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1. 发明授权

US07442843B2 Process for producing cumene and process for propylene oxide production including the production process 有权
标题翻译：用于生产异丙苯的方法和包括生产过程在内的环氧丙烷生产方法
公开(公告)号：US07442843B2
公开(公告)日：2008-10-28
申请号：US10572450
申请日：2004-09-15
申请人： Tetsuo Suzuki , Masaru Ishino , Toshio Nakayama
发明人： Tetsuo Suzuki , Masaru Ishino , Toshio Nakayama
IPC分类号： C07C1/20 , C07C301/00
CPC分类号： C07C5/03 , C07C2523/44 , Y02P20/52 , C07C15/085
摘要： A process for producing cumene by subjecting cumyl alcohol to hydrogenolysis or hydrogenation subsequent to dehydration, which comprises using a palladium-based catalyst as a catalyst for the hydrogenolysis or the hydrogenation, and using hydrogen having a carbon monoxide concentration of 0.1 to 10% by volume as hydrogen.
摘要翻译：通过使枯基醇在脱水后进行氢解或氢化来制造枯烯的方法，其包括使用钯基催化剂作为氢解或氢化的催化剂，并使用一氧化碳浓度为0.1〜10体积％的氢作为氢。

2. 发明申请

US20060217566A1 Process for producing cumene and process for propylene oxide production including the production process 有权
标题翻译：用于生产异丙苯的方法和包括生产过程在内的环氧丙烷生产方法
公开(公告)号：US20060217566A1
公开(公告)日：2006-09-28
申请号：US10572450
申请日：2004-09-15
申请人： Tetsuo Suzuki , Masaru Ishino , Toshio Nakayama
发明人： Tetsuo Suzuki , Masaru Ishino , Toshio Nakayama
IPC分类号： C07D301/14 , C07C1/20
CPC分类号： C07C5/03 , C07C2523/44 , Y02P20/52 , C07C15/085
摘要： A process for producing cumene by subjecting cumyl alcohol to hydrogenolysis or hydrogenation subsequent to dehydration, which comprises using a palladium-based catalyst as a catalyst for the hydrogenolysis or the hydrogenation, and using hydrogen having a carbon monoxide concentration of 0.1 to 10% by volume as hydrogen.
摘要翻译：通过使枯基醇在脱水后进行氢解或氢化来制造枯烯的方法，其包括使用钯基催化剂作为氢解或氢化的催化剂，并使用一氧化碳浓度为0.1〜10体积％的氢作为氢。

3. 发明授权

US08859077B2 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate 有权
标题翻译：多层布线基板的制造方法以及多层布线基板
公开(公告)号：US08859077B2
公开(公告)日：2014-10-14
申请号：US13028588
申请日：2011-02-16
申请人： Shinnosuke Maeda , Tetsuo Suzuki , Satoshi Hirano
发明人： Shinnosuke Maeda , Tetsuo Suzuki , Satoshi Hirano
IPC分类号： B32B3/24 , H05K3/46 , H05K1/11 , H05K3/20
CPC分类号： H05K3/4682 , H05K1/112 , H05K3/205 , H05K2201/094 , H05K2201/09472 , H05K2201/099 , Y10T428/24331 , Y10T428/24339
摘要： A plurality of openings are formed in a resin insulation layer on a bottom surface side of a wiring laminate portion which constitutes a multilayer wiring substrate. A plurality of motherboard connection terminals are disposed to correspond to the openings. The motherboard connection terminals are primarily comprised of a copper layer, and peripheral portions of terminal outer surfaces thereof are covered by the outermost resin insulation layer. A dissimilar metal layer made of at least one metal which is lower in etching rate than copper is formed between an inner main surface of the outermost resin insulation layer and peripheral portions of the terminal outer surfaces.
摘要翻译：在构成多层布线基板的布线层叠体的底面侧的树脂绝缘层上形成有多个开口部。多个主板连接端子被设置成对应于这些开口。母板连接端子主要由铜层构成，其端子外表面的周边部分被最外层树脂绝缘层覆盖。在最外层树脂绝缘层的内主表面和端子外表面的周边部分之间形成由蚀刻速率低于铜的至少一种金属制成的异种金属层。

4. 发明授权

US08707554B2 Method of manufacturing multilayer wiring substrate 有权
标题翻译：制造多层布线基板的方法
公开(公告)号：US08707554B2
公开(公告)日：2014-04-29
申请号：US12979474
申请日：2010-12-28
申请人： Shinnosuke Maeda , Tetsuo Suzuki , Takuya Hando , Tatsuya Ito , Satoshi Hirano , Atsuhiko Sugimoto
发明人： Shinnosuke Maeda , Tetsuo Suzuki , Takuya Hando , Tatsuya Ito , Satoshi Hirano , Atsuhiko Sugimoto
IPC分类号： H01R9/00 , H05K3/00
CPC分类号： H05K1/0298 , H01L21/4846 , H01L23/49822 , H01L2224/16225 , H05K1/09 , H05K1/111 , H05K1/113 , H05K3/0055 , H05K3/3452 , H05K3/4682 , H05K2201/068 , H05K2201/094 , H05K2201/0989 , H05K2201/099
摘要： In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.
摘要翻译：在堆积步骤中，将多个树脂绝缘层和多个导电层以多层布置交替层叠在可分离地层叠在基材侧上的金属箔上，从而形成布线层压体部分。在钻井工序中，通过激光钻孔在最外层的树脂绝缘层上形成多个开口，露出连接端子。随后，在去污步骤中，去除开口内部的污迹。在堆积步骤之后执行的基材除去步骤中，除去基材并暴露金属箔。

