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1. 发明授权

US07897990B2 Semiconductor light emitting element mounting member, and semiconductor light emitting device employing it 有权
标题翻译：半导体发光元件安装部件和采用该半导体发光元件的半导体发光元件
公开(公告)号：US07897990B2
公开(公告)日：2011-03-01
申请号：US10599036
申请日：2005-02-22
申请人： Teruo Amoh , Sadamu Ishidu , Kenjiro Higaki , Yasushi Tsuzuki , Hiroshi Fukuda
发明人： Teruo Amoh , Sadamu Ishidu , Kenjiro Higaki , Yasushi Tsuzuki , Hiroshi Fukuda
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor light-emitting element mounting member with an improved effective light reflectivity in a metal film serving as an electrode layer and/or a reflective layer, in which the metal layer has improved adhesion to a substrate, mechanical strength, and reliability and superior light-emitting characteristics. The semiconductor light-emitting element mounting member (a submount) is made by forming on a substrate metal films formed from Ag, Al, or an alloy containing these metals. The particle diameter of the crystal grains of the metal films is no more than 0.5 μm and the center-line average roughness Ra of the surface is no more than 0.1 μm. In a semiconductor light-emitting device, a semiconductor light-emitting element is mounted in the submount.
摘要翻译：在用作电极层和/或反射层的金属膜中具有改善的有效光反射率的半导体发光元件安装构件，其中金属层具有改善的对基板的粘附性，机械强度和可靠性以及优异的光发光特性。半导体发光元件安装构件（底座）通过在由Ag，Al或含有这些金属的合金形成的基板金属膜上形成。金属膜的晶粒的粒径不大于0.5μm，表面的中心线平均粗糙度Ra不大于0.1μm。在半导体发光装置中，半导体发光元件安装在基座中。

2. 发明申请

US20070215895A1 SEMICONDUCTOR LIGHT EMITTING ELEMENT MOUNTING MEMBER, AND SEMICONDUCTOR LIGHT EMITTING DEVICE EMPLOYING IT 有权
标题翻译：半导体发光元件安装构件和半导体发光器件使用
公开(公告)号：US20070215895A1
公开(公告)日：2007-09-20
申请号：US10599036
申请日：2005-02-22
申请人： Teruo Amoh , Sadamu Ishidu , Kenjiro Higaki , Yasushi Tsuzuki , Hiroshi Fukuda
发明人： Teruo Amoh , Sadamu Ishidu , Kenjiro Higaki , Yasushi Tsuzuki , Hiroshi Fukuda
IPC分类号： H01L31/12
CPC分类号： H01L33/60 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor light-emitting element mounting member with an improved effective light reflectivity in a metal film serving as an electrode layer and/or a reflective layer, in which the metal layer has improved adhesion to a substrate, mechanical strength, and reliability and superior light-emitting characteristics. The semiconductor light-emitting element mounting member (a submount) is made by forming on a substrate metal films formed from Ag, Al, or an alloy containing these metals. The particle diameter of the crystal grains of the metal films is no more than 0.5 μm and the center-line average roughness Ra of the surface is no more than 0.1 μm. In a semiconductor light-emitting device, a semiconductor light-emitting element is mounted in the submount.
摘要翻译：在用作电极层和/或反射层的金属膜中具有改善的有效光反射率的半导体发光元件安装构件，其中金属层具有改善的对基板的粘附性，机械强度和可靠性以及优异的光发光特性。半导体发光元件安装构件（底座）通过在由Ag，Al或含有这些金属的合金形成的基板金属膜上形成。金属膜的晶粒的粒径不大于0.5μm，表面的中心线平均粗糙度Ra不大于0.1μm。在半导体发光装置中，半导体发光元件安装在基座中。

