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    • 1. 发明授权
    • Solid-state image pickup device and method of manufacturing the same
    • 固体摄像装置及其制造方法
    • US07554141B2
    • 2009-06-30
    • US11392616
    • 2006-03-30
    • Tetsuya YamaguchiHiroshige GotoHirofumi YamashitaHisanori IharaIkuko InoueNagataka Tanaka
    • Tetsuya YamaguchiHiroshige GotoHirofumi YamashitaHisanori IharaIkuko InoueNagataka Tanaka
    • H01L31/00H01L31/062H01L31/113
    • H01L27/14689H01L27/1463
    • A solid-state image pickup device comprising a semiconductor substrate which comprises a substrate body containing P-type impurities and a first N-type semiconductor layer containing N-type impurities, the first N-type semiconductor layer being provided on the substrate body, and including a first P-type semiconductor layer which contains p-type impurities, and which is located on the substrate body, a plurality of optical/electrical conversion portions formed of second N-type semiconductor layers which are provided independently of each other in respective positions in a surface portion of the first N-type semiconductor layer, and a plurality of second P-type semiconductor layers which are formed to surround the optical/electrical conversion portions, which are provided along element isolation regions provided in respective positions in the surface portion of the first N-type semiconductor layer, and which continuously extend from the surface portion of the first N-type semiconductor layer to a surface portion of the first P-type semiconductor layer.
    • 一种固态摄像装置,包括:半导体衬底,其包括含有P型杂质的衬底主体和包含N型杂质的第一N型半导体层,所述第一N型半导体层设置在所述衬底主体上;以及 包括含有p型杂质的第一P型半导体层,其位于基板主体上,多个光电转换部分由第二N型半导体层形成,该第二N型半导体层在相应位置彼此独立地设置 在第一N型半导体层的表面部分和形成为围绕光/电转换部分的多个第二P型半导体层,其沿着设置在表面部分中的各个位置的元件隔离区域设置 的第一N型半导体层,并且从第一N型半导体的表面部分连续地延伸 层到第一P型半导体层的表面部分。