5. 发明申请

US20110252852A1 CONVEYING JIG, METHOD OF MANUFACTURING CONVEYING JIG, AND METHOD OF HEAT-TREATING METAL RINGS USING CONVEYING JIG 失效
标题翻译：输送机，输送机的制造方法和使用输送机加热金属环的方法
公开(公告)号：US20110252852A1
公开(公告)日：2011-10-20
申请号：US13140379
申请日：2009-10-22
申请人： Yoshiharu Watabe , Seiichi Minegishi , Tetsuo Suzuki , Masaomi Saruyama , Masashi Takagaki
发明人： Yoshiharu Watabe , Seiichi Minegishi , Tetsuo Suzuki , Masaomi Saruyama , Masashi Takagaki
IPC分类号： C21D9/40 , B21D26/02 , C21D1/00
CPC分类号： C21D9/0025 , B21D26/033 , C21D9/40 , F27D5/0006
摘要： Provided are a conveying jig, a method of manufacturing the conveying jig, and a method of heat-treating metal rings using the conveying jig. The conveying jig is provided with a base and ten holding shafts raised from the base. Ridges and grooves are alternatively provided in the side wall of each holding shaft. The metal rings are held in position by being engaged in the grooves in the holding shafts. The space enclosed within the holding shafts is communicated with the atmosphere, and this allows, when the metal rings held by the conveying jig are subjected to heat treatment in a heat treatment furnace, an atmospheric gas to circulate in the space enclosed within the holding shafts.
摘要翻译：提供了输送夹具，制造输送夹具的方法以及使用输送夹具对金属环进行热处理的方法。输送夹具设有一个基座和十个从底座上升的保持轴。在每个保持轴的侧壁中可选地设置有脊和槽。金属环通过接合在保持轴中的槽中而保持就位。封闭在保持轴内的空间与大气连通，这样当由输送夹具保持的金属环在热处理炉中进行热处理时，能够在封闭在保持轴内的空间内循环大气。

6. 发明授权

US08002923B2 Method of manufacturing glass substrate 有权
标题翻译：制造玻璃基板的方法
公开(公告)号：US08002923B2
公开(公告)日：2011-08-23
申请号：US12249341
申请日：2008-10-10
申请人： Tetsuo Suzuki , Yoshio Kawakami
发明人： Tetsuo Suzuki , Yoshio Kawakami
IPC分类号： B24B1/00 , B24B9/00 , B32B38/00
CPC分类号： G11B5/8404 , B24B9/065
摘要： A glass block is formed by stacking, fixing, and integrating a plurality of thin glass plates having a predetermined thickness. An annular glass block is formed by coring the glass block. Surfaces of an inside circumference and an outside circumference of the annular glass block are ground. The annular glass block of which the surfaces of the inside circumference and the outside circumference are ground are separated into individual annular glass substrates, and separated annular glass substrates are cleaned. Then, edge portions of the inside circumference and the outside circumference of a cleaned annular glass substrate are chamfered.
摘要翻译：通过堆叠，固定和整合具有预定厚度的多个薄玻璃板来形成玻璃块。通过取芯玻璃块形成环形玻璃块。研磨环形玻璃块的内周和外周的表面。将内周面和外周面的表面研磨的环状玻璃块分离成单独的环状玻璃基板，并且分离的环状玻璃基板被清洁。然后，将清洁后的环状玻璃基板的内周缘部和外周缘部进行倒角。

7. 发明申请

US20070012338A1 METHODS AND REMOVERS FOR REMOVING ANODIZED FILMS 失效
标题翻译：用于去除阳离子膜的方法和去除
公开(公告)号：US20070012338A1
公开(公告)日：2007-01-18
申请号：US11424369
申请日：2006-06-15
申请人： Katsuyuki Iijima , Tetsuo Suzuki
发明人： Katsuyuki Iijima , Tetsuo Suzuki
IPC分类号： C23G1/00 , C23G1/02 , B08B7/00 , B08B3/00
CPC分类号： C23G1/22 , C23G1/00 , C23G1/12
摘要： A remover contains an alkaline component, a bivalent zinc ion, a ferric ion, a chelating agent, and a nitrate ion. By using this remover, an anodized film can be selectively removed from an aluminum or aluminum-alloy member.
摘要翻译：去除剂含有碱性组分，二价锌离子，三价铁离子，螯合剂和硝酸根离子。通过使用该去除剂，可以从铝或铝合金构件中选择性地除去阳极氧化膜。

