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    • 1. 发明授权
    • Enhanced semiconductor integrated circuit device with a memory array and
a peripheral circuit
    • 具有存储器阵列和外围电路的增强型半导体集成电路器件
    • US5850096A
    • 1998-12-15
    • US394347
    • 1995-02-23
    • Tetsuo IzawaHiroshi GotoKoichi Hashimoto
    • Tetsuo IzawaHiroshi GotoKoichi Hashimoto
    • H01L21/768H01L29/00
    • H01L21/76895
    • A method for fabricating a semiconductor integrated circuit includes the steps of providing a conductor film on a substrate, providing an insulator film on the conductor film to form a layered structure, removing the insulator film selectively from a first part thereof corresponding to a conductor pattern to be formed, while remaining the insulator film on a second part thereof corresponding also to a conductor pattern to be formed, patterning the layered structure to form a conductor pattern defined by side walls, providing a side wall insulation to each of the side walls of the conductor pattern, providing a first local interconnect pattern on the first part of the conductor pattern such that the first local interconnect pattern establishes an electrical connection with the conductor pattern at the first part, and providing a second local interconnect pattern on the second part of the conductor pattern such that the second local interconnect pattern bridges across the conductor pattern at the second part, without establishing electrical connection therewith.
    • 一种制造半导体集成电路的方法包括以下步骤:在基板上提供导体膜,在导体膜上提供绝缘膜以形成层状结构,从对应于导体图案的第一部分选择性地去除绝缘膜, 形成,同时在其第二部分上保留绝缘膜,其也对应于要形成的导体图案,图案化层叠结构以形成由侧壁限定的导体图案,为侧壁的每个侧壁提供侧壁绝缘 在导体图案的第一部分上提供第一局部互连图案,使得第一局部互连图案在第一部分建立与导体图案的电连接,并且在第二部分上提供第二局部互连图案 导体图案,使得第二局部互连图案穿过导体图案 在第二部分,没有建立与其的电连接。
    • 2. 发明授权
    • Fabrication process of a semiconductor integrated circuit device having
a local interconnect pattern and a semiconductor integrated circuit
device fabricated according to such a fabrication process
    • 具有局部互连图案的半导体集成电路器件和根据这样的制造工艺制造的半导体集成电路器件的制造工艺
    • US5843841A
    • 1998-12-01
    • US661011
    • 1996-06-10
    • Tetsuo IzawaHiroshi GotoKoichi Hashimoto
    • Tetsuo IzawaHiroshi GotoKoichi Hashimoto
    • H01L21/768H01L21/441
    • H01L21/76895
    • A method for fabricating a semiconductor integrated circuit includes the steps of providing a conductor film on a substrate, providing an insulator film on the conductor film to form a layered structure, removing the insulator film selectively from a first part thereof corresponding to a conductor pattern to be formed, while remaining the insulator film on a second part thereof corresponding also to a conductor pattern to be formed, patterning the layered structure to form a conductor pattern defined by side walls, providing a side wall insulation to each of the side walls of the conductor pattern, providing a first local interconnect pattern on the first part of the conductor pattern such that the first local interconnect pattern establishes an electrical connection with the conductor pattern at the first part, and providing a second local interconnect pattern on the second part of the conductor pattern such that the second local interconnect pattern bridges across the conductor pattern at the second part, without establishing electrical connection therewith.
    • 一种制造半导体集成电路的方法包括以下步骤:在基板上提供导体膜,在导体膜上提供绝缘膜以形成层状结构,从对应于导体图案的第一部分选择性地去除绝缘膜, 形成,同时在其第二部分上保留绝缘膜,其也对应于要形成的导体图案,图案化层叠结构以形成由侧壁限定的导体图案,为侧壁的每个侧壁提供侧壁绝缘 在导体图案的第一部分上提供第一局部互连图案,使得第一局部互连图案在第一部分建立与导体图案的电连接,并且在第二部分上提供第二局部互连图案 导体图案,使得第二局部互连图案穿过导体图案 在第二部分,没有建立与其的电连接。
    • 3. 发明授权
    • Fixed-amount discharge squeeze container
    • 定量卸料挤压容器
    • US08915403B2
    • 2014-12-23
    • US13515084
    • 2010-12-02
    • Shinichi InabaSusumu FujinamiHiroshi Goto
    • Shinichi InabaSusumu FujinamiHiroshi Goto
    • B65D37/00G01F11/08B65D1/32B65D1/02
    • B65D1/32B65D1/0223B65D2501/0036B65D2501/0081G01F11/082
    • A fixed-amount discharge squeeze container (10) which discharges a specific amount of content liquid from a discharge port by squeeze deformation of a container body (11) includes a squeeze-deformable plastic-made container body (11) and a squeeze operating portion (14) to perform squeeze operation is arranged at a barrel portion (13) of the container body (11). The squeeze operating portion (14) has a cross-sectional shape formed with a compression face portion (16) having a mountain-like section including a pair of inclined face portions (15) arranged along two faces intersecting obtusely and a compression support portion (18) having an arc-shaped section which is jointed integrally with foot parts (19b) of the compression face portion (16) respectively via an edge line portion (17). The compression face portion (16) is restricted so as not to be flipped into a valley-like shape after the inclined face portions (15) deforms until force to expand the distance between the bilateral foot parts (19b) vanishes.
