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    • 1. 发明授权
    • Apparatus and method for plasma processing
    • 等离子体处理装置及方法
    • US08574446B2
    • 2013-11-05
    • US12536137
    • 2009-08-05
    • Tamotsu MorimotoTakahiro Murakami
    • Tamotsu MorimotoTakahiro Murakami
    • H01L21/00C23F1/00B44C1/22
    • H01J37/32568H01J37/32082
    • At the time of plasma igniting or during plasma processing, only optimizing the distance between electrodes in each case caused a limitation to the prevention of charging damage. To resolve this, a novel plasma processing method employs a plasma processing apparatus which includes an upper electrode to which first high-frequency power is applied, a lower electrode to which second high-frequency power is applied, and a lift mechanism for controlling the spacing between the upper and lower electrodes. The first high-frequency power is applied to the upper electrode to cause plasma igniting. The method is adapted to make the spacing between the upper and lower electrodes larger at least at the time of plasma extinction than during plasma processing of a wafer on the lower electrode.
    • 在等离子体点火或等离子体处理时,仅在每种情况下优化电极之间的距离会对防止充电损坏造成限制。 为了解决这个问题,一种新颖的等离子体处理方法采用等离子体处理装置,其包括施加第一高频功率的上电极,施加第二高频电力的下电极和用于控制间隔的升降机构 在上下电极之间。 将第一高频功率施加到上电极以引起等离子体点火。 该方法适于使得上等电极和下电极之间的间隔至少在等离子体消光时比在下电极上的晶片的等离子体处理期间更大。
    • 2. 发明申请
    • Apparatus and method for plasma processing
    • 等离子体处理装置及方法
    • US20050000654A1
    • 2005-01-06
    • US10796116
    • 2004-03-10
    • Tamotsu MorimotoTakahiro Murakami
    • Tamotsu MorimotoTakahiro Murakami
    • H01L21/3065H01J37/32C23F1/00
    • H01J37/32568H01J37/32082
    • At the time of plasma igniting or during plasma processing, only optimizing the distance between electrodes in each case caused a limitation to the prevention of charging damage. To resolve this, a novel plasma processing method employs a plasma processing apparatus which includes an upper electrode to which first high-frequency power is applied, a lower electrode to which second high-frequency power is applied, and a lift mechanism for controlling the spacing between the upper and lower electrodes. The first high-frequency power is applied to the upper electrode to cause plasma igniting. The method is adapted to make the spacing between the upper and lower electrodes larger at least at the time of plasma extinction than during plasma processing of a wafer on the lower electrode.
    • 在等离子体点火或等离子体处理时,仅在每种情况下优化电极之间的距离会对防止充电损坏造成限制。 为了解决这个问题,一种新颖的等离子体处理方法采用等离子体处理装置,其包括施加第一高频功率的上电极,施加第二高频电力的下电极和用于控制间隔的升降机构 在上下电极之间。 将第一高频功率施加到上电极以引起等离子体点火。 该方法适于使得上等电极和下电极之间的间隔至少在等离子体消光时比在下电极上的晶片的等离子体处理期间更大。
    • 4. 发明申请
    • ANTIREFLECTOR AND DISPLAY DEVICE
    • 防反射和显示设备
    • US20100014163A1
    • 2010-01-21
    • US12493262
    • 2009-06-29
    • Tamotsu MorimotoMichihisa Tomida
    • Tamotsu MorimotoMichihisa Tomida
    • G02B1/11B32B7/02
    • G02B1/115G02B1/116Y10T428/24942
    • There are provided an antireflector having a simple layer structure, a high visible light transmittance, a low visible light reflectance and an excellent anti-fingerprint property, and a display device having an excellent viewability.An antireflector 1 including a substrate 10 and an antireflection film 20; the antireflection film 20 having a first high refractive index layer 22, a metal layer 24, a second high refractive index layer 26 and a low refractive index layer 28 disposed therein sequentially from a substrate side facing the substrate 1; the first high refractive index layer containing at least one member selected from the group consisting of tin, gallium and cerium in the form of an oxide, and indium in the form of an oxide; the metal layer containing silver and palladium and having a palladium content of from 3 to 20 mass % relative to the total amount of the metal layer (100 mass %); the second high refractive index layer containing at least one member selected from the group consisting of tin, gallium and cerium in the form of an oxide and indium in the form of an oxide. A display device including the antireflector 1 disposed on an observer' side of a display panel.
