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    • 1. 发明申请
    • Production method of multilayer ceramic electronic device
    • 多层陶瓷电子器件的生产方法
    • US20070074806A1
    • 2007-04-05
    • US11527574
    • 2006-09-27
    • Tatsuya KojimaRaitaro MasaokaTakako Murosawa
    • Tatsuya KojimaRaitaro MasaokaTakako Murosawa
    • C03B29/00
    • C04B35/4682C04B35/638C04B2235/3206C04B2235/3208C04B2235/3225C04B2235/3236C04B2235/3239C04B2235/3241C04B2235/3418C04B2235/5445C04B2235/6562C04B2235/6565C04B2235/6567C04B2235/6582C04B2235/6584C04B2235/6588C04B2235/663H01G4/0085H01G4/12H01G4/30
    • By a production method for producing a multilayer ceramic electronic device including dielectric layers and internal electrode layers comprising the steps of forming a green sheet to be said dielectric layer after firing, forming a pre-fired electrode layer to be said internal electrode layer after firing in a predetermined pattern on said green sheet by using a conductive material paste, forming a green chip by successively stacking said green sheets and said pre-fired electrode layers, and firing said green chip: wherein the conductive material paste for forming said pre-fired electrode layer is composed at least of conductive material particles, a first common material composed of ceramic powder and a second common material composed of ceramic powder having a larger average particle diameter than that of said first common material; an average particle diameter of said first common material is 1/20 to ½ of an average particle diameter of said conductive material particles; and the average particle diameter of said second common material is 1/10 to ½ of an average thickness of said internal electrode layers after firing; a multilayer ceramic electronic device, such as a multilayer ceramic capacitor, wherein arising of cracks is effectively prevented, having a low short-circuit defect rate, a low voltage resistance defect rate and high capacitance is produced.
    • 通过制造包括电介质层和内部电极层的多层陶瓷电子器件的制造方法,包括以下步骤:在烧成后形成作为所述电介质层的生片,在烧成后形成作为所述内部电极层的预烧电极层 通过使用导电材料浆料在所述生片上的预定图案,通过连续堆叠所述生片和所述预烧电极层形成绿色芯片,并烧制所述生芯片:其中用于形成所述预烧电极的导电材料糊 至少由导电材料颗粒构成的第一普通材料,由陶瓷粉末组成的第一普通材料和平均粒径大于所述第一普通材料的陶瓷粉末的第二普通材料; 所述第一普通材料的平均粒径为所述导电材料颗粒的平均粒径的1/20至1/2; 所述第二普通材料的平均粒径为烧成后的内部电极层的平均厚度的1/10〜1/2; 可以有效地防止出现裂纹的多层陶瓷电子器件,如多层陶瓷电容器,具有低的短路缺陷率,低电压电阻缺陷率和高电容。