8. 发明授权

US06866428B2 Method for connecting optical fibers, and heat treatment apparatus used therefor 有权
标题翻译：光纤连接方法及其使用的热处理装置
公开(公告)号：US06866428B2
公开(公告)日：2005-03-15
申请号：US10188649
申请日：2002-07-01
申请人： Tetsuo Suzuki
发明人： Tetsuo Suzuki
IPC分类号： G02B6/255
CPC分类号： G02B6/2551
摘要： Provided are connection methods and a heat treatment apparatus to be used in the method capable of readily applying heat treatment to a fusion-spliced portion of a connection line which is formed by fusion-splicing optical fibers of different kinds and capable of finishing the heat treatment with no excess or insufficiency.In the connection methods, after fusion-splicing the optical fibers of different kinds having different MFDs, the heat treatment is carried out to match the MFDs. At the same time, a dummy connection line of dummy optical fibers of different kinds is prepared, which is the same combination as the connection line of the optical fibers of different kinds to which the heat treatment is applied. While measuring connection loss in the dummy connection line directly or indirectly, the heat treatment is applied to the dummy connection line as well as the connection line. When a measured value of the connection loss in the dummy connection line lowers below a preset decision value of the time to finish the heat treatment, the heat treatment is finished. It is possible to readily finish the heat treatment at an appropriate timing without giving an excessive or insufficient heat treatment.
摘要翻译：提供了在能够容易地对通过熔接不同种类的光纤形成并能够完成热处理的连接线的熔接部分进行热处理的方法中使用的连接方法和热处理装置。没有过剩或不足。在连接方法中，在熔接具有不同MFD的不同种类的光纤后，进行热处理以匹配MFD。同时，准备了不同种类的虚拟光纤的虚拟连接线，这是与应用热处理的不同种类的光纤的连接线相同的组合。在直接或间接测量虚拟连接线中的连接损耗的同时，对虚拟连接线以及连接线进行热处理。当虚拟连接线中的连接损耗的测量值低于完成热处理的时间的预设决定值时，热处理结束。可以在适当的时间下容易地完成热处理，而不会导致过热或不充分的热处理。

9. 发明授权

US06860119B2 Optical fiber splicing method 有权
标题翻译：光纤拼接方式
公开(公告)号：US06860119B2
公开(公告)日：2005-03-01
申请号：US10171016
申请日：2002-06-11
申请人： Tetsuo Suzuki , Naoki Amatatsu , Hiroaki Oonuma , Wataru Komatsu
发明人： Tetsuo Suzuki , Naoki Amatatsu , Hiroaki Oonuma , Wataru Komatsu
IPC分类号： G02B6/255 , C03B37/027
CPC分类号： G02B6/2551
摘要： An optical fiber splicing method is provided for largely reducing an optical loss in a splice and eliminating a varying outer diameter and bending deformation. This splicing method splices opposing end faces of two optical fibers by fusion, and heats a formed fusion splice to match mode field diameters of the two optical fibers in the fusion splice, wherein the two optical fibers are fixed with an axial tension applied or not applied to the fusion splice, after the formation of the fusion splice, before the fusion splice is heated.
摘要翻译：提供了一种光纤接合方法，用于大大降低接头中的光损耗并消除变化的外径和弯曲变形。该拼接方法通过熔接将两个光纤相对的端面接合，并且加热形成的熔接以匹配熔接中两个光纤的模场直径，其中两个光纤被施加或未施加的轴向张力固定在融合拼接之后，在融合接头加热之前。

10. 发明授权

US06451696B1 Method for reclaiming wafer substrate and polishing solution compositions therefor 有权
标题翻译：回收晶片基板的方法及其研磨液组成
公开(公告)号：US06451696B1
公开(公告)日：2002-09-17
申请号：US09384725
申请日：1999-08-27
申请人： Yoshihiro Hara , Tetsuo Suzuki , Satoru Takada , Hidetoshi Inoue
发明人： Yoshihiro Hara , Tetsuo Suzuki , Satoru Takada , Hidetoshi Inoue
IPC分类号： H01L21302
CPC分类号： H01L21/02032
摘要： A method for reclaiming a wafer substrate material having a metallic film and a dielectric film includes a step for removing the entire metallic film and a part of the dielectric film with a chemical etching agent so as not to substantially dissolve the wafer substrate material itself, a step for removing the residual dielectric layer and the degenerated zone beneath the surface of the substrate by chemical-mechanical polishing, and a step for polishing at least one surface of the substrate.
摘要翻译：用于回收具有金属膜和电介质膜的晶片衬底材料的方法包括用化学蚀刻剂去除整个金属膜和一部分电介质膜以便基本上不溶解晶片衬底材料本身的步骤，用于通过化学机械抛光去除基底表面下面的残余介电层和退化区的步骤，以及用于抛光基底的至少一个表面的步骤。

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