会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Process for fabricating a semiconductor device
    • 制造半导体器件的工艺
    • US06395619B2
    • 2002-05-28
    • US09203330
    • 1998-12-02
    • Takuji TanigamiKenji HakozakiNaoyuki ShinmuraShinichi SatoMasanori YoshimiTakayuki Taniguchi
    • Takuji TanigamiKenji HakozakiNaoyuki ShinmuraShinichi SatoMasanori YoshimiTakayuki Taniguchi
    • H01L2176
    • H01L21/76229
    • The present invention provides a process for fabricating semiconductor device comprising the steps of: forming an etching-stop layer on a semiconductor substrate; patterning the etching-stop layer so that the etching-stop layer remains in a region to be an active region and is removed from a region to be a device isolation region, followed by forming a trench in the region to be the device isolation region; depositing on the semiconductor substrate an insulating film having a thickness greater than or equal to the depth of the trench; forming a resist pattern having an opening above the etching-stop layer above the active region adjacent to a device isolation region whose width is greater than or equal to a predetermined value, followed by etching the insulating film using the resist pattern as a mask; and polishing the insulating film existing on the resulting semiconductor substrate for flattening after removing the resist pattern.
    • 本发明提供一种制造半导体器件的方法,包括以下步骤:在半导体衬底上形成蚀刻停止层; 图案化蚀刻停止层,使得蚀刻停止层保持在作为有源区的区域中,并从作为器件隔离区的区域去除,然后在该区域中形成作为器件隔离区的沟槽; 在半导体衬底上沉积厚度大于或等于沟槽深度的绝缘膜; 形成抗蚀剂图案,其具有在与宽度大于或等于预定值的器件隔离区相邻的有源区上方的蚀刻停止层上方的开口,然后使用抗蚀剂图案作为掩模蚀刻绝缘膜; 并且在除去抗蚀剂图案之后,对存在于所得半导体衬底上的绝缘膜进行抛光以使其变平。
    • 3. 发明授权
    • Writing method for nonvolatile semiconductor memory with soft-write
repair for over-erased cells
    • 非易失性半导体存储器的写入方法,具有用于超擦除单元的软写修复
    • US5742541A
    • 1998-04-21
    • US580515
    • 1995-12-28
    • Takuji TanigamiShinichi Sato
    • Takuji TanigamiShinichi Sato
    • G11C17/00G11C16/04G11C16/10G11C16/14G11C16/34
    • G11C16/3409G11C16/0416G11C16/10G11C16/14G11C16/3404
    • A non-volatile semiconductor memory includes a plurality of memory cells. Each memory cell includes N-type source and drain regions formed in a P-well on a semiconductor substrate, a floating gate formed on the P-well with a tunnel oxide film therebetween, and a control gate formed on the floating gate with an interpoly dielectric film therebetween. The memory has a plurality of bit lines, a plurality of word lines and a source line. The source region of each memory cell is connected to the source line. The drain region of each memory cell is connected to one of the word lines. The memory cell is written to, erased, or read by selectively supplying suitable voltages to the source, bit, and word lines connected thereto. When a selected memory cell is written to by injection electrons into its floating gate, (1) a negative voltage is applied to the P-well and the source line, (2) a first positive voltage is applied to the selected bit line, (3) a second positive voltage is applied to the selected word line, and (4) OV is applied to the non-selected word line. The second positive voltage applied to the control gate is lower than a predetermined voltage between the source and the control gate.
