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1. 发明申请

US20120186863A1 MULTILAYER WIRING BOARD 有权
标题翻译：多层接线板
公开(公告)号：US20120186863A1
公开(公告)日：2012-07-26
申请号：US13355916
申请日：2012-01-23
申请人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Takuya HANDO , Hidetoshi WADA
发明人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Takuya HANDO , Hidetoshi WADA
IPC分类号： H05K1/02
CPC分类号： H05K1/111 , H01L23/12 , H01L23/32 , H01L24/00 , H01L24/16 , H01L24/81 , H01L2224/16225 , H01L2224/81192 , H01L2224/81385 , H01L2224/81815 , H05K1/113 , H05K3/0097 , H05K3/244 , H05K3/3436 , H05K3/4007 , H05K3/4682 , H05K2201/09745 , Y02P70/611
摘要： A multilayer wiring board including a build-up layer comprising a conductor layer and a resin insulation layer that are alternately layered, conductive pads formed on a surface of a resin insulation layer so as to project from the surface, and a solder layer formed over an upper surface of each of the conductive pads is provided. The upper surface of the conductive pads may have a recess, and the entire surface of the solder layer may be situated at an elevated position with respect to an outer periphery portion of the upper surface. Embodiments make it possible to feed and hold a sufficient amount of solder paste on the upper surface of conductive pads, thereby minimizing or eliminating the occurrence of defective connections to a semiconductor element and damage to the solder layer caused by an insufficient thickness of the solder layer.
摘要翻译：一种多层布线基板，包括：交替层叠导体层和树脂绝缘层的堆积层，形成在表面突出的树脂绝缘层的表面的导电性焊盘，以及形成在提供每个导电焊盘的上表面。导电焊盘的上表面可以具有凹部，并且焊料层的整个表面可以相对于上表面的外周部分位于升高位置。实施例使得可以在导电焊盘的上表面上馈送和保持足够量的焊膏，从而最小化或消除与半导体元件的不良连接的发生以及由焊料层的厚度不足引起的焊料层的损坏。

2. 发明申请

US20120211271A1 MULTILAYER WIRING BOARD 有权
标题翻译：多层接线板
公开(公告)号：US20120211271A1
公开(公告)日：2012-08-23
申请号：US13399547
申请日：2012-02-17
申请人： Takuya HANDO , Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Hidetoshi WADA
发明人： Takuya HANDO , Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Hidetoshi WADA
IPC分类号： H05K1/02
CPC分类号： H05K3/4007 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L24/81 , H01L2221/68345 , H01L2224/16225 , H01L2224/81192 , H01L2924/01084 , H05K3/0097 , H05K3/4682 , H05K2201/0367
摘要： A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.
摘要翻译：一种多层布线基板，包括由一层或多层导体和树脂绝缘层形成的堆积层，所述导体和树脂绝缘层层叠在另一层之上，具有形成在至少一层树脂绝缘层的表面上的导电焊盘，以便从提供表面。导电垫可以各自包括位于其下部的柱状部分和位于其较高部分的凸部，其中凸部的表面可以呈现连续的弯曲形状。可以在导电焊盘的上表面上形成焊料层。某些实施例使得可以最小化或消除导电焊盘上的应力集中，并且可以抑制对半导体元件的不良连接的发生以及对导电焊盘的损坏。

