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1. 发明授权

US3999031A Method for electron-beam welding of dissimilar metals 失效
标题翻译：异种金属电子束焊接方法
公开(公告)号：US3999031A
公开(公告)日：1976-12-21
申请号：US546016
申请日：1975-01-31
申请人： Tatsuo Yonezawa , Takamitsu Nakazaki , Hisanao Kita , Tomohiko Shida
发明人： Tatsuo Yonezawa , Takamitsu Nakazaki , Hisanao Kita , Tomohiko Shida
IPC分类号： B23K9/23 , B23K15/00 , F01D9/04
CPC分类号： B23K15/0006 , B23K9/232 , F01D9/044
摘要： A method whereby defect-free welds can be produced in joining metallic members of dissimilar materials by electron-beam welding. The method consists in inserting one of the metallic members in openings formed in a metallic plate of the same material as the other metallic member and welding one metallic member to the metallic plate by providing a weld metal, providing by overlay welding on the weld metal a padding metal of a material substantially similar to that of the other metallic member but lower in oxygen content, effecting machining of the outer surface of the padding metal to form a faying surface, and joining by electron beam welding the faying surface of the padding metal to a faying surface formed on the other metallic member whereby the faying surfaces can be rigidly welded.
摘要翻译：可以通过电子束焊接在不同材料的金属构件中产生无缺陷焊接的方法。该方法包括将金属构件中的一个插入形成在与另一金属构件相同的材料的金属板中的开口中，并通过提供焊接金属将一个金属构件焊接到金属板上，通过焊接金属上的覆盖焊接填充金属的材料基本上类似于另一个金属构件的材料，但是氧含量较低，进行填充金属的外表面的加工以形成引线表面，以及通过电子束焊接填充金属的引线表面与形成在另一个金属部件上的接合表面，由此可以刚性地焊接接合面。

2. 发明授权

US3935417A Welding of copper and iron 失效
标题翻译：铜和铁的焊接
公开(公告)号：US3935417A
公开(公告)日：1976-01-27
申请号：US388500
申请日：1973-08-15
申请人： Tomio Umino , Munenobu Suzuki , Tomohiko Shida
发明人： Tomio Umino , Munenobu Suzuki , Tomohiko Shida
IPC分类号： B23K9/23 , B23K9/02 , B23K15/00 , B23K35/00 , B23K35/30
CPC分类号： B23K35/004 , B23K35/302 , B23K35/3093
摘要： A method for welding copper or a copper base alloy and iron or an iron base alloy characterized in that an element for enhancing the mutual miscibility of copper and iron and an element for refining the crystal grains of the weld metal is added to weld metal in a total amount of 1 to 25 percent by weight based on the weld metal, thereby preventing the welded portion from crack formation and segregation.
摘要翻译：一种用于焊接铜或铜基合金和铁或铁基合金的方法，其特征在于，将用于提高铜和铁的相互混溶性的元素和用于精炼焊接金属的晶粒的元素添加到焊接金属中总计为1〜25重量％，从而防止焊接部分的裂纹形成和偏析。

3. 发明授权

US4367017A Laser beam reflection system 失效
标题翻译：激光束反射系统
公开(公告)号：US4367017A
公开(公告)日：1983-01-04
申请号：US190202
申请日：1980-09-24
申请人： Ryutarou Jimbou , Tomio Umino , Tomohiko Shida , Tomio Iizuka , Shoji Isobe
发明人： Ryutarou Jimbou , Tomio Umino , Tomohiko Shida , Tomio Iizuka , Shoji Isobe
IPC分类号： B23K26/00 , B23K26/02 , B23K26/08 , B23K26/14 , B23K26/20 , B23K26/28 , G02B17/06 , G02B27/14 , G02B27/64 , G02B5/10
CPC分类号： B23K26/147 , B23K26/02 , B23K26/035 , B23K26/0643 , B23K26/08 , B23K26/082 , B23K26/28 , G02B19/0019 , G02B19/0047 , G02B27/642
摘要： A laser beam reflection system for applying a laser beam to an area to be treated. The laser beam reflection system has a hollow head housing, first reflecting mirror means disposed in the rotary head housing and adapted to deflect the laser beam introduced into the rotary head housing away from the axis, second reflecting mirror means disposed in the rotary head housing and adapted to reflect the laser beam coming from the first reflecting mirror means to such a direction as to traverse the axis, and third reflecting mirror means disposed in the head housing movably in the direction traversing the axis and adapted to reflect and focus onto the area the laser beam coming from the second reflecting mirror means. The laser beam reflection system of the invention can be used for welding, surface treatment, heat treatment, cutting of various materials, and a light source of laser communication systems.
摘要翻译：一种用于将激光束施加到待处理区域的激光束反射系统。激光束反射系统具有中空头壳体，第一反射镜装置设置在旋转磁头外壳中，并适于将引入旋转磁头外壳的激光束偏离轴线，第二反射镜装置设置在旋转磁头外壳中，适于将来自第一反射镜装置的激光束反射到穿过轴线的方向，以及第三反射镜装置，其沿着穿过轴线的方向可移动地设置在头部外壳中，并且适于反射和聚焦到该区域上来自第二反射镜装置的激光束。本发明的激光束反射系统可用于焊接，表面处理，热处理，各种材料的切割以及激光通信系统的光源。

