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    • 9. 发明授权
    • Method and device for manufacturing a semiconductor chip
    • 用于制造半导体芯片的方法和装置
    • US5570293A
    • 1996-10-29
    • US268185
    • 1994-06-29
    • Toshiyuki TanakaMasaharu Nakamura
    • Toshiyuki TanakaMasaharu Nakamura
    • H01L21/68H01L23/544G06F17/00
    • H01L21/6836H01L23/544H01L2221/68327H01L2223/54406H01L2223/54413H01L2223/54433H01L2223/54453H01L2223/54473H01L2223/54493H01L2924/0002
    • Semiconductor chip manufacturing methods and devices are disclosed which store dicing data corresponding to the kinds of wafers, when data indicating the wafer kinds are input, read out the dicing data corresponding to the data input, and cut a wafer set at a given position to a desired shape in accordance with the dicing data to thereby manufacture a semiconductor chip. The manufacturing methods and devices include read means for inputting the data indicating the wafer kinds. According to the manufacturing method and device, a symbol indicating the kind of the wafer is recorded as an identification symbol readable by the read means and on a member moving together with the wafer in a chip manufacturing process that is not part of the product being manufactured, and preferably, is also not part of a recyclable carrier for the wafer to be diced. When the data indicating the kind of the wafer is input, the identification symbol recorded in the above-mentioned member is read out by the read means.
    • 公开了半导体芯片制造方法和装置,当输入指示晶片种类的数据时,存储对应于晶片种类的切割数据,读出对应于数据输入的切割数据,并将给定位置处的晶片组切割成 根据切割数据形成所需的形状,从而制造半导体芯片。 制造方法和装置包括用于输入指示晶片种类的数据的读取装置。 根据制造方法和装置,表示晶片的种类的符号被记录为读取装置可读的识别符号,以及在不是被制造的产品的一部分的芯片制造过程中与晶片一起移动的部件 并且优选地也不是要切割晶片的可回收载体的一部分。 当输入指示晶片的种类的数据时,由读取装置读出记录在上述构件中的识别符号。