3. 发明申请

US20120111616A1 ELECTRONIC-COMPONENT-MOUNTED WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电子元件安装接线基板及其制造方法
公开(公告)号：US20120111616A1
公开(公告)日：2012-05-10
申请号：US13290737
申请日：2011-11-07
申请人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
发明人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
IPC分类号： H05K1/09 , B23K31/02 , B23K1/00
CPC分类号： H05K3/4007 , B23K1/0016 , B23K26/384 , B23K26/40 , B23K2101/42 , B23K2103/172 , B23K2103/50 , H01L2224/16225 , H05K1/141 , H05K3/244 , H05K3/3442 , H05K3/3484 , Y02P70/613
摘要： An electronic-component-mounted wiring substrate provides enhanced joining reliability when an electronic component is joined to terminal pads of the wiring substrate, has sufficient strength, and can prevent generation of warpage and formation of a short circuit, which would otherwise occur as a result of re-melting of solder. Solder completely covers an entire surface of each of the terminal pads provided on a laminated substrate such that they project therefrom, and also joins to terminals of the electronic component. Therefore, each of the terminal pads and the solder are joined together reliably, and sufficient electrical continuity is secured therebetween. That is, the reliability of a joint between the solder and each terminal pad is extremely high, and the reliability of joint between the terminal pads and the electronic component is extremely high.
摘要翻译：电子元件安装的布线基板当将电子元件接合到布线基板的端子焊盘时提供增强的连接可靠性，具有足够的强度，并且可以防止产生翘曲和形成短路，否则会发生这种情况。的焊料再熔化。焊料完全覆盖设置在层叠基板上的每个端子焊盘的整个表面，使得它们从其突出，并且还连接到电子部件的端子。因此，端子焊盘和焊料中的每一个可靠地接合在一起，并且在它们之间确保了足够的电连续性。也就是说，焊料和每个端子焊盘之间的接头的可靠性非常高，并且端子焊盘和电子部件之间的接合的可靠性非常高。

4. 发明申请

US20120186864A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20120186864A1
公开(公告)日：2012-07-26
申请号：US13354043
申请日：2012-01-19
申请人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
发明人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： B23K1/00 , B23K35/22 , B23K35/26 , C22C11/06 , C22C13/00 , H01L21/4853 , H01L21/6835 , H01L23/49811 , H01L23/49822 , H01L24/00 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68318 , H01L2221/68331 , H01L2221/68345 , H01L2221/68386 , H01L2224/131 , H01L2224/16237 , H01L2224/81192 , H01L2224/814 , H01L2924/15174 , H01L2924/15312 , H05K3/4682 , H05K2201/10318 , H01L2924/014
摘要： A wiring board and a method for manufacturing the wiring board reinforced by means of a resin is provided. Embodiments of the wiring board allow for reliable attachment of a connection member, like a socket, to a terminal member. For example, a base of terminal pins is put on pin grid array (PGA) terminal pads, and a bonding material paste including solder and an electric insulation material made of a resin is placed on each of the PGA terminal pads. The bonding material paste is then heated to fuse the solder and soften the electric insulation material. Subsequently, the bonding material paste is cooled to solidify the solder and bond each of the bases to a corresponding PGA terminal pad and form an electric insulation surface layer on an exposed surface of each of solder junctions to which the respective bases are bonded.
摘要翻译：提供了一种通过树脂加强的布线板和制造布线板的方法。布线板的实施例允许将连接构件（如插座）可靠地附接到端子构件。例如，将端子引脚的基座放置在引脚格栅阵列（PGA）端子焊盘上，并且将包含焊料的接合材料浆料和由树脂制成的电绝缘材料放置在每个PGA端子焊盘上。然后将接合材料浆料加热以熔化焊料并软化电绝缘材料。随后，将接合材料浆料冷却以固化焊料，并将每个基底结合到相应的PGA端子焊盘上，并在各个基底所接合的每个焊接点的暴露表面上形成电绝缘表面层。

5. 发明申请

US20120186857A1 METHOD FOR MANUFACTURING WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING WIRING BOARD HAVING AN ELECTRONIC COMPONENT 有权
标题翻译：用于安装电子部件的布线板的安装方法，用于安装电子部件的布线板以及用于制造具有电子部件的布线板的方法
公开(公告)号：US20120186857A1
公开(公告)日：2012-07-26
申请号：US13353965
申请日：2012-01-19
申请人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
发明人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
IPC分类号： H05K1/02 , H05K13/04
CPC分类号： H05K3/3478 , H01L24/81 , H01L2224/10126 , H01L2224/16225 , H01L2924/14 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H01L2924/00
摘要： A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted wiring board are provided. A bonding material paste, which can include solder and an electric insulation material made of a resin, can be placed on chip mount terminal pads and heated to fuse the solder and soften the electric insulation material. Subsequently, the solder is solidified to form solder bumps. Further, the electric insulation material is cured on a surface of each of the solder bumps and a surface of a multilayer board around each of the solder bumps to form an electric insulation surface layer. Accordingly, when a chip is mounted to such wiring boards, the electric insulation surface layer minimizes or eliminates the connection between adjacent solder bumps during re-fusing of the solder.
摘要翻译：本发明提供一种电子部件安装用布线基板的制造方法，电子部件的安装用布线基板以及电子元件搭载布线基板的制造方法。可以将包括焊料和由树脂制成的电绝缘材料的接合材料糊料放置在芯片安装端子焊盘上并加热以熔化焊料并软化电绝缘材料。随后，焊料固化形成焊料凸块。此外，电绝缘材料在每个焊料凸块的表面和每个焊料凸块周围的多层板的表面上固化，以形成电绝缘表面层。因此，当芯片安装到这种布线板时，电绝缘表面层在焊料的再熔合期间使相邻焊料凸块之间的连接最小化或消除。