    • 通过容器主体(11)的挤压变形从排出口排出特定量的内容液的固定排出挤压容器(10)包括可挤压变形的塑料制容器体(11)和挤压操作部 (14)设置在容器主体(11)的筒部(13)处。 挤压操作部分(14)具有横截面形状,其形成有具有山形部分的压缩面部分(16),该部分包括一对倾斜面部分(15),两个倾斜面部分沿着两个相互交叉的表面和压缩支承部分 18),其具有经由边缘线部分(17)分别与所述压缩面部分(16)的脚部(19b)整体接合的弧形部分。 压缩面部(16)被限制为在倾斜面部(15)变形之后不会翻转成谷状形状,直到两侧脚部(19b)之间的距离扩大的力消失。
    • 5. 发明授权
    • Image forming method, and image formed matter
    • 图像形成方法,图像形成物
    • US08814340B2
    • 2014-08-26
    • US13388074
    • 2010-08-10
    • Hiroshi Goto
    • Hiroshi Goto
    • B41J2/01B41M5/00B41J2/21B41M7/00C09D11/00
    • B41M5/0017B41J2/2107B41M7/0018C09D11/322C09D11/38C09D11/54Y10T428/24901
    • An image forming method including: applying a pre-treatment liquid onto a coating layer provided on at least one surface of a support of a recording medium, jetting an inkjet ink onto the coating layer, onto which the pre-treatment liquid has been applied, so as to form an image, and applying or jetting a post-treatment liquid onto the coating layer, onto which the inkjet ink has been jetted, so as to form a transparent protective layer on the coating layer, wherein the inkjet ink contains the water-dispersible colorant, a water-soluble organic solvent, a surfactant, a penetrant and water, and wherein an amount of pure water transferred into the recording medium, provided with the coating layer, measured at a contact time of 100 ms with a dynamic scanning liquid absorptometer is 1 ml/m2 to 10 ml/m2, and the pre-treatment liquid contains a water-soluble aliphatic organic acid.
    • 一种图像形成方法,包括:将预处理液体施加到设置在记录介质的支撑体的至少一个表面上的涂层上,将喷墨油墨喷射到涂覆有预处理液体的涂层上, 以便形成图像,并且将后处理液体施加或喷射到已经喷射了喷墨油墨的涂层上,以在涂层上形成透明保护层,其中喷墨油墨含有水 可分散着色剂,水溶性有机溶剂,表面活性剂,渗透剂和水,并且其中转移到记录介质中的设置有涂层的纯水量在100ms的接触时间下用动态扫描 液体吸收计为1ml / m 2至10ml / m 2,预处理液含有水溶性脂肪族有机酸。
    • 7. 发明申请
    • OXIDE SINTERED BODY AND SPUTTERING TARGET
    • 氧化物烧结体和溅射目标
    • US20130341183A1
    • 2013-12-26
    • US14002768
    • 2012-03-01
    • Hiroshi GotoYuki Iwasaki
    • Hiroshi GotoYuki Iwasaki
    • C23C14/34
    • C23C14/3414C04B35/453C04B35/457C04B2235/3217C04B2235/3244C04B2235/3251C04B2235/3284C04B2235/3286C04B2235/3293C23C14/08C23C14/086H01L21/02554H01L21/02565H01L21/02631
    • Provided are an oxide sintered body and a sputtering target that are ideal for the production of an oxide semiconductor film for a display device. The oxide sintered body and sputtering target that are provided have both high conductivity and high relative density, are capable of forming an oxide semiconductor film having a high carrier mobility, and in particular, have excellent direct-current discharge stability in that long-term, stable discharge is possible, even when used by the direct-current sputtering method. The oxide sintered body of the invention is an oxide sintered body obtained by mixing and sintering zinc oxide, tin oxide, and an oxide of at least one metal (M metal) selected from the group consisting of Al, Hf, Ni, Si, Ga, In, and Ta. When the in-plane specific resistance and the specific resistance in the direction of depth are approximated by Gaussian distribution, the distribution coefficient σ of the specific resistance is 0.02 or less.
    • 提供了一种氧化物烧结体和溅射靶,其对于制造用于显示装置的氧化物半导体膜是理想的。 所提供的氧化物烧结体和溅射靶都具有高导电性和高相对密度,能够形成具有高载流子迁移率的氧化物半导体膜,并且特别地,在长期内具有优异的直流放电稳定性, 即使通过直流溅射法使用也能够稳定地进行放电。 本发明的氧化物烧结体是通过将氧化锌,氧化锡和至少一种选自Al,Hf,Ni,Si,Ga的金属(M金属)的氧化物混合并烧结而得到的氧化物烧结体 ,In和Ta。 当面内电阻率和深度方向的电阻率由高斯分布近似时,电阻率的分布系数σ为0.02以下。