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1. 发明授权

US06742700B2 Adhesive composition for bonding different kinds of members 有权
标题翻译：用于粘合不同种类的构件的粘合剂组合物
公开(公告)号：US06742700B2
公开(公告)日：2004-06-01
申请号：US10083374
申请日：2002-02-27
申请人： Takuma Makino , Masayuki Shinkai
发明人： Takuma Makino , Masayuki Shinkai
IPC分类号： B23K3102
CPC分类号： B23K35/001 , B23K35/0244
摘要： A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.
摘要翻译：复合材料通过以下方法制造：粘合剂组合物，其包含降低热应力的颗粒材料和含有贵金属元素作为基材的钎焊材料，其中粘合剂组合物可以粘合两种或更多种不同的构件以形成复合构件，其具有足够的粘合强度，以避免造成损坏，例如在构件的在热应力方面较弱的侧面发生的裂纹，以及通过制造由两种或更多种不同构件组成的复合构件的方法，使用粘合剂组合物或不同构件的粘合部分填充有降低热应力的颗粒材料，然后将熔融的钎焊材料浇注到其中，并冷却以使构件结合。

2. 发明授权

US06390354B1 Adhesive composition for bonding different kinds of members 有权
标题翻译：用于粘合不同种类的构件的粘合剂组合物
公开(公告)号：US06390354B1
公开(公告)日：2002-05-21
申请号：US09238731
申请日：1999-01-28
申请人： Takuma Makino , Masayuki Shinkai
发明人： Takuma Makino , Masayuki Shinkai
IPC分类号： B23K3102
CPC分类号： B23K35/001 , B23K35/0244
摘要： A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.
摘要翻译：复合材料通过以下方法制造：粘合剂组合物，其包含降低热应力的颗粒材料和含有贵金属元素作为基材的钎焊材料，其中粘合剂组合物可以粘合两种或更多种不同的构件以形成复合构件具有足够的粘结强度，以避免造成损坏，例如在构件的在热应力方面较弱的侧面发生的裂纹，以及通过制造由两种或更多种不同构件组成的复合构件的方法，使用粘合剂组合物或不同构件的粘合部分填充有降低热应力的颗粒材料，然后将熔融的钎焊材料浇注到其中，并冷却以使构件结合。

3. 发明授权

US5998041A Joined article, a process for producing said joined article, and a brazing agent for use in producing such a joined article 失效
标题翻译：连接件，用于生产所述连接件的方法，以及用于制造这种接合件的钎焊剂
公开(公告)号：US5998041A
公开(公告)日：1999-12-07
申请号：US820350
申请日：1997-03-12
申请人： Takuma Makino , Masayuki Shinkai
发明人： Takuma Makino , Masayuki Shinkai
IPC分类号： B23K1/19 , B23K35/28 , B23K35/30 , C04B37/00 , C04B37/02 , B21D39/00
CPC分类号： C04B35/645 , C04B37/026 , C04B2237/121 , C04B2237/123 , C04B2237/124 , C04B2237/125 , C04B2237/126 , C04B2237/366 , C04B2237/405 , C04B2237/708 , C04B2237/72 , C04B2237/80 , C04B2237/84 , Y10S428/939 , Y10T428/12535 , Y10T428/12576 , Y10T428/12944
摘要： A joined article includes a ceramic member, another member, and a joining layer which is formed between the ceramic member and another member and joins both the members together, wherein the joining layer is composed mainly of nickel, and the joining layer contains beryllium as an activating component.
摘要翻译：接合制品包括陶瓷构件，另一构件和形成在陶瓷构件和另一构件之间并且将两个构件连接在一起的接合层，其中接合层主要由镍组成，并且接合层包含铍作为激活组件。

