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2. 发明授权

US06640418B2 Method of manufacturing a head unit 有权
标题翻译：制造头单元的方法
公开(公告)号：US06640418B2
公开(公告)日：2003-11-04
申请号：US09890476
申请日：2001-07-31
申请人： Tetsuya Okana , Mitsuhisa Fujiki , Satoshi Yamabayashi , Shinya Ogasawara
发明人： Tetsuya Okana , Mitsuhisa Fujiki , Satoshi Yamabayashi , Shinya Ogasawara
IPC分类号： G11B5127
CPC分类号： G11B5/48 , G11B5/1871 , G11B5/488 , G11B5/4893 , G11B5/531 , G11B5/60 , G11B15/61 , G11B15/64 , Y10T29/49039 , Y10T29/4913 , Y10T29/49133 , Y10T29/49135
摘要： In processing a head unit in which a head relative height Y is Y′ with a grinding amount &Dgr;GD of &Dgr;GD′, the relationship between distances Bo between a vertex of a curved surface as a front face of a head chip and a head gap before and after grinding the front face of the head chip and a gap depth dimension GD, is predetermined with respect to a head unit in which the head relative height is substantially equal to Y′, through which Bo1 as the value of Bo before grinding corresponding to a target value of the value of Bo after grinding is determined and used as Bo1 of the head unit in which the head relative height Y is Y′. Thus, grinding of the front face of the head chip is conducted after Bo1 corresponding to the target value is determined. Hence, a head unit with the value of Bo after grinding falling within the range of standard values can be manufactured efficiently, and accordingly the yield can be improved.
摘要翻译：在处理头部相对高度Y为具有DeltaGD'的磨削量DeltaGD的头部单元的情况下，作为头部芯片的前表面的曲面的顶点与前面的头部间隙之间的曲面顶点之间的距离Bo之间的关系，以及在研磨头芯片的前表面和间隙深度尺寸GD之后，相对于头部相对高度基本上等于Y'的头单元是预定的，通过该头部单元，Bo1作为磨削前的Bo值对应于确定研磨后的Bo值的目标值，并将其用作头部相对高度Y为Y'的头部单元的Bo1。因此，在确定与目标值对应的Bo1之后，进行头芯片的正面的磨削。因此，可以有效地制造研磨后的Bo值在标准值的范围内的头单元，从而可以提高成品率。

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