4. 发明授权

US4740866A Sealed-type liquid cooling device with expandable bellow for semiconductor chips 失效
标题翻译：用于半导体芯片的可膨胀波纹管的密封式液体冷却装置
公开(公告)号：US4740866A
公开(公告)日：1988-04-26
申请号：US843623
申请日：1986-03-25
申请人： Ryoichi Kajiwara , Takao Funamoto , Mitsuo Katoo , Tomohiko Shida , Takeshi Matsuzaka , Hiroshi Wachi , Kazuya Takahashi
发明人： Ryoichi Kajiwara , Takao Funamoto , Mitsuo Katoo , Tomohiko Shida , Takeshi Matsuzaka , Hiroshi Wachi , Kazuya Takahashi
IPC分类号： H01L23/473 , H01L23/433 , H05K7/20
CPC分类号： H01L23/4336 , H01L23/4332 , H01L24/32 , H01L2224/73253
摘要： A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion and is combined with a semiconductor chip through the electrical insulating layer; and a bellows which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.
摘要翻译：半导体模块冷却结构包括具有冷却流体流过的通道的壳体; 冷却流体从所述壳体供给到所述冷却块，并且在所述底部具有电绝缘层并通过所述电绝缘层与半导体芯片组合; 以及连接在壳体和冷却块之间的波纹管。冷却流体通过波纹管供应到冷却块。波纹管形成为使得多个大致平面的环状金属板被层压，压制，扩散，接合，然后进行拉伸和模制。

5. 发明授权

US4315130A Method of treating object by laser beam and apparatus therefor 失效
标题翻译：用激光束处理物体的方法及其设备
公开(公告)号：US4315130A
公开(公告)日：1982-02-09
申请号：US16167
申请日：1979-02-28
申请人： Masahisa Inagaki , Ryutarou Jinbou , Tomio Unino , Tomohiko Shida
发明人： Masahisa Inagaki , Ryutarou Jinbou , Tomio Unino , Tomohiko Shida
IPC分类号： B23K26/06 , B23K26/067 , B23K26/073 , C21D1/09 , B23K27/00
CPC分类号： B23K26/0608 , B23K26/067 , B23K26/073 , Y10S148/093
摘要： There are disclosed a laser treatment method and an apparatus therefor in which a laser beam is irradiated on an object to be treated. The laser beam emitted from a laser apparatus is divided into a plurality of fractional beams, and the fractional laser beams are reflected toward and irradiated on an area to be irradiated of the object being treated after being compounded such that energy density distribution on the irradiated area is made substantially uniform in at least one direction.
摘要翻译：公开了一种激光治疗方法及其装置，其中激光束照射在被处理物上。从激光装置发射的激光束被分成多个分数束，并且分数激光束在被复合后被反射并照射到待被处理物体的待照射区域上，使得照射区域上的能量密度分布在至少一个方向上基本上均匀。

6. 发明授权

US4996589A Semiconductor module and cooling device of the same 失效
标题翻译：半导体模块和冷却装置相同
公开(公告)号：US4996589A
公开(公告)日：1991-02-26
申请号：US258609
申请日：1988-10-17
申请人： Ryoichi Kajiwara , Takao Funamoto , Mituo Kato , Hiroshi Wachi , Tomohiko Shida
发明人： Ryoichi Kajiwara , Takao Funamoto , Mituo Kato , Hiroshi Wachi , Tomohiko Shida
IPC分类号： H01L23/433
CPC分类号： H01L23/433 , H01L23/4332 , H01L2224/16 , H01L2224/48247 , H01L2224/73253 , H01L24/48 , H01L2924/00014 , H01L2924/01068 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/181
摘要： A number of LSI chips (9) are mounted on a wiring substrate (12). A cooling element (68) comprises a housing (1), a bellows (2) and a cooling plate (6) for introducing a cooling medium. The cooling element is connected to the LSI chip by low melting solder, at the same time, the cooling plate is connected to the wiring substrate through a skirt (5) which is connected to the cooling plate and also connected to the wiring substrate by a low melting solder.
摘要翻译：多个LSI芯片（9）安装在布线基板（12）上。冷却元件（68）包括壳体（1），波纹管（2）和用于引入冷却介质的冷却板（6）。冷却元件通过低熔点焊料与LSI芯片连接，同时冷却板通过与冷却板连接的裙部（5）连接到布线基板，并且还通过一个低熔点焊料。

