紧固件，其一端提供与电路卡的插入摩擦连接，另一端提供延伸穿过散热器的压缩弹簧装置，该压缩弹簧装置将散热器朝向导线卡。多个柱形紧固件围绕芯片封装的周边定位，以将热沉平行于电路卡并压缩芯片封装。本发明的封装结构允许比芯片封装区域更大的区域散热器由电路卡支撑，与芯片的唯一关系是压缩热转印触点和辐射屏蔽的关系。

5. 发明授权

US5910883A Hinge incorporating a helically coiled heat pipe for a laptop computer 失效
标题翻译：铰链包括用于笔记本电脑的螺旋卷曲的热管
公开(公告)号：US5910883A
公开(公告)日：1999-06-08
申请号：US907119
申请日：1997-08-06
申请人： Thomas Mario Cipolla , Paul William Coteus , Lawrence Shungwei Mok
发明人： Thomas Mario Cipolla , Paul William Coteus , Lawrence Shungwei Mok
IPC分类号： F28D15/02 , G06F1/20 , H05K7/20
CPC分类号： G06F1/203 , F28D15/0233 , G06F2200/201
摘要： An arrangement and method for enhancing the cooling capacity of portable personal computers. The power dissipation of portable personal computers (PCs) is increased by conducting heat through a heat pipe arranged in a hinge structure interconnecting a display panel with a bottom keyboard housing, and conducting the heat into an area at the rear of the display panel.
摘要翻译：一种用于增强便携式个人计算机的冷却能力的装置和方法。通过布置在将显示面板与底部键盘壳体相互连接的铰链结构中的热管传导热量并将热量传导到显示面板后部的区域来增加便携式个人计算机（PC）的功率消耗。

6. 发明授权

US06181554B2 Portable computer riser for enhanced cooling 失效
标题翻译：便携式计算机提升管，用于增强冷却
公开(公告)号：US06181554B2
公开(公告)日：2001-01-30
申请号：US09184143
申请日：1998-10-08
申请人： Thomas Mario Cipolla , Claudius Feger
发明人： Thomas Mario Cipolla , Claudius Feger
IPC分类号： H05K720
CPC分类号： G06F1/1616 , G06F1/166 , G06F1/203
摘要： Passive cooling of a portable personal computer is enhanced by providing a capability for raising one side of a computer with respect to another thus exposing the bottom surface of the computer base to the ambient air with the heat being dissipated providing an air flow over the bottom surface of the base portion of the computer. A mechanism is provided that is actuated by opening the cover that positions the base in a tilted position. An improved keyboard angle also results.
摘要翻译：便携式个人计算机的被动冷却通过提供一种将计算机的一侧相对于另一侧提升的能力来增强，从而将计算机基座的底表面暴露于环境空气中，散发的热量提供了空气流过底面的计算机基础部分。提供通过打开将基座定位在倾斜位置的盖来致动的机构。改进的键盘角度也会产生。

7. 发明授权

US6097596A Portable computer rotational heat pipe heat transfer 失效
标题翻译：便携式电脑旋转热管传热
公开(公告)号：US6097596A
公开(公告)日：2000-08-01
申请号：US23008
申请日：1998-02-12
申请人： Thomas Mario Cipolla , Lawrence Shungwei Mok
发明人： Thomas Mario Cipolla , Lawrence Shungwei Mok
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/203 , G06F2200/201 , Y10T16/522
摘要： Heat transfer through a heat pipe from a heat source on one side of a hinge to a heat dissipation capability on the other side of the hinge is achieved by providing a rotatable coupler with a thermal transfer body mounted on the side of the hinge away from the heat source and wherein a rotational interface surface area between the thermal transfer body and the heat pipe is larger than the outside of the heat pipe.
摘要翻译：通过热管从铰链的一侧的热源到铰链的另一侧的散热能力的热传递是通过提供一个可转动的耦合器来实现的，该耦合器具有安装在铰链侧的热传递体远离热源，并且其中热传递体和热管之间的旋转界面表面积大于热管的外部。

