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1. 发明授权

US08053920B2 Compact terminal assembly for power converters 有权
标题翻译：紧凑型电源转换器端子组件
公开(公告)号：US08053920B2
公开(公告)日：2011-11-08
申请号：US12178897
申请日：2008-07-24
申请人： Terence G. Ward , George John , Edward P. Yankoski , Gregory S. Smith , James M. Nagashima
发明人： Terence G. Ward , George John , Edward P. Yankoski , Gregory S. Smith , James M. Nagashima
IPC分类号： B60L1/00
CPC分类号： H02M7/003 , H01L2224/49111
摘要： A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component.
摘要翻译：提供了一种用于功率转换器的端子组件。端子组件包括第一和第二导电部件和电流传感器。第一导电组件具有第一和第二可释放的附接结构。第二导电部件具有相应的第一和第二宽度的第一和第二部分。第一宽度小于第二宽度。第一部分通过第二可释放的连接结构可释放地附接到第一导电部件。电流传感器具有穿过其的开口并且位于第一导电部件和第二导电部件的第二部分之间，使得第一导电部件的第一部分延伸穿过开口。电流传感器响应于流过第二导电部件的第一部分的电流。

2. 发明授权

US08400775B2 Capacitor with direct DC connection to substrate 有权
标题翻译：直接与基板直接连接的电容器
公开(公告)号：US08400775B2
公开(公告)日：2013-03-19
申请号：US11774329
申请日：2007-07-06
申请人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
发明人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
IPC分类号： H05K1/18
CPC分类号： H02M7/003
摘要： A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.
摘要翻译：为功率逆变器模块提供了一个子部件。该装置包括具有端子并且集成到壳体中的电容器。衬底安装在壳体上。该基板包括功率半导体开关，并具有至少一个直流（DC）接头。直流标签直接连接到电容器的端子。

3. 发明申请

US20090009980A1 CAPACITOR WITH DIRECT DC CONNECTION TO SUBSTRATE 有权
标题翻译：直接与基板直流连接的电容器
公开(公告)号：US20090009980A1
公开(公告)日：2009-01-08
申请号：US11774329
申请日：2007-07-06
申请人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
发明人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
IPC分类号： H05K7/00 , H02M7/5387 , H05K1/00
CPC分类号： H02M7/003
摘要： A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.
摘要翻译：为功率逆变器模块提供一个子部件。该装置包括具有端子并且集成到壳体中的电容器。衬底安装在壳体上。该基板包括功率半导体开关，并具有至少一个直流（DC）接头。直流标签直接连接到电容器的端子。

4. 发明授权

US08169779B2 Power electronics substrate for direct substrate cooling 有权
标题翻译：电子电子基板用于直接基板冷却
公开(公告)号：US08169779B2
公开(公告)日：2012-05-01
申请号：US12638683
申请日：2009-12-15
申请人： Khiet Le , Terence G. Ward , Brooks S. Mann , Edward P. Yankoski , Gregory S. Smith
发明人： Khiet Le , Terence G. Ward , Brooks S. Mann , Edward P. Yankoski , Gregory S. Smith
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L25/072 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
摘要翻译：为适用于直接基板冷却的电力电子基板提供系统和装置。电力电子基板包括被配置为具有设置在其上的电路的第一表面，第二表面和第二表面上的多个物理特征。物理特征被配置为促进撞击在第二表面上的冷却剂中的湍流边界层。