4. 发明授权

US07170186B2 Laminated radiation member, power semiconductor apparatus, and method for producing the same 有权
标题翻译：层叠辐射构件，功率半导体装置及其制造方法
公开(公告)号：US07170186B2
公开(公告)日：2007-01-30
申请号：US11179216
申请日：2005-07-12
申请人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
发明人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
IPC分类号： H01L23/00
CPC分类号： H01L24/32 , C04B37/026 , C04B2235/3206 , C04B2235/3225 , C04B2235/3873 , C04B2235/616 , C04B2235/6565 , C04B2235/9607 , C04B2237/064 , C04B2237/083 , C04B2237/121 , C04B2237/122 , C04B2237/125 , C04B2237/127 , C04B2237/128 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/407 , C04B2237/56 , C04B2237/704 , C04B2237/706 , C04B2237/72 , C23C4/02 , C23C4/08 , C23C6/00 , C23C24/10 , C23C24/106 , H01L23/3733 , H01L23/3735 , H01L23/3736 , H01L23/473 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/13055 , H01L2924/15787 , H01L2924/19107 , H01L2924/351 , Y10T428/24917 , Y10T428/24926 , Y10T428/252 , H01L2924/00014 , H01L2924/01004 , H01L2924/01022 , H01L2924/3512 , H01L2924/00 , H01L2924/00015
摘要： A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
摘要翻译：叠层辐射构件包括辐射板，结合到辐射板的上表面的绝缘基板和设置在绝缘基板的上表面上的电极。叠层辐射构件通过以下方法制造：包括以下步骤：对辐射板和/或绝缘基板的接合表面进行表面处理，将处理的陶瓷颗粒插入表面，以确保在辐射板和辐射板之间的硬焊料或金属的润湿性绝缘基板，在陶瓷颗粒上方和/或下方设置硬焊料，将硬焊料加热到高于焊料熔点的温度，将熔融的硬焊料穿入陶瓷颗粒之间的空间，使陶瓷颗粒与焊料以制造金属基复合材料，并且用金属基复合材料将辐射板和绝缘基板接合。

5. 发明申请

US20050105584A1 Method of measuring thermal conductivity of honeycomb structure 有权
标题翻译：测量蜂窝结构导热率的方法
公开(公告)号：US20050105584A1
公开(公告)日：2005-05-19
申请号：US10505334
申请日：2003-03-14
申请人： Shuichi Ichikawa , Aiko Otsuka , Motomichi Itou , Takuma Makino
发明人： Shuichi Ichikawa , Aiko Otsuka , Motomichi Itou , Takuma Makino
IPC分类号： G01N25/18
CPC分类号： G01N25/18
摘要： The method for measurement of thermal conductivity of a honeycomb structure according to the present invention comprises the steps keeping the whole honeycomb structure in a steady temperature state with keeping two ends of the honeycomb structure at given different temperatures; and measuring a thermal conductivity of the honeycomb structure in the steady state. According to the present invention there is provided a method for measurement of thermal conductivity of a honeycomb structure, which can measure the thermal conductivity of a honeycomb structure in the shape of the honeycomb structure per se or in a predetermined block shape without preparing, for example, a test specimen of particular shape.
摘要翻译：根据本发明的蜂窝结构体的导热率的测定方法包括以下步骤：将蜂窝结构体整体保持在稳定的温度状态，同时将蜂窝结构的两端保持在给定的不同温度; 并测量蜂窝结构体在稳定状态下的导热率。根据本发明，提供了一种测定蜂窝结构体的导热率的方法，其可以测量蜂窝结构本身的形状或预定块形状的蜂窝结构体的导热性，而无需制备例如特殊形状的试样。

6. 发明申请

US20050263877A1 Laminated radiation member, power semiconductor apparatus, and method for producing the same 有权
标题翻译：层叠辐射构件，功率半导体装置及其制造方法
公开(公告)号：US20050263877A1
公开(公告)日：2005-12-01
申请号：US11179216
申请日：2005-07-12
申请人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
发明人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
IPC分类号： H01L23/06 , H01L23/10 , H01L23/15 , H01L23/373 , H01L23/473
CPC分类号： H01L24/32 , C04B37/026 , C04B2235/3206 , C04B2235/3225 , C04B2235/3873 , C04B2235/616 , C04B2235/6565 , C04B2235/9607 , C04B2237/064 , C04B2237/083 , C04B2237/121 , C04B2237/122 , C04B2237/125 , C04B2237/127 , C04B2237/128 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/407 , C04B2237/56 , C04B2237/704 , C04B2237/706 , C04B2237/72 , C23C4/02 , C23C4/08 , C23C6/00 , C23C24/10 , C23C24/106 , H01L23/3733 , H01L23/3735 , H01L23/3736 , H01L23/473 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/13055 , H01L2924/15787 , H01L2924/19107 , H01L2924/351 , Y10T428/24917 , Y10T428/24926 , Y10T428/252 , H01L2924/00014 , H01L2924/01004 , H01L2924/01022 , H01L2924/3512 , H01L2924/00 , H01L2924/00015
摘要： A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
摘要翻译：叠层辐射构件包括辐射板，结合到辐射板的上表面的绝缘基板和设置在绝缘基板的上表面上的电极。叠层辐射构件通过以下方法制造：包括以下步骤：对辐射板和/或绝缘基板的接合表面进行表面处理，将处理的陶瓷颗粒插入表面，以确保在辐射板和辐射板之间的硬焊料或金属的润湿性绝缘基板，在陶瓷颗粒上方和/或下方设置硬焊料，将硬焊料加热到高于焊料熔点的温度，将熔融的硬焊料穿入陶瓷颗粒之间的空间，使陶瓷颗粒与焊料以制造金属基复合材料，并且用金属基复合材料将辐射板和绝缘基板接合。

