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    • 9. 发明授权
    • Substrate replacing method and substrate processing apparatus
    • 基板更换方法和基板处理装置
    • US08663489B2
    • 2014-03-04
    • US12732451
    • 2010-03-26
    • Shigeru IshizawaHiroshi KoizumiTatsuya Ogi
    • Shigeru IshizawaHiroshi KoizumiTatsuya Ogi
    • B44C1/22
    • H01L21/67745H01L21/67748
    • A method for replacing plural substrates to be processed by a substrate processing apparatus which includes a substrate processing chamber, a load lock chamber, and a conveying apparatus including first and second conveying members for conveying the plural substrates into and out from the substrate processing chamber and the load lock chamber. The method includes the steps of a) conveying a first substrate out from the substrate processing chamber with the first conveying member, b) conveying a second substrate into the substrate processing chamber with the second conveying member, c) conveying the second substrate out from the load lock chamber with the second conveying member, and d) conveying the first substrate into the load lock chamber with the first conveying member. The steps c) and d) are performed between step a) and step b).
    • 一种用于替换多个基板的方法,所述基板处理装置包括基板处理室,负载锁定室和输送装置,所述基板处理装置包括用于将多个基板输入和移出基板处理室的第一和第二输送部件, 负载锁定室。 该方法包括以下步骤:a)用第一输送部件从基板处理室输出第一基板,b)用第二输送部件将第二基板输送到基板处理室中,c)将第二基板从 负载锁定室与第二输送构件,以及d)用第一输送构件将第一基板输送到装载锁定室。 在步骤a)和步骤b)之间执行步骤c)和d)。