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    • 2. 发明申请
    • ACTIVE ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    • 主动阵列基板及其制造方法
    • US20130043474A1
    • 2013-02-21
    • US13481962
    • 2012-05-29
    • Wen-Chung TANGFang-An SHUYao-Chou TSAITed-Hong SHINN
    • Wen-Chung TANGFang-An SHUYao-Chou TSAITed-Hong SHINN
    • H01L29/786H01L21/336
    • H01L27/1288
    • Disclosed herein is a method for manufacturing an active array substrate. The method includes the steps of: forming a first patterned metal layer on a substrate; sequentially forming a semiconductor layer, an insulating layer and a second metal layer to cover the first patterned metal layer; forming a patterned photoresist layer on the second metal layer; patterning the second metal layer, the insulating layer and the semiconductor layer to form a second patterned metal layer, a patterned insulating layer and a patterned semiconductor layer, and removing a portion of the patterned photoresist layer; heating the remained portion of the patterned photoresist layer such that the remained portion is fluidized and transformed into a protective layer; and forming a pixel electrode.
    • 这里公开了一种制造有源阵列基板的方法。 该方法包括以下步骤:在衬底上形成第一图案化金属层; 依次形成半导体层,绝缘层和第二金属层以覆盖第一图案化金属层; 在所述第二金属层上形成图案化的光致抗蚀剂层; 图案化第二金属层,绝缘层和半导体层以形成第二图案化金属层,图案化绝缘层和图案化半导体层,以及去除图案化光致抗蚀剂层的一部分; 加热图案化光致抗蚀剂层的剩余部分,使得剩余部分被流化并转变成保护层; 并形成像素电极。