7. 发明授权

US07682072B2 Method of measuring thermal conductivity of honeycomb structure 有权
标题翻译：测量蜂窝结构导热率的方法
公开(公告)号：US07682072B2
公开(公告)日：2010-03-23
申请号：US10505334
申请日：2003-03-14
申请人： Shuichi Ichikawa , Aiko Otsuka , Motomichi Itou , Takuma Makino
发明人： Shuichi Ichikawa , Aiko Otsuka , Motomichi Itou , Takuma Makino
IPC分类号： G01N25/18
CPC分类号： G01N25/18
摘要： The method for measurement of thermal conductivity of a honeycomb structure according to the present invention comprises the steps keeping the whole honeycomb structure in a steady temperature state with keeping two ends of the honeycomb structure at given different temperatures; and measuring a thermal conductivity of the honeycomb structure in the steady state. According to the present invention there is provided a method for measurement of thermal conductivity of a honeycomb structure, which can measure the thermal conductivity of a honeycomb structure in the shape of the honeycomb structure per se or in a predetermined block shape without preparing, for example, a test specimen of particular shape.
摘要翻译：根据本发明的蜂窝结构体的导热率的测定方法包括以下步骤：将蜂窝结构体整体保持在稳定的温度状态，同时将蜂窝结构的两端保持在给定的不同温度; 并测量蜂窝结构体在稳定状态下的导热率。根据本发明，提供了一种测定蜂窝结构体的导热率的方法，其可以测量蜂窝结构本身的形状或预定块形状的蜂窝结构体的导热性，而无需制备例如特殊形状的试样。

8. 发明授权

US06485816B2 Laminated radiation member, power semiconductor apparatus, and method for producing the same 有权
标题翻译：层叠辐射构件，功率半导体装置及其制造方法
公开(公告)号：US06485816B2
公开(公告)日：2002-11-26
申请号：US09774206
申请日：2001-01-30
申请人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
发明人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
IPC分类号： B32B300
CPC分类号： H01L24/32 , C04B37/026 , C04B2235/3206 , C04B2235/3225 , C04B2235/3873 , C04B2235/616 , C04B2235/6565 , C04B2235/9607 , C04B2237/064 , C04B2237/083 , C04B2237/121 , C04B2237/122 , C04B2237/125 , C04B2237/127 , C04B2237/128 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/407 , C04B2237/56 , C04B2237/704 , C04B2237/706 , C04B2237/72 , C23C4/02 , C23C4/08 , C23C6/00 , C23C24/10 , C23C24/106 , H01L23/3733 , H01L23/3735 , H01L23/3736 , H01L23/473 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/13055 , H01L2924/15787 , H01L2924/19107 , H01L2924/351 , Y10T428/24917 , Y10T428/24926 , Y10T428/252 , H01L2924/00014 , H01L2924/01004 , H01L2924/01022 , H01L2924/3512 , H01L2924/00 , H01L2924/00015
摘要： A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
摘要翻译：叠层辐射构件包括辐射板，结合到辐射板的上表面的绝缘基板和设置在绝缘基板的上表面上的电极。叠层辐射构件通过以下方法制造：包括以下步骤：对辐射板和/或绝缘基板的接合表面进行表面处理，将处理的陶瓷颗粒插入表面，以确保在辐射板和辐射板之间的硬焊料或金属的润湿性绝缘基板，在陶瓷颗粒上方和/或下方设置硬焊料，将硬焊料加热到高于焊料熔点的温度，将熔融的硬焊料穿入陶瓷颗粒之间的空间，使陶瓷颗粒与焊料以制造金属基复合材料，并且用金属基复合材料将辐射板和绝缘基板接合。

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