    • 提供了具有简单的层结构,高可见光透射率,低可见光反射率和优异的抗指纹性的抗反射器,以及具有优异的可视性的显示装置。 包括基板10和抗反射膜20的抗反射器1; 具有从面向衬底1的衬底侧依次设置的第一高折射率层22,金属层24,第二高折射率层26和低折射率层28的抗反射膜20; 所述第一高折射率层含有选自氧化物形式的锡,镓和铈中的至少一种,氧化物形式的铟; 含有银和钯的金属层,相对于金属层的总量为100质量%,钯含量为3〜20质量%。 所述第二高折射率层含有选自氧化物形式的锡,镓和铈和氧化物形式的铟中的至少一种。 一种显示装置,包括设置在显示面板的观察者侧的防反射体1。
    • 5. 发明授权
    • Method of etching
    • 蚀刻方法
    • US06812151B1
    • 2004-11-02
    • US09233073
    • 1999-01-19
    • Kenichi NanbuTamotsu Morimoto
    • Kenichi NanbuTamotsu Morimoto
    • H01L21302
    • H01J37/321H01L21/3065
    • An etching method is carried out by an etching system comprising a gas supply port for supplying an etching gas, a plasma producing vessel defining a plasma producing chamber in which the etching gas is converted into a plasma to produce radicals, a reaction vessel connected to the plasma producing vessel and defining a reaction chamber of a diameter greater than that of the plasma producing chamber, a support table placed in the reaction chamber to support an object to be processed to be etched by the radicals flowing down thereto from the plasma producing chamber, and a vacuum exhaust system for evacuating the reaction chamber. The etching gas is supplied through the etching gas supply port at an etching gas supply rate of 8.4 sccm or above per a substantial volume of one liter of the reaction chamber.
    • 通过蚀刻系统进行蚀刻方法,该蚀刻系统包括用于供给蚀刻气体的气体供给口,限定等离子体生成室的等离子体生成容器,其中蚀刻气体被转换成等离子体以产生自由基,反应容器连接到 等离子体产生容器并且限定直径大于等离子体产生室直径的反应室;支撑台,放置在反应室中,以支撑待处理对象被从等离子体产生室向下流动的自由基蚀刻, 以及用于抽空反应室的真空排气系统。 通过蚀刻气体供给口以相对于1升反应室的体积为8.4sccm以上的蚀刻气体供给量供给蚀刻气体。
    • 6. 发明授权
    • Heat processing apparatus
    • 热处理设备
    • US5567152A
    • 1996-10-22
    • US420075
    • 1995-04-11
    • Tamotsu Morimoto
    • Tamotsu Morimoto
    • H01L21/22C23C16/48C30B25/10C30B31/12H01L21/00H01L21/205H01L21/31H01L21/324F27D3/12
    • H01L21/67109C23C16/481C30B25/10C30B31/12
    • A heat processing apparatus for subjecting heat processing to a wafer by heating includes a reaction tube for containing the wafers, a heating element provided around the reaction tube, for heating an inside of the reaction tube, a plurality of heat radiating members provided concentrically around the heating element with an airtight space between the heating element and an innermost one of the heat radiating members and airtight spaces between the heat radiating members, and a pressure-reducing device for reducing the pressure of these airtight spaces. In this heat processing apparatus, the pressures of the airtight spaces are reduced by the pressure-reducing means at least when the temperature of the inside of the reaction tube is increased.
    • 用于通过加热对晶片进行热处理的热处理装置包括:用于容纳晶片的反应管,设置在反应管周围的加热元件,用于加热反应管的内部;多个散热构件,其围绕 加热元件与加热元件之间的气密空间和散热构件中的最内侧之间以及散热构件之间的气密空间,以及用于降低这些气密空间的压力的减压装置。 在该热处理装置中,至少在反应管内部的温度升高时,通过减压装置降低气密空间的压力。
    • 9. 发明授权
    • Apparatus for and method of processing an object to be processed
    • 用于处理待处理物体的装置和方法
    • US06793834B2
    • 2004-09-21
    • US10197859
    • 2002-07-19
    • Tamotsu Morimoto
    • Tamotsu Morimoto
    • H01L21302
    • H01J37/32623H01J37/3266H01J37/3405
    • A magnetron reactive ion etching apparatus comprises: an electrode unit including electrodes facing each other through a semiconductor device; a high-frequency power source forming an electric field on the electrode unit; a dipole ring magnet; and a switching mechanism. The dipole ring magnet forms the first magnetic field state, including a magnetic field in a direction perpendicular to a direction of the electric field or in a direction parallel to the semiconductor device, and the second magnetic field state, including a magnetic field whose strength at the periphery of the surface of the semiconductor device is so satisfactory that an electron Larmor radius is larger than the mean free path of electrons. The first magnetic field state is switched to the second magnetic field state at a predetermined timing by the switching mechanism which is controlled by a controller.
    • 磁控管反应离子蚀刻装置包括:电极单元,其包括通过半导体器件彼此面对的电极; 在所述电极单元上形成电场的高频电源; 偶极环磁铁; 和切换机构。 偶极环磁体形成第一磁场状态,包括在垂直于电场方向的方向上或在与半导体器件平行的方向上的磁场,以及第二磁场状态,包括磁场强度 半导体器件的表面的周边如此令人满意,使得电子拉莫尔半径大于电子的平均自由程。 第一磁场状态通过由控制器控制的切换机构在预定定时切换到第二磁场状态。