3. 发明申请

US20060220050A1 Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same 有权
标题翻译：半导体发光装置安装构件，使用其的发光二极管构成构件和使用其的发光二极管
公开(公告)号：US20060220050A1
公开(公告)日：2006-10-05
申请号：US10569095
申请日：2004-08-18
申请人： Kenjiro Higaki , Sadamu Ishidu , Teruo Amoh , Yasushi Tsuzuki
发明人： Kenjiro Higaki , Sadamu Ishidu , Teruo Amoh , Yasushi Tsuzuki
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L33/641 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A semiconductor-light-emitting-device-mounting member BL comprises (a) a highly heat-dissipative member 1 having a main surface 10 on which connecting-use electrode layers 41 and 42 are provided to form a device-mounting area 10a and (b) a frame-shaped member 2 placed on the main surface 10 so as to surround the device-mounting area 10a. The device-mounting area 10a has an area that is 1.05 to 4 times the area of a semiconductor light-emitting device LE1. A light-emitting-diode-constituting member LE2 mounts a semiconductor light-emitting device LE1 on the device-mounting area 10a of the semiconductor-light-emitting-device-mounting member BL and has a fluorescent body and/or a protective resin LR filling the inside space of the frame-shaped member 2. A light-emitting diode LE3 mounts the light-emitting-diode-constituting member LE2 on a package 7.
摘要翻译：半导体发光装置安装构件BL包括（a）具有主表面10的高散热构件1，其上设置有连接用电极层41和42以形成装置安装区域10a和（b）以包围装置安装区域10a的方式放置在主表面10上的框状构件2。装置安装区域10a的面积是半导体发光装置LE 1的面积的1.05〜4倍。发光二极管构成部件LE2将半导体发光装置安装部件BL的半导体发光装置LE 1安装在半导体发光装置安装部件BL的装置安装区域10a上，具有荧光体和/或保护树脂LR填充框状构件2的内部空间。发光二极管LE 3将发光二极管构成部件LE 2安装在封装体7上。

4. 发明授权

US07491980B2 Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same 有权
标题翻译：半导体发光装置安装构件，使用其的发光二极管构成构件和使用其的发光二极管
公开(公告)号：US07491980B2
公开(公告)日：2009-02-17
申请号：US10569095
申请日：2004-08-18
申请人： Kenjiro Higaki , Sadamu Ishidu , Teruo Amoh , Yasushi Tsuzuki
发明人： Kenjiro Higaki , Sadamu Ishidu , Teruo Amoh , Yasushi Tsuzuki
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L33/641 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A semiconductor-light-emitting-device-mounting member BL comprises (a) a highly heat-dissipative member 1 having a main surface 10 on which connecting-use electrode layers 41 and 42 are provided to form a device-mounting area 10a and (b) a frame-shaped member 2 placed on the main surface 10 so as to surround the device-mounting area 10a. The device-mounting area 10a has an area that is 1.05 to 4 times the area of a semiconductor light-emitting device LE1. A light-emitting-diode-constituting member LE2 mounts a semiconductor light-emitting device LE1 on the device-mounting area 10a of the semiconductor-light-emitting-device-mounting member BL and has a fluorescent body and/or a protective resin LR filling the inside space of the frame-shaped member 2. A light-emitting diode LE3 mounts the light-emitting-diode-constituting member LE2 on a package 7.
摘要翻译：半导体发光装置安装构件BL包括：（a）具有主表面10的高散热构件1，其上设置有连接用电极层41和42以形成装置安装区域10a和（ b）围绕装置安装区域10a放置在主表面10上的框状构件2。装置安装区域10a的面积为半导体发光装置LE1的面积的1.05〜4倍。发光二极管构成部件LE2将半导体发光装置LE1安装在半导体发光元件安装部件BL的器件安装区域10a上，并具有荧光体和/或保护树脂LR 填充框状构件2的内部空间。发光二极管LE3将发光二极管构成构件LE2安装在封装7上。

5. 发明申请

US20090001396A1 Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode 有权
标题翻译：半导体元件安装，半导体器件，成像器件，发光二极管元件和发光二极管
公开(公告)号：US20090001396A1
公开(公告)日：2009-01-01
申请号：US11987170
申请日：2007-11-28
申请人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
发明人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
IPC分类号： H01L23/52 , H01L23/495 , H01L33/00
CPC分类号： H01L33/62 , H01L23/49827 , H01L24/97 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01004 , H01L2924/01046 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/16195 , H01L2924/3025 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K2201/09181 , H05K2201/09827 , H01L2924/00014 , H01L2924/00
摘要： A collective substrate has through-holes. The through-holes each have an interior surface including taper surfaces which are tapered as having an opening size progressively decreasing from a main surface and an external connection surface toward a minimum size hole portion. A semiconductor element mount includes an insulative member cut out of the collective substrate. An imaging device includes an imaging element mounted in a region surrounded by a frame which is bonded to the main surface of the insulative member and closed by a cover. A light emitting diode component includes a light emitting element mounted on the main surface of the insulative member with the minimum size hole portion of the through-hole being filled with an electrically conductive material, the light emitting element being sealed with a fluorescent material and/or a protective resin.
摘要翻译：集体衬底具有通孔。通孔各自具有内表面，该内表面包括锥形表面，该锥形表面具有从主表面和外部连接表面朝向最小尺寸孔部分逐渐减小的开口尺寸的锥形。半导体元件安装件包括从集体基板切出的绝缘构件。成像装置包括安装在被框架包围的区域中的成像元件，所述框架被结合到绝缘构件的主表面并被盖封闭。发光二极管部件包括安装在绝缘构件的主表面上的发光元件，通孔的最小孔部分填充有导电材料，发光元件用荧光材料和/ 或保护树脂。

