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    • 6. 发明授权
    • Method of manufacturing stamper
    • 制造压模的方法
    • US07938978B2
    • 2011-05-10
    • US12691491
    • 2010-01-21
    • Takuya ShimadaShinobu SugimuraYoshiyuki KamataMasatoshi Sakurai
    • Takuya ShimadaShinobu SugimuraYoshiyuki KamataMasatoshi Sakurai
    • B44C1/22B28B11/08
    • G11B5/855
    • According to one embodiment, a method of manufacturing a stamper includes forming a first stamper from a master plate having lands and grooves through electroforming, forming a second stamper, a width of which is GW, from the first stamper through electroforming, forming a lamination film with a thickness of LLT on the second stamper, forming, on the lamination film, a second releasing layer, a transfer layer with a thickness of TLT and a third electroforming layer with a thickness of ELT, peeling off the transfer layer and the third electroforming layer from the second stamper to form a third stamper, and isotropically etching the transfer layer on the third stamper in an etching thickness of ET to reduce a width of lands of the third stamper, in which the following relations are satisfied: 10 nm≦ELT and ET≦TLT.
    • 根据一个实施例,制造压模的方法包括通过电铸从具有焊盘和槽的母板形成第一压模,通过电铸从第一压模形成其宽度为GW的第二压模,形成层压膜 在第二压模上具有LLT的厚度,在层压膜上形成第二释放层,厚度为TLT的转印层和具有ELT厚度的第三电铸层,剥离转印层和第三电铸 从而形成第三压模,并且以蚀刻厚度的ET对第三压模上的转印层进行各向同性蚀刻,以减小第三压模的焊盘的宽度,其中满足以下关系:10nm≦̸ ELT 和ET≦̸ TLT。
    • 7. 发明申请
    • Method for manufacturing a stamper
    • 制造压模的方法
    • US20100072069A1
    • 2010-03-25
    • US12585756
    • 2009-09-24
    • Takuya ShimadaShinobu SugimuraYoshiyuki Kamata
    • Takuya ShimadaShinobu SugimuraYoshiyuki Kamata
    • C25D1/10
    • C25D1/10C25D5/02
    • A method for manufacturing an imprint stamper includes the steps of forming a first electroformed layer on a concavo-convex pattern of an original disk with the pattern, peeling off the first electroformed layer to provide a first stamper, forming a second electroformed layer on a concavo-convex pattern of the first stamper, peeling off the second electroformed layer to provide a second stamper, forming a third electroformed layer on a concavo-convex pattern of the second stamper, and peeling off the third electroformed layer to provide a third stamper. In addition, a conductive film is formed at least on one of a bottom of the concave portion and a top surface of the convex portion of the concavo-convex pattern at least in one of the first stamper and the second stamper.
    • 压印模具的制造方法包括以下步骤:在具有图案的原盘的凹凸图案上形成第一电铸层,剥离第一电铸层以提供第一压模,在凹凸上形成第二电铸层 - 剥离第二电铸层以提供第二压模,在第二压模的凹凸图案上形成第三电铸层,以及剥离第三电铸层以提供第三压模。 此外,至少在第一压模和第二压模之一中,至少在凹部的底部和凹凸图案的凸部的顶表面中的至少一个上形成导电膜。
    • 8. 发明授权
    • Stamper and method of manufacturing the same
    • 压模及其制造方法
    • US08778162B2
    • 2014-07-15
    • US13077537
    • 2011-03-31
    • Masatoshi SakuraiTakuya ShimadaShinobu SugimuraSatoshi Shirotori
    • Masatoshi SakuraiTakuya ShimadaShinobu SugimuraSatoshi Shirotori
    • C25D1/00C25D1/20
    • G11B5/82B82Y10/00G11B5/743G11B5/855G11B5/858
    • According to one embodiment, a stamper manufacturing method comprises electroless plating by using a master includes a substrate, a conductive underlayer formed on the substrate and having catalytic activity, projecting patterns having no catalytic activity and partially formed on a surface of the conductive underlayer having catalytic activity, and regions in which the conductive underlayer having catalytic activity is exposed between the projecting patterns to deposit selectively an amorphous conductive layer between the projecting patterns and in the regions in which the conductive underlayer is exposed, and forming stamper projections, electroplating on the stamper projections includes the projecting patterns and the amorphous conductive layer by using the amorphous conductive layer and the conductive underlayer as electrodes to form a stamper main body made of a crystalline metal, and releasing a stamper includes the stamper projections and the stamper main body from the master.
    • 根据一个实施例,压模制造方法包括使用主体的无电镀,其包括基板,形成在基板上的具有催化活性的导电底层,具有催化活性的突出图案,并部分地形成在具有催化作用的导电底层的表面上 活性以及其中具有催化活性的导电底层在突出图案之间暴露的区域,以选择性地沉积在突出图案之间的非晶导体层和导电底层暴露的区域中,并且形成压模突起,在压模上电镀 突起包括通过使用非晶导体层和导电底层作为电极形成由结晶金属制成的压模主体的突出图案和非晶导体层,并且释放压模包括压模主体和压模主体 。