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    • 1. 发明授权
    • Semiconductor device and method for manufacturing same
    • 半导体装置及其制造方法
    • US08541834B2
    • 2013-09-24
    • US13238605
    • 2011-09-21
    • Tetsuro Nozu
    • Tetsuro Nozu
    • H01L29/66
    • H01L29/7813H01L29/404H01L29/407H01L29/42368H01L29/512H01L29/66734H01L29/7397H01L29/8725
    • According to one embodiment, a semiconductor device includes a first semiconductor region, a second semiconductor region, a third semiconductor region, a control electrode, a first main electrode, an internal electrode, and an insulating region. The control electrode is provided inside a trench. The first main electrode is in conduction with the third semiconductor region. The internal electrode is provided in the trench and in conduction with the first main electrode. The insulating region is provided between an inner wall of the trench and the internal electrode. The internal electrode includes a first internal electrode part included in a first region of the trench and a second internal electrode part included in a second region between the first region and the first main electrode. A spacing between the first internal electrode part and the inner wall is wider than a spacing between the second internal electrode part and the inner wall.
    • 根据一个实施例,半导体器件包括第一半导体区域,第二半导体区域,第三半导体区域,控制电极,第一主电极,内部电极和绝缘区域。 控制电极设置在沟槽内。 第一主电极与第三半导体区域导通。 内部电极设置在沟槽中并与第一主电极导通。 绝缘区域设置在沟槽的内壁和内部电极之间。 内部电极包括包括在沟槽的第一区域中的第一内部电极部分和包括在第一区域和第一主要电极之间的第二区域中的第二内部电极部分。 第一内部电极部分和内壁之间的间隔比第二内部电极部分和内壁之间的间隔宽。
    • 3. 发明授权
    • Bidirectional voltage-regulator diode
    • 双向稳压二极管
    • US08330184B2
    • 2012-12-11
    • US13050231
    • 2011-03-17
    • Tetsuro Nozu
    • Tetsuro Nozu
    • H01L29/66
    • H01L29/861H01L29/6609H01L29/66098H01L29/732
    • In one embodiment, a bidirectional voltage-regulator diode includes first to fifth semiconductor layers formed on an inner surface of a first recess formed in a semiconductor substrate of an N-type in the order. The first semiconductor layer of the N-type has a first impurity concentration lower than an impurity concentration of the semiconductor substrate. The second semiconductor layer of a P-type has a second impurity concentration. The third semiconductor layer of the P-type has a third impurity concentration higher than the second impurity concentration. The fourth semiconductor layer of the P-type has a fourth impurity concentration lower than the third impurity concentration. The fifth semiconductor layer of the N-type has a fifth impurity concentration.
    • 在一个实施例中,双向电压调节二极管包括依次形成在形成在N型半导体衬底中的第一凹部的内表面上的第一至第五半导体层。 N型的第一半导体层具有比半导体衬底的杂质浓度低的第一杂质浓度。 P型的第二半导体层具有第二杂质浓度。 P型的第三半导体层具有比第二杂质浓度高的第三杂质浓度。 P型的第四半导体层具有比第三杂质浓度低的第四杂质浓度。 N型的第五半导体层具有第五杂质浓度。
    • 4. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20100127259A1
    • 2010-05-27
    • US12558474
    • 2009-09-11
    • Tetsuro Nozu
    • Tetsuro Nozu
    • H01L27/06H01L29/04
    • H01L27/0629H01L27/0255
    • A semiconductor device has a MOS transistor that has a gate connected to a first terminal, a source connected to a second terminal and a drain connected to a third terminal, a first polysilicon diode that has an anode connected to the first terminal, a first single-crystalline silicon diode that is connected to a cathode of the first polysilicon diode at a cathode thereof and to the second terminal at an anode thereof, has a reverse breakdown voltage lower than a reverse breakdown voltage of the first polysilicon diode, a second polysilicon diode that has a cathode connected to the first terminal and a second single-crystalline silicon diode that is connected to an anode of the second polysilicon diode at an anode thereof and to the third terminal at a cathode thereof, has a reverse breakdown voltage lower than a reverse breakdown voltage of the second polysilicon.
    • 半导体器件具有MOS晶体管,其具有连接到第一端子的栅极,连接到第二端子的源极和连接到第三端子的漏极,具有连接到第一端子的阳极的第一多晶硅二极管,第一单极 在其阴极处连接到第一多晶硅二极管的阴极和在其阳极处连接到第二端子的晶体硅二极管具有低于第一多晶硅二极管的反向击穿电压的反向击穿电压,第二多晶硅二极管 其具有连接到第一端子的阴极和在其阳极处连接到第二多晶硅二极管的阳极的第二单晶硅二极管和其阴极处的第三端子的反向击穿电压低于 第二多晶硅的反向击穿电压。
    • 5. 发明授权
    • Bipolar transistor with a GaAs substrate and a SiGe base or collector
    • 具有GaAs衬底和SiGe基极或集电极的双极晶体管
    • US07157749B2
    • 2007-01-02
    • US11053548
    • 2005-02-09
    • Hidetoshi FujimotoTetsuro NozuYoshitomo SagaeAkira Yoshioka
    • Hidetoshi FujimotoTetsuro NozuYoshitomo SagaeAkira Yoshioka
    • H01L31/0328H01L31/0336H01L31/072H01L31/109
    • H01L29/267H01L29/1004H01L29/7371
    • A bipolar transistor is provided which includes a GaAs substrate, an n-type collector region formed on the GaAs substrate, a p-type base region formed on the n-type collector region and having a p-type base layer of SiGe having a composition lattice-matched with the GaAs substrate, and an n-type emitter region formed on the p-type base region. A bipolar transistor may include a GaAs substrate, a collector region of a first conductivity type formed on the GaAs substrate and including a collector contact layer of the first conductivity type SiGe, which has a composition lattice-matched with the GaAs substrate, a base region of a second conductivity type formed on the collector region of the first conductivity type, and an emitter region of the first conductivity type formed on the base region of the second conductivity type.