6. 发明申请

US20080203420A1 Collective Substrate, Semiconductor Element Mount, Semiconductor Device, Imaging Device, Light Emitting Diode Component and Light Emitting Diode 有权
标题翻译：集成基板，半导体元件安装，半导体器件，成像装置，发光二极管部件和发光二极管
公开(公告)号：US20080203420A1
公开(公告)日：2008-08-28
申请号：US10589747
申请日：2005-07-21
申请人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
发明人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
IPC分类号： H01L33/00 , H01L23/14 , H01L31/0203 , H05K1/09
CPC分类号： H01L33/62 , H01L23/49827 , H01L24/97 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01004 , H01L2924/01046 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/16195 , H01L2924/3025 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K2201/09181 , H05K2201/09827 , H01L2924/00014 , H01L2924/00
摘要： A collective substrate (1) is produced by firing a ceramic green sheet and forming through-holes (11) in the resulting substrate. The through-holes (11) each have an interior surface including taper surfaces (11b, 11c) which are tapered as having an opening size progressively decreasing from a main surface (21) and an external connection surface (22) toward a minimum size hole portion (11a). The taper surfaces (11b, 11c) respectively form obtuse angles θ1, θ2 with the main surface (21) and the external connection surface (22). A semiconductor element mount (BL) includes an insulative member (2) cut out of the collective substrate (1). An imaging device (PE2) includes an imaging element (PE1) mounted in a region surrounded by a frame (4) which is bonded to the main surface (21) of the insulative member (2) and closed by a cover (FL). A light emitting diode component (LE2) includes a light emitting element (LE1) mounted on the main surface (21) of the insulative member (2) with the minimum size hole portion (11a) of the through-hole being filled with an electrically conductive material (33a), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE3) includes the light emitting diode component (LE2) mounted in a package (7).
摘要翻译：通过烧制陶瓷生片并在所得到的衬底中形成通孔（11）来制备集合衬底（1）。通孔（11）各自具有包括锥形表面（11b，11c）的内表面，该锥形表面（11b，11c）从开口尺寸从主表面（21）和外部连接表面（22）逐渐减小到最小大小孔部分（11a）。锥形表面（11b，11c）分别与主表面（21）和外部连接表面（22）分别形成钝角θ1，θ2。半导体元件安装件（BL）包括从集体基板（1）切出的绝缘构件（2）。成像装置（PE2）包括安装在由框架（4）包围的区域中的成像元件（PE 1），该框架结合到绝缘构件（2）的主表面（21）并由盖（FL ）。发光二极管部件（LE2）包括安装在绝缘部件（2）的主表面（21）上的发光元件（LE 1），其中填充有通孔的最小尺寸的孔部分（11a）用导电材料（33a），发光元件用荧光材料和/或保护树脂（FR）密封。发光二极管（LE 3）包括安装在封装（7）中的发光二极管部件（LE 2）。

7. 发明授权

US07504671B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07504671B2
公开(公告)日：2009-03-17
申请号：US11929492
申请日：2007-10-30
申请人： Sadamu Ishidu , Kenjiro Higaki , Takashi Ishii , Yasushi Tsuzuki
发明人： Sadamu Ishidu , Kenjiro Higaki , Takashi Ishii , Yasushi Tsuzuki
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/46 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.
摘要翻译：提供了用于充分去除由半导体元件产生的热的半导体器件。半导体装置100配备有基板2，基板2具有底面2b和位于底面2b的相反侧的元件安装面2a，半导体元件1具有安装在元件上的主表面1a 安装面2a。在L是主表面1的长度方向上的长度，H是底面2b与元件安装面2a的距离的情况下，H / L的比例为0.3以上。当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。金属层13设置在空腔2u的表面上。此外，当在主表面1a上设置连接到外部部分的电极32时，在与电极32连接的部分的空腔侧，主表面1a设置有凹槽。凹槽用于防止电极32的连接构件34向外流动。

