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1. 发明授权

US09182592B2 Optical filtering device, defect inspection method and apparatus therefor 有权
标题翻译：光学滤波装置，缺陷检查方法及其装置
公开(公告)号：US09182592B2
公开(公告)日：2015-11-10
申请号：US13983310
申请日：2012-02-03
申请人： Taketo Ueno , Toshihiko Nakata , Yukihiro Shibata , Shun'ichi Matsumoto , Atsushi Taniguchi , Hiroshi Toshiyoshi , Takuya Takahashi , Kentaro Motohara
发明人： Taketo Ueno , Toshihiko Nakata , Yukihiro Shibata , Shun'ichi Matsumoto , Atsushi Taniguchi , Hiroshi Toshiyoshi , Takuya Takahashi , Kentaro Motohara
IPC分类号： G01N21/00 , G02B26/02 , G01N21/956 , G01N21/95
CPC分类号： G02B26/02 , G01N21/9501 , G01N21/956
摘要： An optical filtering device and an optical inspection apparatus for detecting a defect in a high sensitivity using an optical filtering device which includes a shutter array formed in a two-dimensionally on an optically opaque thin film produced on a SOI wafer and the SOI wafer is removed at portions thereof on the lower side of the shutter patterns to form perforation portions while working electrodes are formed at the remaining portion of the SOI wafer, a glass substrate having electrode patterns formed on the surface thereof and having the shutter array mounted thereon, and a power supply section for supplying electric power to the electrode patterns formed on the glass substrate and the working electrodes of the SOI wafer. And the working electrodes is controlled to cause the shutter patterns to carry out opening and closing movements with respect to the perforation portions to carry out optical filtering.
摘要翻译：使用光学滤波装置来检测高灵敏度的缺陷的光学滤波装置和光学检查装置，该光学滤波装置包括在SOI晶片和SOI晶片上制造的光学不透明薄膜上二维地形成的快门阵列在闸板图案的下侧的部分处形成穿孔部分，同时在SOI晶片的剩余部分处形成工作电极，在其表面上形成有安装有快门阵列的电极图案的玻璃基板，以及电源部分，用于向形成在玻璃基板上的电极图案和SOI晶片的工作电极提供电力。并且控制工作电极以使快门图案相对于穿孔部分进行打开和关闭运动以进行光学过滤。

2. 发明申请

US20140160471A1 Optical Filtering Device, Defect Inspection Method and Apparatus Therefor 有权
标题翻译：光过滤装置，缺陷检查方法及装置
公开(公告)号：US20140160471A1
公开(公告)日：2014-06-12
申请号：US13983310
申请日：2012-02-03
申请人： Taketo Ueno , Toshihiko Nakata , Yukihiro Shibata , Shun'ichi Matsumoto , Atsushi Taniguchi , Hiroshi Toshiyoshi , Takuya Takahashi , Kentaro Motohara
发明人： Taketo Ueno , Toshihiko Nakata , Yukihiro Shibata , Shun'ichi Matsumoto , Atsushi Taniguchi , Hiroshi Toshiyoshi , Takuya Takahashi , Kentaro Motohara
IPC分类号： G02B26/02 , G01N21/95
CPC分类号： G02B26/02 , G01N21/9501 , G01N21/956
摘要： An optical filtering device and an optical inspection apparatus for detecting a defect in a high sensitivity using an optical filtering device which includes a shutter array formed in a two-dimensionally on an optically opaque thin film produced on a SOI wafer and the SOI wafer is removed at portions thereof on the lower side of the shutter patterns to form perforation portions while working electrodes are formed at the remaining portion of the SOI wafer, a glass substrate having electrode patterns formed on the surface thereof and having the shutter array mounted thereon, and a power supply section for supplying electric power to the electrode patterns formed on the glass substrate and the working electrodes of the SOI wafer. And the working electrodes is controlled to cause the shutter patterns to carry out opening and closing movements with respect to the perforation portions to carry out optical filtering.
摘要翻译：使用光学滤波装置来检测高灵敏度的缺陷的光学滤波装置和光学检查装置，该光学滤波装置包括在SOI晶片和SOI晶片上制造的光学不透明薄膜上二维地形成的快门阵列在闸板图案的下侧的部分处形成穿孔部分，同时在SOI晶片的剩余部分处形成工作电极，在其表面上形成有安装有快门阵列的电极图案的玻璃基板，以及电源部分，用于向形成在玻璃基板上的电极图案和SOI晶片的工作电极提供电力。并且控制工作电极以使快门图案相对于穿孔部分进行打开和关闭运动以进行光学过滤。

