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1. 发明申请

US20160027721A1 Leadframe Strip And Leadframes 有权
标题翻译：引线框带和引线框架
公开(公告)号：US20160027721A1
公开(公告)日：2016-01-28
申请号：US14444516
申请日：2014-07-28
申请人： Texas Instruments Incorporated
发明人： Wen Yu Lee , Steven Su
IPC分类号： H01L23/495 , H01L21/48
CPC分类号： H05K3/301 , H01L21/4821 , H01L21/4825 , H01L21/565 , H01L21/78 , H01L23/49541 , H01L23/49555 , H01L23/49582 , H01L24/97
摘要： A leadframe strip including a first leadframe having a first die pad and a first plurality of generally parallel leads each extending outwardly relative to the first die pad and terminating in a free end and a second leadframe having a second die pad and a second plurality of generally parallel leads extending outwardly relative to the second die pad and terminating in a free end. The free ends of the second plurality of leads are positioned in close nontouching adjacent relationship with the free ends of the first plurality of leads. The two leadframes may be separated from each other by a single saw cut.
摘要翻译：一种引线框条，包括具有第一引线框架的第一引线框架和第一多个大致平行的引线，每个引线板相对于第一管芯焊盘向外延伸并终止于自由端，第二引线框架具有第二管芯焊盘和第二多个通常平行引线相对于第二管芯焊盘向外延伸并终止于自由端。第二多个引线的自由端位于与第一多个引线的自由端紧密非接触的相邻关系中。两个引线框架可以通过单个锯切切割彼此分离。

2. 发明申请

US20200185308A1 Leadframe With Vertically Spaced Die Attach Pads 审中-公开
公开(公告)号：US20200185308A1
公开(公告)日：2020-06-11
申请号：US16788695
申请日：2020-02-12
申请人： TEXAS INSTRUMENTS INCORPORATED
发明人： Chia-Yu Chang , Chih-Chien Ho , Steven Su
IPC分类号： H01L23/495 , H01L23/00 , G06F30/394
摘要： A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.

3. 发明授权

US10529654B2 Wire support for a leadframe 有权
公开(公告)号：US10529654B2
公开(公告)日：2020-01-07
申请号：US16143148
申请日：2018-09-26
申请人： TEXAS INSTRUMENTS INCORPORATED
发明人： Yuh-Harng Chien , Chih-Chien Ho , Steven Su
IPC分类号： H01L23/495 , H01L23/31 , H01L23/498 , H01L23/00 , H01L25/065 , H01L25/18 , H01L21/56
摘要： A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

4. 发明申请

US20180211905A1 SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH MULTI-LEVEL ASSEMBLY PADS 审中-公开
公开(公告)号：US20180211905A1
公开(公告)日：2018-07-26
申请号：US15924767
申请日：2018-03-19
申请人： Texas Instruments Incorporated
发明人： Chia-Yu Chang , Chih-Chien Ho , Steven Su
IPC分类号： H01L23/495 , H01L23/31 , H01L23/13 , H01L23/00
CPC分类号： H01L23/49551 , H01L23/13 , H01L23/3107 , H01L23/3121 , H01L23/3157 , H01L23/49503 , H01L23/49517 , H01L23/4952 , H01L23/49534 , H01L23/49575 , H01L24/48 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1033 , H01L2924/14 , H01L2924/19105 , H01L2924/00014 , H01L2924/20752 , H01L2924/00
摘要： A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps (132) to the frame. In addition, the leadframe has a third metallic pad (140) in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps (131) to the second pad.

5. 发明授权

US09363901B2 Making a plurality of integrated circuit packages 有权
标题翻译：制作多个集成电路封装
公开(公告)号：US09363901B2
公开(公告)日：2016-06-07
申请号：US14965052
申请日：2015-12-10
申请人： Texas Instruments Incorporated
发明人： Wen Yu Lee , Steven Su
IPC分类号： H01L21/44 , H01L21/48 , H05K3/30 , H01L21/56 , H01L21/78
CPC分类号： H05K3/301 , H01L21/4821 , H01L21/4825 , H01L21/565 , H01L21/78 , H01L23/49541 , H01L23/49555 , H01L23/49582 , H01L24/97
摘要： A method of making a plurality of integrated circuit packages provides a metal strip. A first leadframe having a first die pad is formed on the metal strip. Also formed are a first plurality of leads with proximal ends adjacent to the first die pad, free distal ends positioned outwardly from the first die pad, and a first leadframe dam bar intersecting the proximal ends of the first plurality of leads. A second leadframe having a second die pad, a second plurality of leads with proximal ends adjacent to the second die pad and free distal ends positioned outwardly from the second die pad and a second leadframe dam bar intersecting the proximal ends of the second plurality of leads are formed on the metal strip. The free distal ends of said second plurality of leads are aligned with and adjacent to said free distal ends of said first plurality of leads.
摘要翻译：制造多个集成电路封装的方法提供金属条。具有第一管芯焊盘的第一引线框形成在金属条上。还形成有第一多个引线，其具有邻近第一管芯焊盘的近端，从第一管芯焊盘向外定位的自由远端，以及与第一多个引线的近端相交的第一引线框阻挡条。具有第二管芯焊盘的第二引线框架，具有邻近第二管芯焊盘的近端的第二多个引线和从第二管芯焊盘向外定位的自由远端以及与第二多个引线的近端相交的第二引线框阻挡条形成在金属条上。所述第二多个引线的自由远端与所述第一多个引线的所述自由远端对准并相邻。