    • 非易失性半导体存储器包括多个存储单元。 每个存储单元包括形成在半导体衬底上的P阱中的N型源极和漏极区,在P阱上形成有在其间具有隧道氧化物膜的浮置栅极,以及在浮置栅极上形成的具有间隔 电介质膜之间。 存储器具有多个位线,多个字线和源极线。 每个存储单元的源区连接到源极线。 每个存储单元的漏极区域连接到一条字线。 通过向连接到其的源,位和字线选择性地提供合适的电压来将存储单元写入,擦除或读取。 当通过注入电子将选定的存储单元写入其浮动栅极时,(1)向P阱和源极线施加负电压,(2)将第一正电压施加到所选位线, 3)将第二正电压施加到所选字线,并且(4)将OV施加到未选择的字线。 施加到控制栅极的第二正电压低于源极和控制栅极之间的预定电压。
    • 5. 发明授权
    • Method for manufacturing semiconductor memory device
    • 制造半导体存储器件的方法
    • US6066531A
    • 2000-05-23
    • US99520
    • 1998-06-18
    • Yukiharu AkiyamaTakuji TanigamiShinichi Sato
    • Yukiharu AkiyamaTakuji TanigamiShinichi Sato
    • H01L21/8247H01L27/115H01L29/788H01L29/792H01L21/336
    • H01L27/11521
    • A method for manufacturing a semiconductor memory device, including the steps of: forming a plurality of stripes comprising a first floating gate material film and a ion implantation protective film, covering one longitudinal side wall of the stripes with a resist pattern; removing a given width of the other side wall of the first floating gate material film by an isotropic etching in use of the resist pattern as a mask; forming an impurity region of low concentration by implanting impurity ions of a second conductivity type into the semiconductor substrate of the first conductivity type in use of the ion implantation protective film as a mask in a tilted direction after removing the resist pattern; and forming asymmetrical impurity regions on both sides of the stripe like first floating gate material film as viewed in the cross section along the direction perpendicular to the longitudinal direction of the stripes. According to the above-mentioned method, without using a side wall spacer, a semiconductor memory device provided with asymmetrical impurity regions having precisely desired forms can be obtained.
    • 一种制造半导体存储器件的方法,包括以下步骤:形成包括第一浮栅材料膜和离子注入保护膜的多个条,用抗蚀剂图案覆盖条的一个纵向侧壁; 通过使用抗蚀图案作为掩模,通过各向同性蚀刻去除第一浮栅材料膜的另一侧壁的给定宽度; 通过在去除抗蚀剂图案之后,在使用离子注入保护膜作为掩模作为掩模的情况下,将第二导电类型的杂质离子注入到第一导电类型的半导体衬底中,形成低浓度的杂质区; 以及沿着与条纹的纵向方向垂直的方向在横截面中看到的条状的第一浮栅材料膜的两侧上形成非对称杂质区域。 根据上述方法,在不使用侧壁间隔物的情况下,可以获得具有精确期望形状的非对称杂质区域的半导体存储器件。
    • 6. 发明授权
    • Nonvolatile semiconductor storage device having a plurality of blocks of
memory cell transistors formed on respective wells isolated from each
other
    • 具有形成在彼此隔离的各个孔上的多个存储单元晶体块的非易失性半导体存储器件
    • US06091632A
    • 2000-07-18
    • US66514
    • 1998-04-24
    • Masanori YoshimiShinichi Sato
    • Masanori YoshimiShinichi Sato
    • G11C16/02H01L21/8247H01L27/115H01L29/788H01L29/792G11C16/04
    • G11C16/3427H01L27/115
    • A plurality of blocks of memory cell transistors are formed on the respective isolated wells. In a write stage, a predetermined write-stage well voltage is applied to the well of a selected block including the memory cell transistors to be subjected to a write operation, a bias voltage is applied to the well of each of the remaining, non-selected blocks to increase a threshold voltage of the memory cell transistors of each non-selected block, in comparison with a threshold voltage determined by the predetermined write-stage well voltage, and a voltage is applied to the control gates of the memory cell transistors of each non-selected block to reduce a difference between a potential of the floating gate of each memory cell transistor of each non-selected block and a write-stage drain voltage applied to the drain of the memory cell transistor through the associated bit line such that a source-drain leak current of each memory cell transistor in the non-selected blocks falls in a permissible range.
    • 在各个隔离的阱上形成多个存储单元晶体管块。 在写入阶段,将预定的写入阶段阱电压施加到包括要进行写入操作的存储单元晶体管的所选择的块的阱中,将偏置电压施加到剩余的非 - 与由预定写入级阱电压确定的阈值电压相比,增加每个未选择块的存储单元晶体管的阈值电压的选择块,并且将电压施加到存储单元晶体管的控制栅极 每个未选择的块以减少每个未选择块的每个存储单元晶体管的浮置栅极的电位与通过相关联的位线施加到存储单元晶体管的漏极的写入级漏极电压之间的差异,使得 未选择的块中的每个存储单元晶体管的源漏漏电流落在容许范围内。