3. 发明授权

US08885037B2 Defect inspection method and apparatus therefor 有权
标题翻译：缺陷检查方法及其设备
公开(公告)号：US08885037B2
公开(公告)日：2014-11-11
申请号：US13375239
申请日：2010-07-01
申请人： Atsushi Taniguchi , Yukihiro Shibata , Taketo Ueno , Toshihiko Nakata
发明人： Atsushi Taniguchi , Yukihiro Shibata , Taketo Ueno , Toshihiko Nakata
IPC分类号： H04N9/47 , G01J4/00 , G01N21/00 , G06K9/00 , G01N37/00 , G01N21/95 , G01N21/956
CPC分类号： G01N21/956 , G01N21/9501
摘要： To effectively utilize the polarization property of an inspection subject for obtaining higher inspection sensitivity, for the polarization of lighting, it is necessary to observe differences in the reflection, diffraction, and scattered light from the inspection subject because of polarization by applying light having the same elevation angle and wavelength in the same direction but different polarization. According to conventional techniques, a plurality of measurements by changing polarizations is required to cause a prolonged inspection time period that is an important specification of inspection apparatuses. In this invention, a plurality of polarization states are modulated in micro areas in the lighting beam cross section, images under a plurality of polarized lighting conditions are collectively acquired by separately and simultaneously forming the scattered light from the individual micro areas in the individual pixels of a sensor, whereby inspection sensitivity and sorting and sizing accuracy are improved without reducing throughput.
摘要翻译：为了有效地利用检查对象的偏振特性以获得更高的检测灵敏度，对于照明的偏振，需要观察来自检查对象的反射，衍射和散射光的差异，因为通过施加具有相同的光的偏振仰角和波长相同但偏振不同。根据常规技术，需要通过改变极化的多个测量来引起作为检查设备的重要规格的延长的检查时间段。在本发明中，在照明光束横截面的微小区域中调制多个偏振状态，通过分别并且同时形成来自各个像素中的各个微区域的散射光，共同地获得多个偏振光照条件下的图像传感器，从而在不降低生产能力的情况下提高检测灵敏度和分选和尺寸精度。

4. 发明授权

US08804112B2 Method of defect inspection and device of defect inspection 有权
标题翻译：缺陷检查方法和缺陷检查装置
公开(公告)号：US08804112B2
公开(公告)日：2014-08-12
申请号：US13265935
申请日：2010-04-22
申请人： Yukihiro Shibata , Toshihiko Nakata , Taketo Ueno , Atsushi Taniguchi , Toshifumi Honda
发明人： Yukihiro Shibata , Toshihiko Nakata , Taketo Ueno , Atsushi Taniguchi , Toshifumi Honda
IPC分类号： G01N21/00
CPC分类号： G01N21/95623 , G01N21/95607 , G01N2021/8822 , G01N2201/062 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A method of inspecting defects and a device inspecting defects of detecting defects at high sensitivity and high capture efficiency even on various patterns existing on a wafer. In the device of inspecting defects, an illumination optical system is formed of two systems of a coherent illumination of a laser 5 and an incoherent illumination of LEDs 6a, 6b, 6c and 6d, and light paths are divided in a detecting system corresponding to respective illumination light, spatial modulation elements 55a and 55b are arranged to detecting light paths, respectively, scattered light inhibiting sensitivity is shielded by the spatial modulating elements 55a and 55b, scattered light transmitted through the spatial modulation elements 55a and 55b is detected by image sensors 90a and 90b arranged to respective light paths, and images detected by these two image sensors 90a and 90b are subjected to a comparison processing, thereby determining a defect candidate.
摘要翻译：一种检测缺陷的方法，以及即使在晶片上存在的各种图案，也可以检测高灵敏度和高捕获效率的缺陷检测缺陷。在检查缺陷的装置中，照明光学系统由激光器5的相干照明和LED 6a，6b，6c和6d的非相干照明的两个系统形成，并且光路被分成对应于相应的照明光，空间调制元件55a和55b分别被布置成检测光路，散射光抑制灵敏度被空间调制元件55a和55b屏蔽，传播通过空间调制元件55a和55b的散射光被图像传感器90a检测和90b，并且由这两个图像传感器90a和90b检测到的图像进行比较处理，从而确定缺陷候选。

