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1. 发明授权

US08454407B2 Polishing method and apparatus 有权
标题翻译：抛光方法和设备
公开(公告)号：US08454407B2
公开(公告)日：2013-06-04
申请号：US12511344
申请日：2009-07-29
申请人： Taro Takahashi , Motohiro Niijima , Akihiko Ogawa
发明人： Taro Takahashi , Motohiro Niijima , Akihiko Ogawa
IPC分类号： B24B49/12
CPC分类号： B24B37/013 , B24B49/105
摘要： A polishing method polishes and planarizes a substrate. The substrate is pressed against a polishing surface on a rotating polishing table. During polishing, the polishing table is rotated, and the surface, being polished, of the substrate is scanned by an eddy current sensor provided in the polishing table. An output of the eddy current sensor is monitored, and substrate damage is detected from a change in the output of the eddy current sensor. Further, an output of an end point detecting sensor obtained by scanning the surface of the substrate is monitored, and the polishing end point is detected from a change in the output of the end point detecting sensor. After detecting the polishing end point, an output of the end point detecting sensor or another sensor is monitored, and detecting a film left on a part of the substrate is performed.
摘要翻译：抛光方法抛光和平坦化基底。将衬底压在旋转的抛光台上的抛光表面上。在抛光期间，抛光台旋转，并且通过设置在抛光台中的涡流传感器扫描基板的抛光表面。监测涡流传感器的输出，并根据涡流传感器输出的变化检测基板损坏。此外，监视通过扫描基板的表面而获得的端点检测传感器的输出，并且根据端点检测传感器的输出的变化来检测抛光终点。在检测到抛光终点之后，监测端点检测传感器或另一传感器的输出，并且检测留在基板的一部分上的膜。

2. 发明申请

US20100035516A1 POLISHING METHOD AND APPARATUS 有权
标题翻译：抛光方法和装置
公开(公告)号：US20100035516A1
公开(公告)日：2010-02-11
申请号：US12511344
申请日：2009-07-29
申请人： Taro TAKAHASHI , Motohiro Niijima , Akihiko Ogawa
发明人： Taro TAKAHASHI , Motohiro Niijima , Akihiko Ogawa
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/105
摘要： The present invention relates to a polishing method and apparatus for polishing and planarizing an object to be polished (substrate) such as a semiconductor wafer. The substrate as an object to be polished is pressed against a polishing surface on a rotating polishing table in the polishing method. During polishing of the substrate, the polishing table is rotated, and the surface, being polished, of the substrate is scanned by an eddy current sensor provided in the polishing table. An output of the eddy current sensor obtained by scanning the surface, being polished, of the substrate is monitored, and damage of the substrate is detected from a change in the output of the eddy current sensor. Further, an output of an endpoint detecting sensor obtained by scanning the surface, being polished, of the substrate is monitored, and the polishing end point is detected from a change in the output of the end point detecting sensor. After detecting the polishing end point, an output of the endpoint detecting sensor or a different sensor is monitored, and monitoring of the remaining film for detecting a film left on a part of the substrate is performed.
摘要翻译：本发明涉及用于抛光和平面化待抛光物体（衬底）如半导体晶片的抛光方法和装置。作为研磨对象的基板在研磨方法中被压靠在旋转研磨台上的研磨面上。在抛光基板期间，旋转抛光台，并且通过设置在抛光台中的涡流传感器来扫描基板的抛光表面。监测通过扫描基板表面而获得的涡流传感器的输出，并根据涡电流传感器的输出的变化来检测基板的损坏。此外，监视通过扫描基板的表面而获得的端点检测传感器的输出，并根据端点检测传感器的输出的变化来检测抛光终点。在检测到抛光终点之后，监视端点检测传感器或不同传感器的输出，并且执行用于检测留在基板的一部分上的膜的剩余膜的监视。