    • 提供一种双极晶体管,其包括GaAs衬底,形成在GaAs衬底上的n型集电极区域,形成在n型集电极区域上并具有具有组成的SiGe的p型基极层的p型基极区域 与GaAs衬底晶格匹配,以及形成在p型基极区上的n型发射极区。 双极晶体管可以包括GaAs衬底,在GaAs衬底上形成的第一导电类型的集电极区域,并且包括具有与GaAs衬底晶格匹配的组成的第一导电类型SiGe的集电极接触层, 形成在第一导电类型的集电极区域上的第二导电类型的第一导电类型的发射极区域和形成在第二导电类型的基极区域上的第一导电类型的发射极区域。
    • 6. 发明授权
    • Semiconductor device suited for a high frequency amplifier
    • 适用于高频放大器的半导体器件
    • US07038250B2
    • 2006-05-02
    • US10834347
    • 2004-04-29
    • Toru SugiyamaTetsuro NozuKouhei Morizuka
    • Toru SugiyamaTetsuro NozuKouhei Morizuka
    • H01L29/732H01L31/0328H01L31/0336H01L31/072H01L31/109
    • H01L29/1004H01L29/0817H01L29/7371
    • According to the present invention, there is a provided a semiconductor device having, a collector contact layer made of an n-type GaAs layer; a first collector layer formed on the collector contact layer and made of an n-type GaAs layer; a second collector layer formed on the first collector layer and made of a p-type GaAs layer; a third collector layer formed on the second collector layer and made of an n-type InGaP layer; a fourth collector layer formed on the third collector layer and made of an n-type InGaP layer having an impurity concentration higher than that of the third collector layer; a fifth collector layer formed on the fourth collector layer and made of an n-type GaAs layer; a base layer formed on the fifth collector layer and made of a p-type GaAs layer; and an emitter layer formed on the base layer and made of an n-type InGaP layer.
    • 根据本发明,提供了一种具有由n型GaAs层制成的集电极接触层的半导体器件; 形成在集电极接触层上并由n型GaAs层构成的第一集电极层; 第二集电体层,形成在第一集电层上,由p型GaAs层构成; 形成在第二集电体层上并由n型InGaP层制成的第三集电极层; 第三集电体层,形成在第三集电体层上,由具有比第三集电体层的杂质浓度高的n型InGaP层构成; 形成在第四集电体层上并由n型GaAs层制成的第五集电极层; 基底层,形成在第五集电体层上,由p型GaAs层构成; 以及形成在基底层上并由n型InGaP层制成的发射极层。
    • 9. 发明授权
    • Semiconductor device with a protection diode
    • 具有保护二极管的半导体器件
    • US08264000B2
    • 2012-09-11
    • US12816096
    • 2010-06-15
    • Tetsuro Nozu
    • Tetsuro Nozu
    • H01L29/66
    • H01L27/0255H01L29/861
    • According to one embodiment, a semiconductor device includes a semiconductor substrate, a semiconductor region, a first and second electrodes. The semiconductor region is provided on the semiconductor substrate via an insulating film. The semiconductor region includes a protection diode. An overvoltage causes breakdown of the protection diode. A PN junction of the protection diode is exposed at an end face of the semiconductor region. A first and second electrodes are provided distally to the exposed end face of the PN junction. The first and second electrodes are connected to the semiconductor region to provide a current to the protection diode.
    • 根据一个实施例,半导体器件包括半导体衬底,半导体区域,第一和第二电极。 半导体区域经由绝缘膜设置在半导体衬底上。 半导体区域包括保护二极管。 过压会导致保护二极管故障。 保护二极管的PN结在半导体区域的端面处露出。 第一和第二电极在PN结的暴露端面的远侧设置。 第一和第二电极连接到半导体区域以向保护二极管提供电流。
    • 10. 发明授权
    • Semiconductor apparatus
    • 半导体装置
    • US08022479B2
    • 2011-09-20
    • US12128289
    • 2008-05-28
    • Tetsuro Nozu
    • Tetsuro Nozu
    • H01L29/788
    • H01L23/60H01L27/0255H01L2924/0002H01L2924/00
    • A semiconductor apparatus includes a semiconductor substrate, an insulating film provided on the semiconductor substrate, and a semiconductor film provided on the insulating film. The semiconductor substrate includes a region of a first current path including at least one diode, the semiconductor film includes a region of a second current path including at least one diode, the first current path and the second current path are connected in parallel to each other, the region of the first current path includes at least part of an area directly below the region of the second current path, and the first current path has a higher resistance than the second current path.
    • 半导体装置包括半导体衬底,设置在半导体衬底上的绝缘膜和设置在绝缘膜上的半导体膜。 半导体衬底包括包括至少一个二极管的第一电流通路的区域,该半导体膜包括包括至少一个二极管的第二电流通路的区域,第一电流通路和第二电流通路彼此并联连接 第一电流路径的区域包括直接在第二电流路径的区域下方的区域的至少一部分,并且第一电流路径具有比第二电流路径更高的电阻。