5. 发明申请

US20120092484A1 DEFECT INSPECTION METHOD AND APPARATUS THEREFOR 有权
标题翻译：缺陷检查方法及其设备
公开(公告)号：US20120092484A1
公开(公告)日：2012-04-19
申请号：US13375239
申请日：2010-07-01
申请人： Atsushi Taniguchi , Yukihiro Shibata , Taketo Ueno , Toshihiko Nakata
发明人： Atsushi Taniguchi , Yukihiro Shibata , Taketo Ueno , Toshihiko Nakata
IPC分类号： H04N7/18
CPC分类号： G01N21/956 , G01N21/9501
摘要： To effectively utilize the polarization property of an inspection subject for obtaining higher inspection sensitivity, for the polarization of lighting, it is necessary to observe differences in the reflection, diffraction, and scattered light from the inspection subject because of polarization by applying light having the same elevation angle and wavelength in the same direction but different polarization. According to conventional techniques, a plurality of measurements by changing polarizations is required to cause a prolonged inspection time period that is an important specification of inspection apparatuses. In this invention, a plurality of polarization states are modulated in micro areas in the lighting beam cross section, images under a plurality of polarized lighting conditions are collectively acquired by separately and simultaneously forming the scattered light from the individual micro areas in the individual pixels of a sensor, whereby inspection sensitivity and sorting and sizing accuracy are improved without reducing throughput.
摘要翻译：为了有效地利用检查对象的偏振特性以获得更高的检测灵敏度，对于照明的偏振，需要观察来自检查对象的反射，衍射和散射光的差异，因为通过施加具有相同的光的偏振仰角和波长相同但偏振不同。根据常规技术，需要通过改变极化的多个测量来引起作为检查设备的重要规格的延长的检查时间段。在本发明中，在照明光束横截面的微小区域中调制多个偏振状态，通过分别并且同时形成来自各个像素中的各个微区域的散射光，共同地获得多个偏振光照条件下的图像传感器，从而在不降低生产能力的情况下提高检测灵敏度和分选和尺寸精度。