6. 发明申请

US20080146244A1 MOBILE NODE, A CONTROL METHOD THEREOF, AND A MOBILE NODE CONTROL PROGRAM 审中-公开
标题翻译：移动节点，其控制方法和移动节点控制程序
公开(公告)号：US20080146244A1
公开(公告)日：2008-06-19
申请号：US12021054
申请日：2008-01-28
申请人： Masahiro INOUE , Koji Omae , Ichiro Okajima , Narumi Umeda
发明人： Masahiro INOUE , Koji Omae , Ichiro Okajima , Narumi Umeda
IPC分类号： H04Q7/20
CPC分类号： H04W88/10 , H04W48/18 , H04W88/06 , Y02D70/1244 , Y02D70/142
摘要： A mobile node having two or more interfaces, a control method of the mobile node, and a mobile node control program are disclosed. The mobile node includes a generating unit to generate control information for each interface, an information providing unit for providing the control information provided by each interface to an upper layer, and a routing controlling unit to perform at least one of determining connectivity, and updating a routing based on the provided control information.
摘要翻译：公开了具有两个或多个接口的移动节点，移动节点的控制方法和移动节点控制程序。移动节点包括：生成单元，用于生成每个接口的控制信息;信息提供单元，用于将由每个接口提供的控制信息提供给上层;以及路由控制单元，用于执行确定连接性中的至少一个，以及更新基于提供的控制信息进行路由。

7. 发明申请

US20080035835A1 PHOTOELECTRIC CONVERSION SENSOR 审中-公开
标题翻译：光电转换传感器
公开(公告)号：US20080035835A1
公开(公告)日：2008-02-14
申请号：US11836396
申请日：2007-08-09
申请人： Takahiro KOMATSU , Masakazu MIZUSAKI , Shinichiro KANEKO , Masahiro INOUE , Takashi KITADA
发明人： Takahiro KOMATSU , Masakazu MIZUSAKI , Shinichiro KANEKO , Masahiro INOUE , Takashi KITADA
IPC分类号： H01L27/00
CPC分类号： H01L27/307 , B82Y10/00 , H01L51/0047
摘要： A photoelectric conversion sensor according to the invention comprises: a substrate; a plurality of organic photoelectric conversion pixel parts arranged on the substrate for converting incident light to an electric signal; a light transmissive substrate for transmitting incident light; an optical filter arranged on the light transmissive substrate for limiting the wavelength range of incident light to the plurality of organic photoelectric conversion pixel parts; and a support part for supporting the substrate and the light transmissive substrate in a state where the organic photoelectric conversion pixel parts are separated from the optical filter.
摘要翻译：根据本发明的光电转换传感器包括：基板; 多个有机光电转换像素部件，布置在基板上，用于将入射光转换成电信号; 用于透射入射光的透光基板; 布置在所述透光基板上的滤光器，用于将入射光的波长范围限制到所述多个有机光电转换像素部分; 以及用于在有机光电转换像素部分与滤光器分离的状态下支撑基板和透光基板的支撑部分。

