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1. 发明授权

US07552759B2 Loop-type heat exchange device 失效
标题翻译：环型热交换装置
公开(公告)号：US07552759B2
公开(公告)日：2009-06-30
申请号：US11306421
申请日：2005-12-28
申请人： Tay-Jian Liu , Chao-Nien Tung , Chih-Peng Lee , Chuen-Shu Hou , Chih-Hao Yang
发明人： Tay-Jian Liu , Chao-Nien Tung , Chih-Peng Lee , Chuen-Shu Hou , Chih-Hao Yang
IPC分类号： F28D15/00
CPC分类号： F28F3/02 , F28D15/0266 , F28D15/043 , F28D15/046 , F28D2015/0216 , F28F2210/02 , H01L2924/0002 , H01L2924/00
摘要： A loop-type heat exchange device (10) is disclosed, which includes an evaporator (20), a condenser (40), a vapor conduit (30) and a liquid conduit (50). The evaporator contains therein a working fluid. The working fluid in the evaporator evaporates into vapor after absorbing heat, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases its latent heat of evaporation and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The condenser defines therein a chamber, and a plurality of heat-exchange pins is provided inside the chamber for effectively exchanging heat with the vapor entering into the condenser.
摘要翻译：公开了一种环型热交换装置（10），其包括蒸发器（20），冷凝器（40），蒸汽导管（30）和液体导管（50）。蒸发器包含工作流体。蒸发器中的工作流体在吸收热量后蒸发成蒸气，产生的蒸汽经由蒸气导管流到冷凝器，蒸发器释放蒸发潜热并冷凝成冷凝物。冷凝液然后通过液体导管返回到蒸发器，从而形成传热回路。冷凝器在其中限定一个室，并且在室内部设置多个热交换销，用于与进入冷凝器的蒸气有效地交换热量。

2. 发明授权

US07472479B2 Heat pipe and method of producing the same 失效
标题翻译：热管及其制造方法
公开(公告)号：US07472479B2
公开(公告)日：2009-01-06
申请号：US11307155
申请日：2006-01-26
申请人： Chuen-Shu Hou , Chao-Nien Tung , Tay-Jian Liu , Chih-Hao Yang , Kuo-Chu Hsieh
发明人： Chuen-Shu Hou , Chao-Nien Tung , Tay-Jian Liu , Chih-Hao Yang , Kuo-Chu Hsieh
IPC分类号： B21D53/06 , B23P6/00 , B23P19/04 , F28D15/00
CPC分类号： F28D15/046 , B23P15/26 , B23P2700/09 , F28D15/0283 , Y10T29/49353 , Y10T29/49377 , Y10T29/53113
摘要： A heat pipe (50) and a method (100) of producing the heat pipe are disclosed. The method includes the following steps: (1) inserting a mandrel (10) into a hollow metal casing (20) with a porous structure (30) combined to an outer surface of the mandrel; (2) filling powders (40) into a space formed between the hollow metal casing and the porous structure; (3) sintering the filled powders; (4) drawing the mandrel out of the hollow metal casing; and (5) sealing the hollow metal casing with a working fluid filled therein. The heat pipe produced by this method includes a composite wick structure (60) arranged in the hollow metal casing. By using this method, the mandrel can be easily drawn out of the hollow metal casing after the filled powders are sintered.
摘要翻译：公开了一种制热管的热管（50）和方法（100）。该方法包括以下步骤：（1）将心轴（10）插入中空金属壳体（20）中，多孔结构（30）组合到心轴的外表面; （2）将粉末（40）填充到形成在中空金属壳体和多孔结构之间的空间中; （3）烧结填充的粉末; （4）将心轴从中空金属外壳中拉出; 和（5）用填充在其中的工作流体密封中空金属外壳。通过该方法制造的热管包括布置在中空金属壳体中的复合芯结构（60）。通过使用该方法，在填充的粉末被烧结之后，心轴可以容易地从中空金属壳体中拉出。

