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    • 4. 发明授权
    • Method for the production of LED bodies
    • 生产LED灯体的方法
    • US07205170B2
    • 2007-04-17
    • US10497727
    • 2002-12-04
    • Thorsten RickingCem OlkayJörg LehmannThomas Manth
    • Thorsten RickingCem OlkayJörg LehmannThomas Manth
    • H01L21/00H01L21/56
    • B29C45/34B29C45/0046B29C45/14655B29C45/14836B29C2045/0027H01L2224/45124H01L2224/48091H01L2224/48247H01L2924/00014H01L2924/00
    • The invention relates to a method for producing light-conducting LED bodies by injection molding into a mold of a material that is fusible prior to final solidification. Each LED body comprises at least one light-emitting chip and at least two wire-shaped electrodes that are electrically connected to the chip. The injection mold is evacuated via at least one opening per LED after positioning the electronic parts and closing. The evacuation opening is disposed in the proximity of the electrodes in the bottom area of the LED. The fusible material is injected between the bottom area and the chip or the reflector trough at least approximately parallel to the chip surface and at least approximately normal to a surface embodied by two electrodes, with the center line of the injection stream running between two electrodes. The inventive method for producing light-conducting LED bodies prevents the LED electronics from being damaged during normal performance of the injection molding process.
    • 本发明涉及一种通过注塑成型到在最终凝固之前易熔的材料的模具来生产导光LED体的方法。 每个LED体包括电连接到芯片的至少一个发光芯片和至少两个线状电极。 在定位电子部件并关闭后,通过每个LED至少一个开口抽吸注射模具。 排气开口设置在LED的底部区域中的电极附近。 可熔材料在底部区域和芯片或反射器槽之间注入至少大致平行于芯片表面,并且至少大致垂直于由两个电极实现的表面,注入流的中心线在两个电极之间延伸。 用于制造导光LED本体的本发明的方法防止了LED电子器件在注射成型工艺的正常执行期间被损坏。