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    • 2. 发明授权
    • Method of manufacturing a head unit
    • 制造头单元的方法
    • US06640418B2
    • 2003-11-04
    • US09890476
    • 2001-07-31
    • Tetsuya OkanaMitsuhisa FujikiSatoshi YamabayashiShinya Ogasawara
    • Tetsuya OkanaMitsuhisa FujikiSatoshi YamabayashiShinya Ogasawara
    • G11B5127
    • G11B5/48G11B5/1871G11B5/488G11B5/4893G11B5/531G11B5/60G11B15/61G11B15/64Y10T29/49039Y10T29/4913Y10T29/49133Y10T29/49135
    • In processing a head unit in which a head relative height Y is Y′ with a grinding amount &Dgr;GD of &Dgr;GD′, the relationship between distances Bo between a vertex of a curved surface as a front face of a head chip and a head gap before and after grinding the front face of the head chip and a gap depth dimension GD, is predetermined with respect to a head unit in which the head relative height is substantially equal to Y′, through which Bo1 as the value of Bo before grinding corresponding to a target value of the value of Bo after grinding is determined and used as Bo1 of the head unit in which the head relative height Y is Y′. Thus, grinding of the front face of the head chip is conducted after Bo1 corresponding to the target value is determined. Hence, a head unit with the value of Bo after grinding falling within the range of standard values can be manufactured efficiently, and accordingly the yield can be improved.
    • 在处理头部相对高度Y为具有DeltaGD'的磨削量DeltaGD的头部单元的情况下,作为头部芯片的前表面的曲面的顶点与前面的头部间隙之间的曲面顶点之间的距离Bo之间的关系,以及 在研磨头芯片的前表面和间隙深度尺寸GD之后,相对于头部相对高度基本上等于Y'的头单元是预定的,通过该头部单元,Bo1作为磨削前的Bo值对应于 确定研磨后的Bo值的目标值,并将其用作头部相对高度Y为Y'的头部单元的Bo1。 因此,在确定与目标值对应的Bo1之后,进行头芯片的正面的磨削。 因此,可以有效地制造研磨后的Bo值在标准值的范围内的头单元,从而可以提高成品率。
    • 4. 发明授权
    • Imaging apparatus
    • 成像设备
    • US08494359B2
    • 2013-07-23
    • US13395125
    • 2011-06-29
    • Shinya OgasawaraMakoto IyodaYoshikazu YamanoTomonori MizutaniYasuhiro Miyamoto
    • Shinya OgasawaraMakoto IyodaYoshikazu YamanoTomonori MizutaniYasuhiro Miyamoto
    • G03B17/02
    • G03B17/02F16M11/041
    • An imaging apparatus having a protection ring which protects a supporting device coupling section such that it is difficult for a user to touch the supporting device coupling section is provided. A supporting device can be coupled to a camera body, and the camera body includes a supporting device coupling section and a protection ring. The supporting device coupling section has a screw hole to which the supporting device can be coupled, and a supporting device coupling surface which is formed and exposed around the entrance of the screw hole. The protection ring includes a return spring which restricts the position of the protection ring, a return spring stopper which supports the return spring, and a supporting device contact surface which protrudes outward of the exposed surface formed around the entrance of the screw hole of the supporting device coupling section, in a direction toward a housing outside.
    • 提供一种具有保护环的成像装置,其保护支撑装置联接部分,使得用户难以接触支撑装置联接部分。 支撑装置可以耦合到相机主体,并且相机主体包括支撑装置联接部分和保护环。 支撑装置联接部分具有能够联接支撑装置的螺孔,以及围绕螺丝孔的入口形成和暴露的支撑装置联接表面。 保护环包括限制保护环的位置的复位弹簧,支撑复位弹簧的复位弹簧止动器,以及支撑装置接触表面,该支撑装置接触表面从形成在支撑件的螺钉孔的入口周围的暴露表面向外突出 装置联接部分,朝向壳体外部的方向。
    • 5. 发明申请
    • Imaging Device
    • 成像设备
    • US20120274840A1
    • 2012-11-01
    • US13394813
    • 2011-06-29
    • Yoshikazu YamanoYasuhiro MiyamotoMakoto IyodaShinya OgasawaraTomonori Mizutani
    • Yoshikazu YamanoYasuhiro MiyamotoMakoto IyodaShinya OgasawaraTomonori Mizutani
    • H04N5/225
    • G03B17/02G03B2217/002
    • Provided is an imaging device that does not let a user experience a sense of discomfort by touching a support attaching part. The imaging device includes: a support attaching part that is disposed on a support attaching surface and includes a screw hole; and a support attaching part cover that moves between a first position covering the support attaching part and a second position uncovering the support attaching part without generating convexness with regard to the support attaching surface. When a support is attached to the support attaching part, the support attaching part cover moves from the first position to the second position; and when the support is removed from the support attaching part, the support attaching part cover moves from the second position to the first position.