3. 发明授权

US07360583B2 Integrated liquid cooling system for electronic components 失效
标题翻译：电子元件集成液体冷却系统
公开(公告)号：US07360583B2
公开(公告)日：2008-04-22
申请号：US11308275
申请日：2006-03-15
申请人： Tay-Jian Liu , Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou
发明人： Tay-Jian Liu , Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28D2021/0029 , H01L2924/0002 , H01L2924/00
摘要： An integrated liquid cooling system (100) includes a pump (10), a mounting base (15), a heat dissipating member (20). The mounting base defines therein a through hole (151). The heat dissipating member is mounted to and maintained in fluid communication with the mounting base. The pump is received in the through hole of the mounting base. The pump has a bottom plate for thermally contacting a heat generating component and is configured for driving a coolant to circulate through the mounting base and the heat dissipating member. The pump, the mounting base and the heat dissipating member of the liquid cooling system are combined together to form an integrated and compact structure without utilizing any connecting pipes or fittings.
摘要翻译：集成液体冷却系统（100）包括泵（10），安装基座（15），散热构件（20）。安装基座在其中限定有通孔（151）。散热构件被安装并保持与安装基座的流体连通。泵被容纳在安装基座的通孔中。泵具有用于热接触发热部件的底板，并且构造成用于驱动冷却剂循环通过安装基座和散热构件。液体冷却系统的泵，安装基座和散热构件组合在一起，形成一体化且紧凑的结构，而不用任何连接管或配件。

4. 发明申请

US20060283577A1 LOOP-TYPE HEAT EXCHANGE DEVICE 失效
标题翻译：环型热交换器
公开(公告)号：US20060283577A1
公开(公告)日：2006-12-21
申请号：US11306421
申请日：2005-12-28
申请人： Tay-Jian Liu , Chao-Nien Tung , Chih-Peng Lee , Chuen-Shu Hou , Chih-Hao Yang
发明人： Tay-Jian Liu , Chao-Nien Tung , Chih-Peng Lee , Chuen-Shu Hou , Chih-Hao Yang
IPC分类号： F28D15/04
CPC分类号： F28F3/02 , F28D15/0266 , F28D15/043 , F28D15/046 , F28D2015/0216 , F28F2210/02 , H01L2924/0002 , H01L2924/00
摘要： A loop-type heat exchange device (10) is disclosed, which includes an evaporator (20), a condenser (40), a vapor conduit (30) and a liquid conduit (50). The evaporator contains therein a working fluid. The working fluid in the evaporator evaporates into vapor after absorbing heat, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases its latent heat of evaporation and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The condenser defines therein a chamber, and a plurality of heat-exchange pins is provided inside the chamber for effectively exchanging heat with the vapor entering into the condenser.
摘要翻译：公开了一种环型热交换装置（10），其包括蒸发器（20），冷凝器（40），蒸汽导管（30）和液体导管（50）。蒸发器包含工作流体。蒸发器中的工作流体在吸收热量后蒸发成蒸气，产生的蒸汽经由蒸气导管流到冷凝器，蒸发器释放蒸发潜热并冷凝成冷凝物。冷凝液然后通过液体导管返回到蒸发器，从而形成传热回路。冷凝器在其中限定一个室，并且在室内部设置多个热交换销，用于与进入冷凝器的蒸气有效地交换热量。

5. 发明授权

US07757750B2 Integrated cooling system for electronic components 失效
标题翻译：电子元件集成冷却系统
公开(公告)号：US07757750B2
公开(公告)日：2010-07-20
申请号：US11309293
申请日：2006-07-21
申请人： Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou , Tay-Jian Liu
发明人： Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou , Tay-Jian Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/046 , F28D2021/0029 , F28D2021/0031 , H01L2924/0002 , H01L2924/00
摘要： A cooling system for removing heat from a heat generating component, includes a base (100) and a heat sink (200) mounted on the base. The base includes a bottom wall (20) and a side wall (10) surrounding the bottom wall. The bottom wall and the side wall cooperatively define a space (40) receiving working fluid therein. The heat sink defines an evaporating passage (220) and a condensing passage (230) therein. The two passages are in fluid communication with the space. Cooperatively the space and the passages define a loop for circulating the working fluid therein. The working fluid has a phase change for dissipating heat generated by a heat-generating electronic component.
摘要翻译：用于从发热部件除去热的冷却系统包括安装在基座上的基座（100）和散热片（200）。底座包括底壁（20）和围绕底壁的侧壁（10）。底壁和侧壁协同地限定在其中容纳工作流体的空间（40）。散热器在其中限定了蒸发通道（220）和冷凝通道（230）。两个通道与空间流体连通。合作地，空间和通道限定用于在其中循环工作流体的回路。工作流体具有用于耗散由发热电子部件产生的热量的相位变化。

