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    • 8. 发明授权
    • Bidirectional coding splitter
    • 双向编码分离器
    • US06831773B2
    • 2004-12-14
    • US10282018
    • 2002-10-29
    • Thomas PfeifferPeter Kersten
    • Thomas PfeifferPeter Kersten
    • G02F129
    • H04J14/005
    • It is an object of the invention to provide a network topology for OCDM signals. Coding splitters combining both coding and splitting functions are provided. The coding splitters themselves can be made from cascaded Mach Zehnder filters which are located somewhere in the network and which can be integrated using planar waveguide technologies. Each OCDM transceiver as well as the network is connected to the splitter via a pair of fibers for the two transmission directions. This set-up has the advantage that the same splitter can be used for both directions to and from the transceivers on one side and to and from the network on the other side.
    • 本发明的一个目的是提供一种用于OCDM信号的网络拓扑。 提供了组合编码和分割功能的编码分离器。 编码分离器本身可以由位于网络某处的级联马赫曾德滤波器制成,并且可以使用平面波导技术进行集成。 每个OCDM收发器以及网络通过用于两个传输方向的一对光纤连接到分路器。 该设置具有以下优点:相同的分离器可以用于在一侧的收发器和来自另一侧的网络的两个方向。
    • 9. 发明授权
    • Methods for the production of printed circuit boards with through-platings
    • 生产具有镀层的印刷电路板的方法
    • US06272745B1
    • 2001-08-14
    • US09042264
    • 1998-03-13
    • Peter KerstenJörg Kiefer
    • Peter KerstenJörg Kiefer
    • H01K310
    • H05K3/0094H05K3/025H05K3/048H05K3/246H05K2201/0347H05K2201/0355H05K2201/0959H05K2203/0191H05K2203/025H05K2203/0264H05K2203/0554H05K2203/1383Y10T29/4913Y10T29/49139Y10T29/49155Y10T29/49165
    • Methods for the production of printed circuit boards (1) with at least one electrically conductive through-plating which runs in a hole (5) in an insulating base material (2) from a first to a second surface include the following steps. The base material is pressed on its surfaces with two-layered foils (3, 4) consisting of a Cu foil (31, 32) covered with a Cu layer (32′, 42′), an acrylonitrile-butadiene-styrene-copolymer film (32″, 42″) or a self-adhesive plastic film (32*, 42*) in such a way that the Cu foils adhere well to the base material. The holes are produced and they as well as the exposed surfaces of the layers (32′, 42′; 32″, 42″; 32*, 42*) are provided with a further Cu layer (6, 6′). The metallized holes are completely filled with an insulating material (7) or with a conductive material (7′; 8) by spreading on with a squeegee or by rolling on to the exposed surface of the Cu layer (6, 6′). The layers (32′, 42′; 32″, 42″; 32*, 42*) are removed together with the Cu layer (6, 6′). Stubs (71, 72; 81, 82) which project beyond the remaining Cu foils (31, 41) are removed after the curing of the material (7, 7′; 8) thereby planarizing the Cu foils (31, 41) being now ready for structuring to produce a conductive pattern.
    • 用于生产印刷电路板(1)的方法包括以下步骤:在至少一个在第一至第二表面的绝缘基材(2)的孔(5)中延伸的导电贯穿镀层。 用覆盖有Cu层(32',42')的Cu箔(31,32)和丙烯腈 - 丁二烯 - 苯乙烯共聚物膜(3',4')构成的两层箔(3,4) (32“,42”)或自粘塑料膜(32 *,42 *),使得Cu箔与基材良好地粘合。 产生孔,并且它们以及层(32',42'; 32“,42”; 32 *,42 *)的暴露表面设置有另外的Cu层(6,6')。 金属化的孔完全用绝缘材料(7)或用导电材料(7'; 8)填充,通过用刮板传播或通过滚动到Cu层(6,6')的暴露表面上。 层(32',42'; 32“,42”; 32 *,42 *)与Cu层(6,6')一起被去除。 在材料(7,7'; 8)固化之后,移除超过剩余的Cu箔(31,41)的突出部(71,72; 81,82),从而使现在的Cu箔(31,41)平坦化 准备结构化以产生导电图案。