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    • 10. 发明授权
    • Method for manufacturing multilayer wiring substrate
    • 多层布线基板的制造方法
    • US08580066B2
    • 2013-11-12
    • US13372088
    • 2012-02-13
    • Erina YamadaHironori Sato
    • Erina YamadaHironori Sato
    • B29C65/52B32B37/02B32B37/12B32B38/10B32B38/04B32B43/00C09J5/00
    • H05K3/4682H01L2924/15174H05K3/0097H05K2201/09536H05K2201/0959H05K2203/1536Y10T156/1056
    • A method for manufacturing a reliable multilayer wiring substrate at a relatively low cost having little or no warpage or distortion is provided. In certain embodiments an insulation core made of an insulation material that is more rigid than that of resin insulation layers is prepared. A through hole is formed through core upper and lower surfaces of the insulation core, and a through hole conductor is formed therein. A plate-like substrate is prepared, and resin insulation layers and at least one conductor layer are laminated on the substrate to form a first buildup layer. The insulation core is laminated on the first buildup layer so as to electrically connect the conductor layer and the through hole conductor. Resin insulation layers and at least one conductor layer are then laminated on the insulation core. Lastly, the substrate is separated from the first buildup layer to yield a multilayer wiring substrate.
    • 提供了具有很少或没有翘曲或变形的成本较低的可靠的多层布线基板的制造方法。 在某些实施例中,制备由绝缘材料制成的绝缘芯,该绝缘芯比树脂绝缘层更硬。 通过绝缘芯的中心和下表面形成通孔,并在其中形成通孔导体。 制备板状基板,在基板上层叠树脂绝缘层和至少一层导体层,形成第一累积层。 绝缘芯层压在第一堆积层上,以电连接导体层和通孔导体。 树脂绝缘层和至少一个导体层然后层压在绝缘芯上。 最后,将基板与第一堆积层分离,得到多层布线基板。