3. 发明申请

US20090096446A1 Polishing monitoring method, polishing apparatus and monitoring apparatus 有权
标题翻译：抛光监测方法，抛光装置和监测装置
公开(公告)号：US20090096446A1
公开(公告)日：2009-04-16
申请号：US12285674
申请日：2008-10-10
申请人： Taro Takahashi , Yoichi Kobayashi , Shinrou Ohta , Akihiko Ogawa
发明人： Taro Takahashi , Yoichi Kobayashi , Shinrou Ohta , Akihiko Ogawa
IPC分类号： G01B7/06
CPC分类号： G01B7/105
摘要： The present invention provides a method for monitoring a change in thickness of a conductive film brought into sliding contact with a polishing surface of a polishing pad using an eddy current sensor. The output signal of the eddy current sensor comprises two signals corresponding to a resistance component and an inductive reactance component of an impedance of an electric circuit including a coil of the eddy current sensor. The method includes acquiring the output signal of the eddy current sensor when the eddy current sensor is facing the conductive film, defining the two signals as coordinates on a coordinate system, repeating the acquiring of the output signal and the defining of the coordinates, determining a center of curvature of an arc specified by at least three sets of coordinates on the coordinate system, determining an angle of inclination of a line connecting the center of curvature and a latest one of the at least three sets of coordinates, and monitoring a change in thickness of the conductive film by monitoring a change in the angle of inclination.
摘要翻译：本发明提供一种用于使用涡流传感器监测与抛光垫的抛光表面滑动接触的导电膜的厚度变化的方法。涡电流传感器的输出信号包括对应于包括涡流传感器的线圈的电路的阻抗的电阻分量和电抗分量的两个信号。该方法包括当涡流传感器面向导电膜时获取涡流传感器的输出信号，将两个信号定义为坐标系上的坐标，重复获取输出信号和定义坐标，确定由坐标系上的至少三组坐标指定的圆弧的曲率中心，确定连接曲率中心的直线和最小三个坐标系中的最近一个的线的倾斜角度，通过监测倾斜角度的变化来确定导电膜的厚度。

4. 发明授权

US08078419B2 Polishing monitoring method and polishing apparatus 有权
标题翻译：抛光监测方法和抛光装置
公开(公告)号：US08078419B2
公开(公告)日：2011-12-13
申请号：US12285604
申请日：2008-10-09
申请人： Yoichi Kobayashi , Taro Takahashi , Yasumasa Hiroo , Akihiko Ogawa , Shinrou Ohta
发明人： Yoichi Kobayashi , Taro Takahashi , Yasumasa Hiroo , Akihiko Ogawa , Shinrou Ohta
IPC分类号： G06F19/00 , B24B49/00 , G01B7/06 , G01B5/02 , G01R19/00 , G01C17/38
CPC分类号： G01B7/105 , B24B37/042 , B24B49/105
摘要： A method monitors a change in film thickness during polishing using an eddy current sensor. This method includes acquiring an output signal of the eddy current sensor as a correction signal value during water-polishing of a substrate, during dressing of the polishing pad, or during replacement of the polishing pad, calculating a correcting amount from a difference between the correction signal value and a predetermined correction reference value, calculating an actual measurement signal value by subtracting the correction amount from the output signal of the eddy current sensor when polishing a substrate having a conductive film, and monitoring a change in thickness of the conductive film during polishing by monitoring a change in the actual measurement signal value.
摘要翻译：一种方法使用涡流传感器监测抛光过程中膜厚度的变化。该方法包括在修整抛光垫期间或在更换抛光垫期间获取涡流传感器的输出信号作为衬底的水抛光期间的校正信号值，或者在抛光垫的更换期间，从校正之间的差计算校正量信号值和预定的校正基准值，通过在研磨具有导电膜的基板时从涡电流传感器的输出信号中减去校正量，并且在抛光期间监测导电膜的厚度变化来计算实际测量信号值通过监视实际测量信号值的变化。

5. 发明申请

US20090104847A1 Polishing monitoring method and polishing apparatus 有权
标题翻译：抛光监测方法和抛光装置
公开(公告)号：US20090104847A1
公开(公告)日：2009-04-23
申请号：US12285604
申请日：2008-10-09
申请人： Yoichi Kobayashi , Taro Takahashi , Yasumasa Hiroo , Akihiko Ogawa , Shinrou Ohta
发明人： Yoichi Kobayashi , Taro Takahashi , Yasumasa Hiroo , Akihiko Ogawa , Shinrou Ohta
IPC分类号： B24B51/00
CPC分类号： G01B7/105 , B24B37/042 , B24B49/105
摘要： The present invention provides a method of monitoring a change in film thickness during polishing using an eddy current sensor. This method includes acquiring an output signal of the eddy current sensor as a correction signal value during water-polishing of a substrate, during dressing of the polishing pad, or during replacement of the polishing pad, calculating a correcting amount from a difference between the correction signal value and a predetermined correction reference value, calculating an actual measurement signal value by subtracting the correction amount from the output signal of the eddy current sensor when polishing a substrate having a conductive film, and monitoring a change in thickness of the conductive film during polishing by monitoring a change in the actual measurement signal value.
摘要翻译：本发明提供一种使用涡流传感器来监测在抛光期间膜厚变化的方法。该方法包括在修整抛光垫期间或在更换抛光垫期间获取涡流传感器的输出信号作为衬底的水抛光期间的校正信号值，或者在抛光垫的更换期间，从校正之间的差计算校正量信号值和预定的校正基准值，通过在研磨具有导电膜的基板时从涡电流传感器的输出信号中减去校正量，并且在抛光期间监测导电膜的厚度变化来计算实际测量信号值通过监视实际测量信号值的变化。