8. 发明授权

US07335925B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07335925B2
公开(公告)日：2008-02-26
申请号：US10539926
申请日：2004-03-08
申请人： Sadamu Ishidu , Kenjiro Higaki , Takashi Ishii , Yasushi Tsuzuki
发明人： Sadamu Ishidu , Kenjiro Higaki , Takashi Ishii , Yasushi Tsuzuki
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/46 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1a and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u.
摘要翻译：提供了用于充分去除由半导体元件产生的热的半导体器件。半导体器件100配备有具有底面2b和位于底面2b的相反侧的元件安装面2a的基板2和具有主表面1a的半导体元件1，安装在元件安装表面2a上。在L表示主表面1a的长度方向上的长度a和H是底面2b与元件安装面2a之间的距离时，H / L的比例为0.3以上。当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。金属层13设置在空腔2u的表面上。

9. 发明授权

US07649270B2 Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode 有权
标题翻译：集体基板，半导体元件安装件，半导体器件，成像器件，发光二极管元件和发光二极管
公开(公告)号：US07649270B2
公开(公告)日：2010-01-19
申请号：US10589747
申请日：2005-07-21
申请人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
发明人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
IPC分类号： H01L23/29
CPC分类号： H01L33/62 , H01L23/49827 , H01L24/97 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01004 , H01L2924/01046 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/16195 , H01L2924/3025 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K2201/09181 , H05K2201/09827 , H01L2924/00014 , H01L2924/00
摘要： A collective substrate (1) is produced by firing a ceramic green sheet and forming through-holes (11) in the resulting substrate. The through-holes (11) each have an interior surface including taper surfaces (11b, 11c) which are tapered as having an opening size progressively decreasing from a main surface (21) and an external connection surface (22) toward a minimum size hole portion (11a). The taper surfaces (11b, 11c) respectively form obtuse angles θ1, θ2 with the main surface (21) and the external connection surface (22). A semiconductor element mount (BL) includes an insulative member (2) cut out of the collective substrate (1). An imaging device (PE2) includes an imaging element (PE1) mounted in a region surrounded by a frame (4) which is bonded to the main surface (21) of the insulative member (2) and closed by a cover (FL). A light emitting diode component (LE2) includes a light emitting element (LE1) mounted on the main surface (21) of the insulative member (2) with the minimum size hole portion (11a) of the through-hole being filled with an electrically conductive material (33a), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE3) includes the light emitting diode component (LE2) mounted in a package (7).
摘要翻译：通过烧制陶瓷生片并在所得到的衬底中形成通孔（11）来制备集合衬底（1）。通孔（11）各自具有包括锥形表面（11b，11c）的内表面，锥形表面（11b，11c）具有从主表面（21）和外部连接表面（22）朝向最小尺寸孔逐渐减小的开口尺寸的锥形部分（11a）。锥形表面（11b，11c）分别与主表面（21）和外部连接表面（22）形成钝角θ1，θ2。半导体元件安装件（BL）包括从集体基板（1）切出的绝缘构件（2）。成像装置（PE2）包括安装在被框架（4）包围的区域中的成像元件（PE1），该框架结合到绝缘构件（2）的主表面（21）并由盖（FL）封闭。发光二极管部件（LE2）包括安装在绝缘构件（2）的主表面（21）上的发光元件（LE1），其中通孔的最小尺寸孔部分（11a）填充有电导电材料（33a），发光元件用荧光材料和/或保护树脂（FR）密封。发光二极管（LE3）包括安装在封装（7）中的发光二极管部件（LE2）。

10. 发明申请

US20080105894A1 SEMICONDUCTOR DEVICE 有权
公开(公告)号：US20080105894A1
公开(公告)日：2008-05-08
申请号：US11929387
申请日：2007-10-30
申请人： Sadamu Ishidu , Kenjiro Higaki , Takashi Ishii , Yasushi Tsuzuki
发明人： Sadamu Ishidu , Kenjiro Higaki , Takashi Ishii , Yasushi Tsuzuki
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/46 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.

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