5. 发明申请

US20080225482A1 SEMICONDUCTOR COOLING SYSTEM FOR USE IN ELECTRIC OR HYBRID VEHICLE 有权
标题翻译：用于电动或混合动力汽车的半导体冷却系统
公开(公告)号：US20080225482A1
公开(公告)日：2008-09-18
申请号：US11685726
申请日：2007-03-13
申请人： Gregory Scott Smith , George John , Terence G. Ward , Edward P. Yankoski , David F. Nelson
发明人： Gregory Scott Smith , George John , Terence G. Ward , Edward P. Yankoski , David F. Nelson
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.
摘要翻译：提供冷却系统以与半导体组件结合使用，所述半导体组件包括通过细长的电连接与第一半导体器件电连接的第一半导体器件和第二半导体器件。冷却系统包括流动通道，流体地联接到流动通道的泵以及流体耦合到流动通道并被配置为将冷却剂流体引导到第二半导体器件上的出口阵列。出口阵列具有形成在其中的互连特征，其构造成在其中接收细长的电连接。

6. 发明申请

US20080303056A1 SEMICONDUCTOR SUBASSEMBLIES WITH INTERCONNECTS AND METHODS FOR MANUFACTURING THE SAME 有权
标题翻译：具有互连的半导体分层及其制造方法
公开(公告)号：US20080303056A1
公开(公告)日：2008-12-11
申请号：US11758859
申请日：2007-06-06
申请人： Terence G. Ward , Edward P. Yankoski
发明人： Terence G. Ward , Edward P. Yankoski
IPC分类号： H01L29/74 , H01L21/332
CPC分类号： H01L24/40 , H01L24/37 , H01L25/072 , H01L2224/37011 , H01L2224/40091 , H01L2224/40225 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： A semiconductor subassembly is provided for use in a switching module of an inverter circuit for a high power, alternating current motor application. The semiconductor subassembly includes a wafer having first and second opposed metallized faces; a semiconductor switching device electrically coupled to the first metallized face of the wafer and having at least one electrode region; and an interconnect bonded to the semiconductor switching device. The interconnect includes a first metal layer bonded to the at least one electrode region of the semiconductor switching device, a ceramic layer bonded to the first metal layer, the ceramic layer defining a via for accessing the first metal layer, a second metal layer bonded to the ceramic layer, and a conducting substance disposed in the via of the ceramic layer to electrically couple the first metal layer to the second metal layer.
摘要翻译：提供了一种用于大功率，交流电动机应用的逆变器电路的开关模块中的半导体子组件。半导体子组件包括具有第一和第二相对的金属化面的晶片; 电耦合到所述晶片的所述第一金属化面并且具有至少一个电极区域的半导体开关器件; 以及连接到半导体开关器件的互连。互连包括结合到半导体开关器件的至少一个电极区域的第一金属层，接合到第一金属层的陶瓷层，限定用于接触第一金属层的通孔的陶瓷层，接合到第一金属层的第二金属层陶瓷层和设置在陶瓷层的通孔中的导电物质，以将第一金属层电耦合到第二金属层。

7. 发明授权

US07952875B2 Stacked busbar assembly with integrated cooling 有权
标题翻译：堆叠式母线组合，集成冷却
公开(公告)号：US07952875B2
公开(公告)日：2011-05-31
申请号：US12475005
申请日：2009-05-29
申请人： George R. Woody , Terence G. Ward , Edward P. Yankoski
发明人： George R. Woody , Terence G. Ward , Edward P. Yankoski
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L25/071 , H01L25/18 , H01L2924/0002 , H01L2924/12044 , H02M7/003 , H01L2924/00
摘要： A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system including one or more fluid channels in communication with an inlet and an outlet. The busbar assemblies are stacked such that their respective inlets and outlets are aligned and a coolant may then flow in parallel therethrough.
摘要翻译：堆叠母线组件包括两个或更多个母线组件，每个母线组件包括多个母线，其具有与其连接的一个或多个功率半导体器件（例如，IGBT，功率二极管等）。每个母线具有内部集成冷却系统，其包括与入口和出口连通的一个或多个流体通道。母线组件被堆叠成使得它们各自的入口和出口对齐，然后冷却剂可以平行流过其中。