6. 发明授权

US09337130B2 Leadframe strip and leadframes 有权
标题翻译：引线框和引线框架
公开(公告)号：US09337130B2
公开(公告)日：2016-05-10
申请号：US14444516
申请日：2014-07-28
申请人： Texas Instruments Incorporated
发明人： Wen Yu Lee , Steven Su
IPC分类号： H01L23/495 , H01L21/48
CPC分类号： H05K3/301 , H01L21/4821 , H01L21/4825 , H01L21/565 , H01L21/78 , H01L23/49541 , H01L23/49555 , H01L23/49582 , H01L24/97
摘要： A leadframe strip including a first leadframe having a first die pad and a first plurality of generally parallel leads each extending outwardly relative to the first die pad and terminating in a free end and a second leadframe having a second die pad and a second plurality of generally parallel leads extending outwardly relative to the second die pad and terminating in a free end. The free ends of the second plurality of leads are positioned in close nontouching adjacent relationship with the free ends of the first plurality of leads. The two leadframes may be separated from each other by a single saw cut.
摘要翻译：一种引线框条，包括具有第一引线框架的第一引线框架和第一多个大致平行的引线，每个引线框架相对于第一管芯焊盘向外延伸并终止于自由端，第二引线框架具有第二管芯焊盘和第二多个通常平行引线相对于第二管芯焊盘向外延伸并终止于自由端。第二多个引线的自由端位于与第一多个引线的自由端紧密非接触的相邻关系中。两个引线框架可以通过单个锯切切割彼此分离。

7. 发明授权

US10600724B2 Leadframe with vertically spaced die attach pads 有权
公开(公告)号：US10600724B2
公开(公告)日：2020-03-24
申请号：US15151177
申请日：2016-05-10
申请人： Texas Instruments Incorporated
发明人： Chia-Yu Chang , Chih-Chien Ho , Steven Su
IPC分类号： H01L23/495 , G06F17/50 , H01L23/00 , H01L23/31
摘要： A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.

8. 发明申请

US20180174950A1 Method Of Making A Wire Support Leadframe For A Semiconductor Device 审中-公开
公开(公告)号：US20180174950A1
公开(公告)日：2018-06-21
申请号：US15896971
申请日：2018-02-14
申请人： TEXAS INSTRUMENTS INCORPORATED
发明人： Yuh-Harng Chien , Chih-Chien Ho , Steven Su
IPC分类号： H01L23/495 , H01L25/18 , H01L23/00 , H01L23/31 , H01L23/498 , H01L25/065
CPC分类号： H01L23/49541 , H01L21/56 , H01L23/3121 , H01L23/49503 , H01L23/49551 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L25/18 , H01L2224/05554 , H01L2224/05599 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48137 , H01L2224/48138 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/17747
摘要： A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

9. 发明授权

US09627331B1 Method of making a wire support leadframe for a semiconductor device 有权
公开(公告)号：US09627331B1
公开(公告)日：2017-04-18
申请号：US14985127
申请日：2015-12-30
申请人： TEXAS INSTRUMENTS INCORPORATED
发明人： Yuh-Harng Chien , Chih-Chien Ho , Steven Su
IPC分类号： H01L23/00 , H01L23/495 , H01L21/48 , H01L21/56
CPC分类号： H01L23/49541 , H01L21/56 , H01L23/3121 , H01L23/49503 , H01L23/49551 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L25/18 , H01L2224/05554 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48137 , H01L2224/48138 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/17747 , H01L2224/05599 , H01L2224/85399
摘要： A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

10. 发明授权

US10811343B2 Method of making a wire support leadframe for a semiconductor device 有权
公开(公告)号：US10811343B2
公开(公告)日：2020-10-20
申请号：US16253151
申请日：2019-01-21
申请人： TEXAS INSTRUMENTS INCORPORATED
发明人： Yuh-Harng Chien , Chih-Chien Ho , Steven Su
IPC分类号： H01L23/495 , H01L23/31 , H01L23/498 , H01L23/00 , H01L25/065 , H01L25/18 , H01L21/56
摘要： A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

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