6. 发明申请

US20070034353A1 INTEGRATED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS 失效
标题翻译：电子元件集成液体冷却系统
公开(公告)号：US20070034353A1
公开(公告)日：2007-02-15
申请号：US11308278
申请日：2006-03-15
申请人： Tay-Jian Liu , Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou
发明人： Tay-Jian Liu , Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28D1/05366 , F28D15/00 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： An integrated liquid cooling system (100) includes a heat absorbing member (10), a heat dissipating member (20) and a pump (15). The heat absorbing member defines therein a fluid flow channel (115) for passage of a coolant. The heat dissipating member is mounted to and maintained in fluid communication with the heat absorbing member. The pump is received in the heat dissipating member and is maintained in fluid communication with the heat absorbing member and the heat dissipating member. The pump is configured for driving the coolant to circulate through the heat absorbing member and the heat dissipating member. The components (i.e., the heat absorbing member, the heat dissipating member and the pump) of the liquid cooling system are combined together to form an integrated structure without utilizing any separate connecting pipes.
摘要翻译：集成液体冷却系统（100）包括吸热构件（10），散热构件（20）和泵（15）。吸热构件中限定有用于冷却剂通过的流体流动通道（115）。散热构件安装在该吸热构件上并保持与吸热构件的流体连通。泵被容纳在散热构件中并且与吸热构件和散热构件保持流体连通。泵构造成用于驱动冷却剂循环通过吸热构件和散热构件。液体冷却系统的部件（即，吸热部件，散热部件和泵）组合在一起形成一体的结构，而不用任何单独的连接管。

7. 发明申请

US20070023167A1 INTEGRATED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS 失效
标题翻译：电子元件集成液体冷却系统
公开(公告)号：US20070023167A1
公开(公告)日：2007-02-01
申请号：US11308275
申请日：2006-03-15
申请人： Tay-Jian Liu , Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou
发明人： Tay-Jian Liu , Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28D2021/0029 , H01L2924/0002 , H01L2924/00
摘要： An integrated liquid cooling system (100) includes a pump (10), a mounting base (15), a heat dissipating member (20). The mounting base defines therein a through hole (151). The heat dissipating member is mounted to and maintained in fluid communication with the mounting base. The pump is received in the through hole of the mounting base. The pump has a bottom plate for thermally contacting a heat generating component and is configured for driving a coolant to circulate through the mounting base and the heat dissipating member. The pump, the mounting base and the heat dissipating member of the liquid cooling system are combined together to form an integrated and compact structure without utilizing any connecting pipes or fittings.
摘要翻译：集成液体冷却系统（100）包括泵（10），安装基座（15），散热构件（20）。安装基座在其中限定有通孔（151）。散热构件被安装并保持与安装基座的流体连通。泵被容纳在安装基座的通孔中。泵具有用于热接触发热部件的底板，并且构造成用于驱动冷却剂循环通过安装基座和散热构件。液体冷却系统的泵，安装基座和散热构件组合在一起，形成一体化且紧凑的结构，而不用任何连接管或配件。