7. 发明授权

US4809058A Integrated circuit device 失效
标题翻译：集成电路器件
公开(公告)号：US4809058A
公开(公告)日：1989-02-28
申请号：US941812
申请日：1986-12-15
申请人： Takao Funamoto , Ryoichi Kajiwara , Mituo Katou , Takeshi Matsuzaka , Tomohiko Shida , Hiroshi Wachi , Kazuya Takahashi , Masatoshi Watanabe , Minoru Yamada , Keiichirou Nakanishi , Katuo Sugawara
发明人： Takao Funamoto , Ryoichi Kajiwara , Mituo Katou , Takeshi Matsuzaka , Tomohiko Shida , Hiroshi Wachi , Kazuya Takahashi , Masatoshi Watanabe , Minoru Yamada , Keiichirou Nakanishi , Katuo Sugawara
IPC分类号： H01L23/473 , H01L23/538 , H05K1/02 , H05K1/03 , H05K7/20 , H01L23/02 , H01L25/04 , H01L39/02
CPC分类号： H05K1/0373 , H01L23/473 , H01L23/5383 , H01L23/5385 , H05K1/0272 , H01L2924/0002 , H05K2201/0209 , H05K2201/0251 , H05K2201/064
摘要： An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof. This integrated circuit device has a power source substrate of a remarkably high heat radiating efficiency, and is suitably used as an integrated circuit device having integrated circuit chips mounted with a high density on a wiring substrate therein.
摘要翻译：一种集成电路装置，其特征在于，在其一面上安装有集成电路芯片的布线基板，与所述布线基板的另一面接触而形成的叠层结构的电源基板，通过交替层叠多个馈电导体层导电金属和多个电绝缘材料的电绝缘层，并且将层叠层结合在一起;将布线基板和电源基板彼此电连接的装置，以及至少插入至少馈电导体层或电绝缘层，并且适于将发生在电源基板中的热辐射到其外部。该集成电路装置具有显着高的散热效率的电源基板，并且适合用作集成电路装置，其中集成电路芯片以高密度安装在其布线基板上。

8. 发明授权

US3944779A Process for fusion-welding iron-nickle-cobalt alloy and copper or said alloy, copper and iron 失效
标题翻译：铁 - 镍 - 钴合金和铜或所述合金，铜和铁的熔接工艺
公开(公告)号：US3944779A
公开(公告)日：1976-03-16
申请号：US485252
申请日：1974-07-02
申请人： Tomio Umino , Munenobu Suzuki , Tomohiko Shida
发明人： Tomio Umino , Munenobu Suzuki , Tomohiko Shida
IPC分类号： B23K9/23 , B23K35/30 , C22C9/00 , C22C19/00 , C22C38/00 , B23K15/00
CPC分类号： B23K35/3066 , B23K35/302
摘要： In a process for fusion-welding a binary combination of an iron alloy containing 50 % by weight or less of nickel and cobalt combined and copper; or a ternary combination of said iron alloy, copper, and iron, including the steps of bringing members of said binary combination or ternary combination into gapless contact with one another and subjecting the contact zone to a treatment including at least one of electron beam welding, laser beam welding, plasma welding, and TIG welding without use of a filler metal, an improvement which is characterized by supplying welding energy necessary to form in the welding zone molten weld metal having such a width and depth that have been determined from the composition and thickness of said base metals so that the composition of the weld metal may fall within the specified area in a diagram, shown in FIG. 1, representing composition of a three component system, said specified area being enclosed with straight lines connecting successively the point X (97 wt-% Cu, 2 wt-% Fe, 1 wt-% Ni + Co), the point Y (2 wt-% Cu, 49 wt-% Fe, 49 wt-% Ni + Co), the point Z (2 wt-% Cu, 97 wt-% Fe, 1 wt-% Ni + Co), and the point X except for the area enclosed with straight lines connecting successively the point a (35 wt-% Cu, 32.5 wt-% Fe, 32.5 wt-% Ni + Co), the point b (10 wt-% Cu, 45 wt-% Fe, 45 wt-% Ni + Co), the point c (8 wt-% Cu, 91 wt-% Fe, 1 wt-% Ni + Co), the point d (45 wt-% Cu, 54 wt-% Fe, 1 wt-% Ni + Co), and the point a. According to this improved process, development of weld cracking can be prevented.
摘要翻译：在熔融焊接含有50重量％以下的镍和钴的铜合金和铜的二元组合的方法中，或所述铁合金，铜和铁的三元组合，包括使所述二元组合或三元组合的构件彼此无间隙接触的步骤，并对接触区进行包括电子束焊接，激光束焊接，等离子体焊接和TIG焊接，而不使用填充金属，其特征在于提供在焊接区域形成熔融焊缝金属所需的焊接能量，该焊接金属具有从组合物确定的这种宽度和深度，所述贱金属的厚度使得焊接金属的组成可以在图中所示的图中落在指定区域内。如图1所示，表示三组分体系的组成，所述指定区域用连接点X（97重量％Cu，2重量％Fe，1重量％Ni + Co），点Y（2）重量％Cu，49重量％Fe，49重量％Ni + Co），点Z（2重量％Cu，97重量％Fe，1重量％Ni + Co）和点X除外对于连续连接点a（35重量％Cu，32.5重量％Fe，32.5重量％Ni + Co），点b（10重量％Cu，45重量％Fe， 45重量％Ni + Co），点c（8重量％Cu，91重量％Fe，1重量％Ni + Co），点d（45重量％Cu，54重量％Fe， 1重量％Ni + Co），和a点。根据该改进方法，可以防止焊缝开裂的发展。

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