8. 发明授权

US07612447B2 Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices 有权
标题翻译：具有延伸周期的层的半导体器件用于改进的冷却和用于冷却半导体器件的方法
公开(公告)号：US07612447B2
公开(公告)日：2009-11-03
申请号：US11758833
申请日：2007-06-06
申请人： Terence G. Ward , Edward P. Yankoski
发明人： Terence G. Ward , Edward P. Yankoski
IPC分类号： H01L23/34 , H01L23/52
CPC分类号： H01L23/4735 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device is provided, and includes a wafer having first and second opposed metallized major faces and a transistor bonded to the first metallized face of the wafer. The transistor includes a first surface, and the first surface defines a first area. The device further includes a first metal layer bonded to the first surface of the transistor. The first metal layer has a first surface that defines a second area larger than the first area of the transistor. The device further includes a ceramic layer bonded to the first surface of the first metal layer.
摘要翻译：提供半导体器件，并且包括具有第一和第二相对的金属化主面的晶片和结合到晶片的第一金属化面的晶体管。晶体管包括第一表面，并且第一表面限定第一区域。该器件还包括结合到晶体管的第一表面的第一金属层。第一金属层具有限定比晶体管的第一区域大的第二区域的第一表面。该装置还包括结合到第一金属层的第一表面的陶瓷层。

9. 发明授权

US08063440B2 Power electronics power module with imbedded gate circuitry 有权
标题翻译：带嵌入式门电路的电力电子电源模块
公开(公告)号：US08063440B2
公开(公告)日：2011-11-22
申请号：US12473632
申请日：2009-05-28
申请人： Edward P. Yankoski , Terence G. Ward , George R. Woody
发明人： Edward P. Yankoski , Terence G. Ward , George R. Woody
IPC分类号： H01L29/76 , H01L29/94
CPC分类号： H01L25/18 , H01L2924/0002 , H01L2924/13055 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/4913 , H01L2924/00
摘要： A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated.
摘要翻译：提供电力电子电源模块。电力电子功率模块包括导电衬底，具有第一和第二相对表面的电子管芯以及形成在其上的至少一个晶体管，该电子管芯安装在导电衬底上，并且至少一个晶体管被配置成使得当至少一个晶体管被激活，电流从电子管芯的第一表面流入导电衬底，以及至少部分嵌入导电衬底中的控制构件，该控制构件具有形成在其上的控制导体并电连接到所述至少一个晶体管使得当控制信号被提供给所述控制导体时，所述至少一个晶体管被激活。

10. 发明申请

US20100109351A1 SYSTEM AND METHOD FOR CLAMPING A CHASSIS COVER 审中-公开
标题翻译：用于夹紧底盘盖的系统和方法
公开(公告)号：US20100109351A1
公开(公告)日：2010-05-06
申请号：US12263155
申请日：2008-10-31
申请人： George R. Woody , Edward P. Yankoski , Terence G. Ward , Brooks S. Mann
发明人： George R. Woody , Edward P. Yankoski , Terence G. Ward , Brooks S. Mann
IPC分类号： B65D45/34 , B65D45/32
CPC分类号： F16B5/0635 , Y10T292/214 , Y10T292/216 , Y10T292/221
摘要： A system is provided for securing a cover having a first surface onto a chassis having a rim, the rim having a second surface. The system comprises a clamping rail and a fastener coupled to the rail. The clamping rail is configured to form a loop that circumferentially engages the first surface and the second surface and, when constricted, produces a first force substantially coplanar with the loop. The fastener is configured to constrict the rail, the rail and the first and second surfaces configured to produce a second force having a component substantially orthogonal to the loop when the rail is constricted.
摘要翻译：提供了一种用于将具有第一表面的盖固定到具有边缘的底架上的系统，所述边缘具有第二表面。该系统包括夹紧轨道和联接到轨道的紧固件。夹紧轨道构造成形成环，其环绕第一表面和第二表面接合，并且当收缩时产生与环基本上共面的第一力。紧固件被构造成收缩轨道，轨道以及被构造成当轨道收缩时产生具有与环路基本正交的分量的第二力的第二和第二表面。

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