6. 发明授权

US09068814B2 Polishing monitoring method, polishing apparatus and monitoring apparatus 有权
标题翻译：抛光监测方法，抛光装置和监测装置
公开(公告)号：US09068814B2
公开(公告)日：2015-06-30
申请号：US12285674
申请日：2008-10-10
申请人： Taro Takahashi , Yoichi Kobayashi , Shinrou Ohta , Akihiko Ogawa
发明人： Taro Takahashi , Yoichi Kobayashi , Shinrou Ohta , Akihiko Ogawa
IPC分类号： G01B7/06
CPC分类号： G01B7/105
摘要： A method monitors a change in thickness of a conductive film brought into sliding contact with a polishing surface of a polishing pad using an eddy current sensor. The output signal of the eddy current sensor includes two signals corresponding to a resistance component and an inductive reactance component of an impedance of an electric circuit including a coil of the eddy current sensor. The method includes acquiring the output signal of the eddy current sensor when the eddy current sensor is facing the conductive film, defining the two signals as coordinates on a coordinate system, repeating the acquiring of the output signal and the defining of the coordinates, determining a center of curvature of an arc specified by at least three sets of coordinates on the coordinate system, determining an angle of inclination of a line connecting the center of curvature and a latest one of the at least three sets of coordinates, and monitoring a change in thickness of the conductive film by monitoring a change in the angle of inclination.
摘要翻译：一种方法使用涡流传感器监测与抛光垫的抛光表面滑动接触的导电膜的厚度变化。涡电流传感器的输出信号包括对应于包括涡流传感器的线圈的电路的阻抗的电阻分量和电抗分量的两个信号。该方法包括当涡流传感器面向导电膜时获取涡流传感器的输出信号，将两个信号定义为坐标系上的坐标，重复获取输出信号和定义坐标，确定由坐标系上的至少三组坐标指定的圆弧的曲率中心，确定连接曲率中心的直线和最小三个坐标系中的最近一个的线的倾斜角度，通过监测倾斜角度的变化来确定导电膜的厚度。

7. 发明授权

US6041840A Vacuum lamination device and a vacuum lamination method 失效
标题翻译：真空层压装置和真空层压方法
公开(公告)号：US6041840A
公开(公告)日：2000-03-28
申请号：US74375
申请日：1998-05-08
申请人： Akihiko Ogawa
发明人： Akihiko Ogawa
IPC分类号： B29C43/36 , B29C43/18 , B29C43/20 , B29C43/34 , B29C43/56 , B29L9/00 , B29L31/34 , H05K3/02 , B32B31/00
CPC分类号： B32B37/1018 , B29C2043/3647 , H05K3/022
摘要： Film bodies are provided on opposing surfaces of an upper platen and a lower platen, and a frame is provided on the lower platen. The frame forms a forming room when the upper platen and the lower platen are brought close to each other. One film body is fixed on a heater having a given flexibility and rigidity. The upper platen includes a flow path through which a coolant is circulated. A recessed portion is formed on the lower surface of the upper platen under the film body. The material to be formed is pressurized by the film bodies due to a pressure reduction caused by depressurizing the forming room without reducing its capacity, in a state in which the film body is separated from the recessed portion and heated by the heater. Then, the material is cooled while in tight contact with the recessed portion.
摘要翻译：膜体设置在上压板和下压板的相对表面上，框架设置在下压板上。当上压板和下压板彼此靠近时，框架形成成形室。一个胶片体固定在具有给定柔韧性和刚度的加热器上。上压板包括冷却剂循环通过的流路。在薄膜主体下方的上板的下表面上形成有凹部。在膜体与凹部分离并被加热器加热的状态下，由于由成形室减压引起的压力降低，膜形成体的材料被膜体加压而不降低其容量。然后，与凹部紧密接触地冷却材料。