    • 提供一种成像装置,其不会使用户通过触摸支撑附接部件而感到不适感。 该成像装置包括:支撑安装部,其设置在支撑安装面上并且包括螺钉孔; 以及在覆盖所述支撑安装部的第一位置和露出所述支撑安装部的第二位置之间移动而不产生关于所述支撑件附接表面的凸起的支撑附接部盖。 当支撑件附接到支撑附接部分时,支撑附接部分盖从第一位置移动到第二位置; 并且当支撑件从支撑附接部分移除时,支撑件附接部分盖从第二位置移动到第一位置。
    • 7. 发明申请
    • IMAGE PICKUP DEVICE
    • 图像拾取器件
    • US20090046191A1
    • 2009-02-19
    • US12190769
    • 2008-08-13
    • Yukihiro IWATAMasato TobinagaShinya OgasawaraMiyoko Irikiin
    • Yukihiro IWATAMasato TobinagaShinya OgasawaraMiyoko Irikiin
    • H04N5/335
    • H04N9/097
    • The image pickup device includes a color separation prism, solid-state image sensors, a light shielding layer and a heat radiating layer. The color separation prism, made up of a plurality of prism members, separates light incident thereon through an image pickup lens into a plurality of color components. The plurality of solid-state image sensors are fixed to the plurality of prism members, respectively. The light shielding layer is placed so as to cover surfaces of the color separation prism. The heat radiating layer, formed from a high heat conductivity material, is placed on a surface of the light shielding layer so as to be kept from contact with each of the solid-state image sensors. Thus, in the image pickup device, temperature increases of the solid-state image sensors are suppressed while external-force loads applied to the solid-state image sensors are reduced, with a relatively simple structure.
    • 图像拾取装置包括分色棱镜,固态图像传感器,遮光层和散热层。 由多个棱镜构件构成的分色棱镜将通过图像拾取透镜入射的光分离成多个颜色分量。 多个固态图像传感器分别固定到多个棱镜构件。 遮光层被放置成覆盖分色棱镜的表面。 由高导热性材料形成的散热层被放置在遮光层的表面上,以便不与每个固态图像传感器接触。 因此,在图像拾取装置中,通过相对简单的结构,能够减小固态图像传感器的外力负荷而降低固态图像传感器的温度上升。
    • 10. 发明授权
    • Multi-layer solid state imaging device
    • 多层固态成像装置
    • US08045041B2
    • 2011-10-25
    • US12211994
    • 2008-09-17
    • Shinya OgasawaraYukihiro IwataMiyoko Irikiin
    • Shinya OgasawaraYukihiro IwataMiyoko Irikiin
    • H04N9/07H04N5/225
    • H04N5/2253
    • An image pickup device includes a color separation prism composed of prism members and which separates light into color components, solid-state image sensors fixed to the prism members, respectively, image sensor boards on which the solid-state image sensors are mounted, respectively, an image control board to which image pickup signals generated by the image sensor boards, respectively, are inputted, and a flexible board which is connected to the image control board. The flexible board includes a signal transmission layer connected to each of the image sensor boards and which contains transmission paths for transmitting the image pickup signals to the image control board, and a heat radiating layer formed of a high heat conductivity material which is connected to each of the solid-state image sensors and fixed to the signal transmission layer via an insulating layer to transfer heat generated in the solid-state image sensors.
    • 图像摄取装置包括由棱镜构成的分色棱镜,将光分为彩色分量,分别固定在棱镜构件上的固体摄像元件分别固定有固体摄像元件的图像传感器板, 分别输入由图像传感器板生成的图像拾取信号的图像控制板和连接到图像控制板的柔性板。 柔性板包括连接到每个图像传感器板的信号传输层,并且包含用于将图像拾取信号传输到图像控制板的传输路径,以及由高导热性材料形成的散热层,其连接到每个 的固态图像传感器,并且经由绝缘层固定到信号传输层,以传递在固态图像传感器中产生的热量。