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    • 2. 发明授权
    • Polishing method and apparatus for detecting a polishing end point of a
semiconductor wafer
    • 用于检测半导体晶片的抛光终点的抛光方法和装置
    • US5643046A
    • 1997-07-01
    • US390529
    • 1995-02-17
    • Ichiro KatakabeNaoto MiyashitaTatsuo Akiyama
    • Ichiro KatakabeNaoto MiyashitaTatsuo Akiyama
    • B24B37/013B24B49/04H01L21/304B24B7/22B24B49/12
    • B24B37/013B24B49/04
    • A polishing method and apparatus are provided for detecting the polishing end point of a semi-conductor wafer having a polishing film and a stopper film formed thereon. First driving means are provided having a first drive shaft for rotating a polishing plate and a polishing cloth thereon. Second driving means having a second rotatable drive shaft are also provided. Mounting means for mounting the semi-conductor wafer is adapted to be rotated by the second driving means for polishing the wafer. Energy supplying means for supplying prescribed energy to the semi-conductor wafer are also included. Finally, detecting means for detecting a polishing end point of the polishing film is included and detects a variation of the energy supplied to the semi-conductor wafer. Different types of energy can be utilized such as infrared light and a vibration wave.
    • 提供了一种抛光方法和装置,用于检测在其上形成有抛光膜和阻挡膜的半导体晶片的研磨终点。 第一驱动装置设置有用于使研磨板和抛光布旋转的第一驱动轴。 还提供具有第二可旋转驱动轴的第二驱动装置。 用于安装半导体晶片的安装装置适于通过用于抛光晶片的第二驱动装置旋转。 还包括用于向半导体晶片提供规定能量的能量供给装置。 最后,包括用于检测抛光膜的抛光终点的检测装置,并且检测提供给半导体晶片的能量的变化。 可以使用不同类型的能量,例如红外光和振动波。
    • 7. 发明授权
    • Feature point matching device, feature point matching method, and non-transitory computer readable medium storing feature matching program
    • 特征点匹配装置,特征点匹配方法和非暂态计算机可读介质存储特征匹配程序
    • US09430711B2
    • 2016-08-30
    • US13984004
    • 2011-11-01
    • Tatsuo Akiyama
    • Tatsuo Akiyama
    • G06K9/46G06K9/62G06T7/00
    • G06K9/46G06K9/6211G06K2209/01G06T7/74
    • A feature point matching device includes a position feature generation unit for generating a position feature quantity for a feature point based on a position of the feature point included in an image, a pixel value feature generation unit for generating a pixel value feature quantity for the feature point based on a pixel value of the feature point included in the image, and a feature matching unit for matching a first feature point and a second feature point based on a degree of matching between a first position feature quantity generated from a first image and a second position feature quantity generated from a second image and a degree of matching between a first pixel value feature quantity generated from the first image and a second pixel value feature quantity generated from the second image.
    • 特征点匹配装置包括:位置特征生成单元,用于基于图像中包含的特征点的位置生成特征点的位置特征量;像素值特征生成单元,生成特征的像素值特征量 基于图像中包含的特征点的像素值的特征点,以及基于从第一图像生成的第一位置特征量与第二特征点之间的匹配度来匹配第一特征点和第二特征点的特征匹配单元 从第二图像生成的第二位置特征量和从第一图像生成的第一像素值特征量与从第二图像生成的第二像素值特征量之间的匹配度。
    • 8. 发明申请
    • FEATURE POINT ARRANGEMENT CHECKING DEVICE, IMAGE CHECKING DEVICE, METHOD THEREFOR, AND PROGRAM
    • 特征点安装检查设备,图像检查设备,其方法和程序
    • US20100239172A1
    • 2010-09-23
    • US12734559
    • 2008-11-10
    • Tatsuo Akiyama
    • Tatsuo Akiyama
    • G06K9/46
    • G06T7/33
    • The arrangements of feature points are computed based on feature points acquired from checking target images. The feature amount having invariants as elements regarding a geometrical transformation is generated for each of the checking target images based on a computed result. And when checking whether or not the feature point arrangements of the checking target images are the same feature point arrangements by using the feature point amounts of the checking target images, at least each of the feature point arrangements that are bases for generating the feature amounts is stored, and a parameter regarding the geometrical transformation is computed based on the feature point arrangements of the checking target images. By utilizing the computed parameter regarding the geometrical transformation, whether or not the feature point arrangements of the checking target images are the same feature point arrangements is checked.
    • 特征点的布置基于从检查目标图像获得的特征点来计算。 基于计算结果,针对每个检查对象图像生成具有关于几何变换的元素的不变量的特征量。 并且当通过使用检查对象图像的特征点量来检查检查对象图像的特征点排列是否是相同的特征点排列时,作为生成特征量的基础的至少每个特征点排列是 存储,并且基于检查对象图像的特征点排列来计算关于几何变换的参数。 通过利用关于几何变换的计算参数,检查检查对象图像的特征点排列是否相同的特征点布置。
    • 9. 发明授权
    • Semiconductor design/fabrication system, semiconductor design/fabrication method and semiconductor design/fabrication program
    • 半导体设计/制造系统,半导体设计/制造方法和半导体设计/制造程序
    • US06775816B2
    • 2004-08-10
    • US10327114
    • 2002-12-24
    • Yoshiyuki SatoShigeki SugimotoTatsuo Akiyama
    • Yoshiyuki SatoShigeki SugimotoTatsuo Akiyama
    • G06F1750
    • H01L22/20H01L2924/0002H01L2924/00
    • A semiconductor design/fabrication system which combines a plurality of function blocks and arranges the combined function blocks on a chip, comprising: a function block selector which selects the function blocks to be arranged on the same chip from a plurality of function blocks for each of which a critical area indicating a range where defective products occur due to existence of defects is known; a chip information calculator which calculates a sum of the critical areas on each of the selected function blocks; an yield calculator which calculates an yield based on a calculation result of the chip information calculator and defect occurrence rate information of a chip fabrication line; a cost delivery time information calculator which calculates information relating to fabrication cost and delivery time of the chip based on a calculation result of the yield calculator and fabrication management information relating to cost and fabrication period of the chip fabrication line; and a combination selector which selects a combination of the function blocks constituting the chip based on the information relating to the fabrication cost and the delivery time of the chip calculated by the cost delivery time information calculator.
    • 一种组合多个功能块并将组合功能块布置在芯片上的半导体设计/制造系统,包括:功能块选择器,从多个功能块中选择要布置在同一芯片上的功能块, 这是一个关键区域,表明由于存在缺陷而出现缺陷产品的范围; 芯片信息计算器,其计算每个所选择的功能块上的关键区域的总和; 收益率计算器,其基于芯片信息计算器的计算结果和芯片制造线的缺陷发生率信息来计算收益; 成本交付时间信息计算器,其基于收益计算器的计算结果和与芯片制造线的成本和制造周期相关的制造管理信息来计算与芯片的制造成本和交付时间有关的信息; 以及组合选择器,其基于与由成本递送时间信息计算器计算的芯片的制造成本和输送时间有关的信息来选择构成芯片的功能块的组合。