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1. 发明授权

US5248886A Processing system 失效
标题翻译：加工系统
公开(公告)号：US5248886A
公开(公告)日：1993-09-28
申请号：US842421
申请日：1992-02-27
申请人： Teruo Asakawa , Tetsu Osawa , Noboru Hosaka
发明人： Teruo Asakawa , Tetsu Osawa , Noboru Hosaka
IPC分类号： B65G49/00 , C23C14/56 , C30B35/00 , H01J37/317 , H01L21/00 , H01L21/265 , H01L21/677
CPC分类号： H01L21/67069 , C30B35/005 , H01L21/67201 , H01L21/67213 , H01L21/67259 , H01L21/67745
摘要： Load lock chambers having a function of detecting positional deviation of wafers are provided in a process chamber of an ion injection apparatus, two on a carrying-in side, and two on a carrying-out side. One load lock chamber on the carrying-in side and one on the carrying-out side are used as a standby. Carrying-in carrying-out members and are outside of the process chamber. Two transfer members are in the process chamber. A dummy wafer stage is formed at a position which can be accessed by the transfer members. Wafers are transferred from load stages by the carrying-in member via the load lock chambers to the process chamber through a double operation line. Loading a wafer on the turn table and unloading a wafer therefrom can be performed simultaneously by operations of the transfer members and. The wafers are similarly carried out of the apparatus in a double operation line. At this time, dummy wafers in the process chamber can be used, if necessary.

2. 发明授权

US5357115A Processing method for wafers 失效
标题翻译：晶圆加工方法
公开(公告)号：US5357115A
公开(公告)日：1994-10-18
申请号：US109733
申请日：1993-08-20
申请人： Teruo Asakawa , Tetsu Osawa , Noboru Hosaka
发明人： Teruo Asakawa , Tetsu Osawa , Noboru Hosaka
IPC分类号： B65G49/00 , C23C14/56 , C30B35/00 , H01J37/317 , H01L21/00 , H01L21/265 , H01L21/677 , H01J37/20
CPC分类号： H01L21/67069 , C30B35/005 , H01L21/67201 , H01L21/67213 , H01L21/67259 , H01L21/67745
摘要： Load lock chambers having a function of detecting positional deviation of wafers are provided in a process chamber of an ion injection apparatus, two on a carrying-in side, and two on a carrying-out side. One load lock chamber on the carrying-in side and one on the carrying-out side are used as a standby. Carrying-in and carrying-out members are outside of the process chamber. Two transfer members are in the process chamber. A dummy wafer stage is formed at a position which can be accessed by the transfer members. Wafers are transferred from load stages by the carrying-in member via the load lock chambers to the process chamber through a double operation line. Loading a wafer on the turn table and unloading a wafer therefrom can be performed simultaneously by operations of the transfer members and. The wafers are similarly carried out of the apparatus in a double operation line. At this time, dummy wafers in the process chamber can be used, if necessary.
摘要翻译：具有检测晶片位置偏差功能的加载锁定室设置在离子注入装置的处理室中，两个位于输入侧，两个位于输出侧。使用侧的一个装载锁定室和一个在进出侧的装载锁定室用作备用。携带和携带成员在处理室之外。两个转移构件位于处理室中。虚设晶片台形成在能够被转印部件访问的位置。晶片从负载阶段通过承载构件经由负载锁定室通过双重操作线路传送到处理室。将转盘上的晶片装载并卸载晶片可以通过转印部件的操作同时进行。晶圆类似地在双重操作线中由设备执行。此时，如果需要，可以使用处理室中的虚设晶片。

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