8. 发明申请

US20100265859A1 MOBILE TERMINAL, CONTROL APPARATUS, HOME AGENT AND PACKET COMMUNICATIONS METHOD 有权
标题翻译：移动终端，控制装置，家庭代理和分组通信方法
公开(公告)号：US20100265859A1
公开(公告)日：2010-10-21
申请号：US12829094
申请日：2010-07-01
申请人： Masahiro INOUE , Ichiro Okajima , Narumi Umeda
发明人： Masahiro INOUE , Ichiro Okajima , Narumi Umeda
IPC分类号： H04B7/005 , G06F15/173
CPC分类号： H04L29/12009 , H04L29/12018 , H04L29/12207 , H04L29/12839 , H04L61/10 , H04L61/20 , H04L61/6022 , H04W48/18 , H04W68/00 , H04W80/04 , H04W88/06
摘要： In a packet communications system, a control apparatus implements routing control of a received packet directed for the mobile terminal. The mobile terminal includes a plurality of network interface cards; a communication manager configured to select at least one network interface card among from the plurality of network interface cards, in accordance with information regarding the network interface card; and an upper layer manager configured to receive the packet transmitted from the control apparatus, with using a selected network interface card.
摘要翻译：在分组通信系统中，控制装置实现针对移动终端的接收分组的路由控制。移动终端包括多个网络接口卡; 通信管理器，被配置为根据关于网络接口卡的信息，从多个网络接口卡中选择至少一个网络接口卡; 以及上层管理器，被配置为使用所选择的网络接口卡来接收从控制设备发送的分组。

9. 发明申请

US20090072603A1 VEHICLE BACKREST STRUCTURE 有权
标题翻译：车辆背部结构
公开(公告)号：US20090072603A1
公开(公告)日：2009-03-19
申请号：US12201827
申请日：2008-08-29
申请人： Takeshi KOBAYASHI , Masahiro INOUE
发明人： Takeshi KOBAYASHI , Masahiro INOUE
IPC分类号： B60N2/00
CPC分类号： B60N2/22 , B60N2002/684
摘要： A backrest structure capable for a vehicle having seats that are supported on a vehicle body frame via a seat frame as a seat support member. Each of the seats includes a seat back as a backrest supporting a back of a driver. The seat back is removably mounted in the seat frame, thereby permitting positional adjustments in vertical and longitudinal directions to fit a body type of the driver. The resulting configuration makes driving of the vehicle easier.
摘要翻译：一种靠背结构，其能够通过座椅框架作为座椅支撑构件而具有被支撑在车体框架上的座椅的车辆。每个座椅包括座椅靠背，作为支撑驾驶员背部的靠背。座椅靠背可拆卸地安装在座椅框架中，从而允许垂直和纵向方向上的位置调整以适应驾驶员的身体类型。所得到的配置使得车辆的驾驶更容易。

10. 发明申请

US20120112619A1 SPARK PLUG AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：火花塞及其制造方法
公开(公告)号：US20120112619A1
公开(公告)日：2012-05-10
申请号：US13212668
申请日：2011-08-18
申请人： Yuji KASUYA , Masahiro INOUE
发明人： Yuji KASUYA , Masahiro INOUE
IPC分类号： H01T13/20 , H01T21/02
CPC分类号： H01T13/32 , H01T21/02
摘要： A buried portion (32B) buried from a junction target surface of a ground electrode (27) is provided in a noble metal tip (32). In a section, perpendicular to a central axis CL2 of the ground electrode (27), a large width portion (32W) is formed in the buried portion (32B), and a region between the junction target surface and a largest width region of the large width portion (32W) is formed into a shape which gradually increases in width, or into a shape having a region of the relevant shape and a constant width region. A region from the large width portion (32W) to a point of intersection P1, P2 is covered with a base material of the ground electrode (27) and a melt portion (35), and a thickness t1 (mm) of the noble metal tip (32) and a buried amount t2 (mm) satisfy 0.25≦t2/t1.
摘要翻译：在贵金属端头（32）上设有从接地电极（27）的接合靶表面埋设的埋入部（32B）。在垂直于接地电极（27）的中心轴线CL2的截面中，在埋入部分（32B）中形成大的宽度部分（32W），并且在接合靶表面和接合电极的最大宽度区域之间的区域大宽度部分（32W）形成为宽度逐渐增大的形状，或具有相关形状区域和恒定宽度区域的形状。从宽幅部（32W）到交点P1，P2的区域被接地电极（27）的基材和熔融部（35）覆盖，贵金属的厚度t1（mm）尖端（32）和埋入量t2（mm）满足0.25＆nlE; t2 / t1。

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