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    • 4. 发明授权
    • Glass antenna
    • 玻璃天线
    • US5952977A
    • 1999-09-14
    • US556754
    • 1995-11-02
    • Tatsuaki TaniguchiKazuo ShigetaKenji Kubota
    • Tatsuaki TaniguchiKazuo ShigetaKenji Kubota
    • H01Q1/12H05B3/84H01Q1/32
    • H05B3/84H01Q1/1278H05B2203/002
    • A glass antenna system with good rear visibility. A glass antenna has a first antenna conductor element extending on a blank region where no defogger hot wires extend, a second antenna conductor element which is capacitively coupled to the first antenna conductor element in a defogger region, a third antenna conductor element which extends at a position substantially symmetrical to the first antenna conductor element about the central line of the defogger, and a fourth antenna conductor element which extends at a position substantially symmetrical to the second antenna conductor element about the central line, and is capacitively coupled to the third antenna conductor element.
    • 玻璃天线系统具有良好的后视距。 玻璃天线具有在没有除雾器热线延伸的空白区域上延伸的第一天线导体元件,在除雾器区域电容耦合到第一天线导体元件的第二天线导体元件,在第一天线导体元件 位于与除雾器的中心线周围的第一天线导体元件基本对称的位置;以及第四天线导体元件,其在与第二天线导体元件基本对称的位置处围绕中心线延伸,并且电容耦合到第三天线导体 元件。
    • 9. 发明申请
    • CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME
    • 导电构件及其制造方法
    • US20110266035A1
    • 2011-11-03
    • US12998700
    • 2009-07-09
    • Takeshi SakuraiSeiichi IshikawaKenji KubotaTakashi Tamagawa
    • Takeshi SakuraiSeiichi IshikawaKenji KubotaTakashi Tamagawa
    • H05K1/03H05K3/00
    • C25D5/505C25D5/12C25D5/50C25D7/00H01R13/03Y10T29/49124Y10T428/12708
    • [Object] To provide a conductive member which has a stable contact resistance, is difficult to be separated, and also decreases the inserting and drawing force when used for a connector.[Means to Solve Problems] A Cu—Sn intermetallic compound layer 3 and an Sn-based surface layer 4 are formed in this order on the surface of a Cu-based substrate 1 through an Ni-based base layer 2, and, furthermore, the Cu—Sn intermetallic compound layer 3 is composed of a Cu3Sn layer 5 arranged on the Ni-based base layer 2 and a Cu6Sn5 layer 6 arranged on the Cu3Sn layer 5; the Cu—Sn intermetallic compound layer 3 obtained by bonding the Cu3Sn layer 5 and the Cu6Sn5 layer 6 is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer 4; thicknesses X of the recessed portions 7 are set to 0.05 μm to 1.5 μm, the area coverage of the Cu3Sn layer 5 with respect to the Ni-based base layer 2 is 60% or higher, the ratio of the thicknesses of the projected portions 8 to the thicknesses Y of the recessed portions 7 in the Cu—Sn intermetallic compound layer 3 is 1.2 to 5, and the average thickness of the Cu3Sn layer 5 is 0.01 μm to 0.5 μm.[Selected Drawing] FIG. 1
    • 为了提供具有稳定的接触电阻的导电构件,难以分离,并且当用于连接器时也降低了插入和拉伸力。 解决问题的方法通过Ni基基层2,在Cu基基板1的表面上依次形成Cu-Sn金属间化合物层3和Sn系表面层4,此外, Cu-Sn金属间化合物层3由设置在Ni基基底层2上的Cu 3 Sn层5和设置在Cu 3 Sn层5上的Cu 6 Sn 5层6构成。 通过结合Cu 3 Sn层5和Cu 6 Sn 5层6而获得的Cu-Sn金属间化合物层3在与Sn基表面层4接触的表面上设置有凹凸部。 凹部7的厚度X设定为0.05μm〜1.5μm,Cu3Sn层5相对于Ni系基底层2的面积覆盖率为60%以上,凸部8的厚度比 Cu-Sn金属间化合物层3中的凹部7的厚度Y为1.2〜5,Cu 3 Sn层5的平均厚度为0.01〜0.5μm。 [所选图] 1