8. 发明授权

US06738763B1 Information retrieval system having consistent search results across different operating systems and data base management systems 失效
标题翻译：信息检索系统在不同的操作系统和数据库管理系统之间具有一致的搜索结果
公开(公告)号：US06738763B1
公开(公告)日：2004-05-18
申请号：US09603772
申请日：2000-06-26
申请人： Hiroyuki Suzuki , Masaaki Mitani , Masayoshi Itakura , Akihiko Ogawa , Hirotoshi Fujibe
发明人： Hiroyuki Suzuki , Masaaki Mitani , Masayoshi Itakura , Akihiko Ogawa , Hirotoshi Fujibe
IPC分类号： G06F1730
CPC分类号： G06F17/30666 , Y10S707/99932 , Y10S707/99933 , Y10S707/99935 , Y10S707/99936 , Y10S707/99937
摘要： An information retrieval system whereby identical search results can be derived irrespective of the kind of DBMS or OS. A keyword normalizing device normalizes a keyword transmitted from a client through a network. A normalized data searching device then searches normalized data in a data storage section for data corresponding to the normalized keyword, and supplies the data to source data acquiring device. The source data acquiring device acquires source data associated with the normalized data supplied thereto, from among source data in the data storage section, and supplies the acquired source data to a sorting device. The sorting device first sorts the normalized data and then the source data in order of the sorted normalized data, and supplies the resulting source data to a source data supply device. The source data supply device transmits the source data to the client through the network.
摘要翻译：一种信息检索系统，可以得出相同的搜索结果，而不管DBMS或OS的种类如何。关键字归一化设备将通过网络从客户端发送的关键字规范化。归一化数据搜索装置然后在数据存储部分中搜索与归一化关键字相对应的数据的标准化数据，并将数据提供给源数据获取装置。源数据获取装置从数据存储部分的源数据中获取与其提供的归一化数据相关联的源数据，并将获取的源数据提供给分类装置。排序装置首先按照分类的归一化数据的顺序对归一化数据和源数据进行排序，并将得到的源数据提供给源数据提供装置。源数据提供设备通过网络将源数据发送给客户端。

9. 发明授权

US06469643B1 Information processing system 失效
公开(公告)号：US06469643B1
公开(公告)日：2002-10-22
申请号：US09603577
申请日：2000-06-26
申请人： Hiroyuki Suzuki , Masaaki Mitani , Masayoshi Itakura , Akihiko Ogawa , Hirotoshi Fujibe
发明人： Hiroyuki Suzuki , Masaaki Mitani , Masayoshi Itakura , Akihiko Ogawa , Hirotoshi Fujibe
IPC分类号： H03M700
CPC分类号： H03M7/30
摘要： An information processing system for normalizing an input character string and storing the normalized character string is provided whereby the required storage capacity can be cut down. Normalizing means normalizes an input character string, for example, , and generates , which is then supplied to restoration information generating means and storing means. The restoration information generating means is supplied also with the original character string , besides the normalized character string , and generates restoration information “F@&” consisting of ASCII characters, which is supplied to storing means. The storing means stores the normalized character string and the restoration information “F@&” in a manner associated with each other. When the normalized character string stored in the storing means is specified, restoring means acquires the corresponding restoration information “F@&” and, based on the acquired information, restores the original information . Consequently, the required storage capacity of the storing means can be cut down, compared with the case of storing also the input character string .

10. 发明授权

US5143935A Benzamide derivatives 失效
标题翻译：苯甲酸衍生物
公开(公告)号：US5143935A
公开(公告)日：1992-09-01
申请号：US777011
申请日：1991-10-16
申请人： Hiromichi Fujiwara , Akihiko Ogawa , Hideyo Sakiyama , Toshiaki Tamura
发明人： Hiromichi Fujiwara , Akihiko Ogawa , Hideyo Sakiyama , Toshiaki Tamura
IPC分类号： A61K31/40 , A61P1/00 , C07D207/14
CPC分类号： C07D207/14
摘要： A benzamide derivative represented by the formula: ##STR1## having a promoting activity of gastrointestinal tract and pharmacentical composition containing the same.

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