8. 发明授权

US5786873A Efficient optical system for a high resolution projection display employing reflection light valves 失效
标题翻译：高效光学系统，用于采用反射光阀的高分辨率投影显示
公开(公告)号：US5786873A
公开(公告)日：1998-07-28
申请号：US910807
申请日：1997-08-13
申请人： George Liang-Tai Chiu , Thomas Mario Cipolla , Fuad Elias Doany , Derek Brian Dove , Alan Edward Rosenbluth , Rama Nand Singh , Janusz Stanislaw Wilczynski
发明人： George Liang-Tai Chiu , Thomas Mario Cipolla , Fuad Elias Doany , Derek Brian Dove , Alan Edward Rosenbluth , Rama Nand Singh , Janusz Stanislaw Wilczynski
IPC分类号： G02F1/13 , G02F1/1335 , G03B21/00 , H04N5/74 , H04N9/31
CPC分类号： G02B27/283 , G02B27/1026 , G02B27/145 , H04N9/3105
摘要： An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. The system includes a quarter wave plate positioned to suppress stray reflection from the projection lens. The system also includes a second quarter wave plate disposed on the screen and a polarizing film disposed on the second quarter wave plate to suppress ambient light from illuminating the screen and entering the system.
摘要翻译：描述了由反射双折射光阀，偏振分束器，彩色图像组合棱镜，照明系统，投影透镜，用于颜色和对比度控制的滤光器以及放置在为高分辨率彩色显示提供优点的配置中的屏幕组成的光学系统。该系统包括四分之一波片，定位成抑制投影透镜的杂散反射。该系统还包括设置在屏幕上的第二四分之一波长板和设置在第二四分之一波片上的偏振膜，以抑制环境光照射屏幕并进入系统。

9. 发明授权

US06181553B2 Arrangement and method for transferring heat from a portable personal computer 失效
标题翻译：用于从便携式个人计算机传送热量的布置和方法
公开(公告)号：US06181553B2
公开(公告)日：2001-01-30
申请号：US09148690
申请日：1998-09-04
申请人： Thomas Mario Cipolla , Lawrence Shungwei Mok
发明人： Thomas Mario Cipolla , Lawrence Shungwei Mok
IPC分类号： H05K500
CPC分类号： G06F1/203 , G06F1/1632
摘要： An arrangement and method for enhancing the cooling capacity of portable personal computers. More particularly, there is provided to the provision of an arrangement for increasing the cooling capacity of portable personal computers, particularly such as laptop or notebook computers. The computer possesses a keyboard having the rear edge thereof hingedly connected with the bottom of an openable display unit or panel, and containing heat-generating computer electronics, from which heat is removed through a heat pipe terminating in a coupling arrangement possessing elements which connect to and disconnect from each other when, respectively, docking and undocking the portable personal computer in a docking station so as to facilitate the transference of heat from the portable personal computer through the coupling arrangement into the docking station from whence the heat is dissipated to the surroundings through the intermediary of a heat sink.
摘要翻译：一种用于增强便携式个人计算机的冷却能力的装置和方法。更具体地，提供了提供用于增加便携式个人计算机（特别是诸如膝上型计算机或笔记本计算机）的冷却能力的装置。计算机具有键盘，其后缘与可开启的显示单元或面板的底部铰接，并且包含发热计算机电子设备，热量通过终端于具有连接到并且当分别在对接站中对接和脱离便携式个人计算机时，彼此断开，以便于将热量从便携式个人计算机通过耦合装置转移到对接站中，从而从散热到周围环境通过散热器的中介。

10. 发明授权

US6078495A Apparatus and method for moving keyboard and display for enhanced cooling on portable computers 失效
标题翻译：用于移动键盘和显示器以便在便携式计算机上增强冷却的装置和方法
公开(公告)号：US6078495A
公开(公告)日：2000-06-20
申请号：US14535
申请日：1998-01-28
申请人： Thomas Mario Cipolla , Ramiro Ramirez
发明人： Thomas Mario Cipolla , Ramiro Ramirez
IPC分类号： G06F1/20 , G06F1/16 , H05K5/00 , H05K7/20
CPC分类号： G06F1/203
摘要： The present invention is a computer arrangement with enhanced cooling capability. The computer arrangement includes a housing having an opening thereon. The housing holds heat generating components, such as a central processing unit and other hardware components and peripheral devices. The computer arrangement further includes a keyboard which is slidably mounted on the housing over the opening, and a display panel which is connected to the keyboard. The keyboard and the display panel are both slidable relative to the opening so as to uncover a portion of the opening to thereby enable an escape of heat from within said housing.
摘要翻译：本发明是具有增强的冷却能力的计算机装置。计算机装置包括其上具有开口的壳体。壳体容纳诸如中央处理单元和其他硬件组件和外围设备的发热部件。该计算机装置还包括可滑动地安装在开口上的壳体上的键盘和连接到键盘的显示面板。键盘和显示面板可相对于开口滑动，以便露出开口的一部分，从而能够将热量从所述壳体内逸出。

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