8. 发明授权

US07380585B2 Loop-type heat exchange module 失效
标题翻译：环型热交换模块
公开(公告)号：US07380585B2
公开(公告)日：2008-06-03
申请号：US11306358
申请日：2005-12-25
申请人： Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Hao Yang
发明人： Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Hao Yang
IPC分类号： F28D15/02
CPC分类号： F28D15/0266 , F28D15/0275 , F28D15/046 , F28F3/022 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A loop-type heat exchange module (10) is disclosed, which includes an evaporator (11), a vapor conduit (12), a condenser (13), a liquid conduit (14), a cooling fan (16), a fastening seat (151) and a fan cover (152). The evaporator contains therein a working fluid. The working fluid evaporates into vapor after absorbing heat in the evaporator, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases the heat and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The cooling fan is applied to produce a forced airflow towards the condenser. The fastening seat is used for fastening the evaporator to have an intimate contact with a heat-generating electronic component. The fan cover extends from one side of the fastening seat and receives the cooling fan and the condenser therein.
摘要翻译：公开了一种环形热交换模块（10），其包括蒸发器（11），蒸汽导管（12），冷凝器（13），液体导管（14），冷却风扇（16）座（151）和风扇罩（152）。蒸发器包含工作流体。在蒸发器中吸收热量之后，工作流体蒸发成蒸汽，并且所产生的蒸气经由蒸汽导管流到冷凝器，蒸气释放热量并冷凝成冷凝物。冷凝液然后通过液体导管返回到蒸发器，从而形成传热回路。施加冷却风扇以产生朝向冷凝器的强制气流。紧固座用于紧固蒸发器以与发热电子部件紧密接触。风扇盖从紧固座的一侧延伸，并接收冷却风扇和冷凝器。

9. 发明申请

US20070006994A1 LOOP-TYPE HEAT EXCHANGE DEVICE 审中-公开
标题翻译：环型热交换器
公开(公告)号：US20070006994A1
公开(公告)日：2007-01-11
申请号：US11306455
申请日：2005-12-29
申请人： Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Feng Fan , Chih-Hao Yang
发明人： Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Feng Fan , Chih-Hao Yang
IPC分类号： F28D15/04
CPC分类号： F28D15/043 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： A loop-type heat exchange device (10) is disclosed, which includes an evaporator (20), a condenser (40), a vapor conduit (30) and a liquid conduit (50). The evaporator defines therein a chamber for containing a working fluid. The chamber is divided into an evaporating region and a micro-channel region. The working fluid in the evaporator evaporates into vapor after absorbing heat at the evaporating region, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases its latent heat of evaporation and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The evaporator is configured in such a manner that an amount of vapor to be formed and accumulated in the micro-channel region can be minimized.
摘要翻译：公开了一种环型热交换装置（10），其包括蒸发器（20），冷凝器（40），蒸汽导管（30）和液体导管（50）。蒸发器在其中限定了用于容纳工作流体的室。室被分为蒸发区和微通道区。在蒸发区吸收热量后，蒸发器中的工作流体蒸发成蒸气，产生的蒸汽经由蒸汽导管流到冷凝器，蒸发器释放其蒸发潜热并冷凝成冷凝物。冷凝液然后通过液体导管返回到蒸发器，从而形成传热回路。蒸发器被配置成使得要在微通道区域中形成和积聚的蒸汽的量最小化。

10. 发明授权

US07418996B2 Integrated liquid cooling system for electronic components 失效
标题翻译：电子元件集成液体冷却系统
公开(公告)号：US07418996B2
公开(公告)日：2008-09-02
申请号：US11308278
申请日：2006-03-15
申请人： Tay-Jian Liu , Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou
发明人： Tay-Jian Liu , Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou
IPC分类号： F28D15/00 , F28F7/02
CPC分类号： H01L23/473 , F28D1/05366 , F28D15/00 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： An integrated liquid cooling system (100) includes a heat absorbing member (10), a heat dissipating member (20) and a pump (15). The heat absorbing member defines therein a fluid flow channel (115) for passage of a coolant. The heat dissipating member is mounted to and maintained in fluid communication with the heat absorbing member. The pump is received in the heat dissipating member and is maintained in fluid communication with the heat absorbing member and the heat dissipating member. The pump is configured for driving the coolant to circulate through the heat absorbing member and the heat dissipating member. The components (i.e., the heat absorbing member, the heat dissipating member and the pump) of the liquid cooling system are combined together to form an integrated structure without utilizing any separate connecting pipes.
摘要翻译：集成液体冷却系统（100）包括吸热构件（10），散热构件（20）和泵（15）。吸热构件中限定有用于冷却剂通过的流体流动通道（115）。散热构件安装在该吸热构件上并保持与吸热构件的流体连通。泵被容纳在散热构件中并且与吸热构件和散热构件保持流体连通。泵构造成用于驱动冷却剂循环通过吸热构件和散热构件。液体冷却系统的部件（即，吸热部件，散热部件和泵）组合在一起形成一体的结构，而不用任何单独的连接管。

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