6. 发明申请

US20120092657A1 METHOD OF DEFECT INSPECTION AND DEVICE OF DEFECT INSPECTION 有权
标题翻译：缺陷检查方法和缺陷检查装置
公开(公告)号：US20120092657A1
公开(公告)日：2012-04-19
申请号：US13265935
申请日：2010-04-22
申请人： Yukihiro Shibata , Toshihiko Nakata , Taketo Ueno , Atsushi Taniguchi , Toshifumi Honda
发明人： Yukihiro Shibata , Toshihiko Nakata , Taketo Ueno , Atsushi Taniguchi , Toshifumi Honda
IPC分类号： G01N21/88
CPC分类号： G01N21/95623 , G01N21/95607 , G01N2021/8822 , G01N2201/062 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A method of inspecting defects and a device inspecting defects of detecting defects at high sensitivity and high capture efficiency even on various patterns existing on a wafer. In the device of inspecting defects, an illumination optical system is formed of two systems of a coherent illumination of a laser 5 and an incoherent illumination of LEDs 6a, 6b, 6c and 6d, and light paths are divided in a detecting system corresponding to respective illumination light, spatial modulation elements 55a and 55b are arranged to detecting light paths, respectively, scattered light inhibiting sensitivity is shielded by the spatial modulating elements 55a and 55b, scattered light transmitted through the spatial modulation elements 55a and 55b is detected by image sensors 90a and 90b arranged to respective light paths, and images detected by these two image sensors 90a and 90b are subjected to a comparison processing, thereby determining a defect candidate.
摘要翻译：一种检测缺陷的方法，以及即使在晶片上存在的各种图案，也可以检测高灵敏度和高捕获效率的缺陷检测缺陷。在检查缺陷的装置中，照明光学系统由激光器5的相干照明和LED 6a，6b，6c和6d的非相干照明的两个系统形成，并且光路被分成对应于相应的照明光，空间调制元件55a和55b分别被布置成检测光路，散射光抑制灵敏度被空间调制元件55a和55b屏蔽，传播通过空间调制元件55a和55b的散射光被图像传感器90a检测和90b，并且由这两个图像传感器90a和90b检测到的图像进行比较处理，从而确定缺陷候选。

7. 发明申请

US20080068593A1 METHOD AND APPARATUS FOR DETECTING DEFECTS 审中-公开
标题翻译：检测缺陷的方法和装置
公开(公告)号：US20080068593A1
公开(公告)日：2008-03-20
申请号：US11853050
申请日：2007-09-11
申请人： HIROYUKI NAKANO , Yasuhiro Yoshitake , Toshihiko Nakata , Taketo Ueno
发明人： HIROYUKI NAKANO , Yasuhiro Yoshitake , Toshihiko Nakata , Taketo Ueno
IPC分类号： G01N21/00
CPC分类号： G01N21/95623 , G01N21/21 , G01N21/95607 , G01N2201/0655
摘要： A defect detecting apparatus for detecting defects on a substrate sample (wafer) having circuit patterns such as interconnections. The defect detecting apparatus is provided with stages that can be moved arbitrarily in each of the X, Y, Z, and θ directions in a state that the substrate sample is mounted thereon, an illumination optical system for illuminating the circuit patterns from one or plural directions, and a detection optical system for detecting reflection light, diffraction light, or scattered light coming from an inspection region being illuminated through almost the entire hemispherical surface having the substrate sample as the bottom surface. The NA (numerical aperture) thereby falls within a range of 0.7 to 1.0. Harmful defects or foreign substances can be detected so as to be separated from non-defects such as surface roughness of interconnections.
摘要翻译：一种用于检测具有诸如互连之类的电路图案的衬底样品（晶片）上的缺陷的缺陷检测装置。该缺陷检测装置设置有可以在其上安装衬底样品的状态下在X，Y，Z和θ方向中的任一个中任意移动的阶段，用于从一个或多个照明电路图案的照明光学系统方向，以及用于检测来自检查区域的反射光，衍射光或散射光的检测光学系统，该检查区域被基底样品的几乎整个半球形表面照射作为底面。 NA（数值孔径）因此落在0.7至1.0的范围内。可以检测有害的缺陷或异物，以便与诸如互连的表面粗糙度的无缺陷分离。

8. 发明授权

US06897956B2 Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device 失效
标题翻译：用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统
公开(公告)号：US06897956B2
公开(公告)日：2005-05-24
申请号：US10235656
申请日：2002-09-06
申请人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
发明人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
IPC分类号： G01B11/00 , G01B11/27 , H01L21/027 , H01L21/66 , H05K1/02 , H05K3/46
CPC分类号： G01B11/272 , H05K1/0269 , H05K3/4638
摘要： An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured, comprising: an XY stage running in a direction x and in a direction y while mounting the substrate; an illumination optical system for illuminating each of the alignment mark portions in a state where the XY stage runs in a direction x which is a direction of arranging the chips; a detecting optical system having an objective lens for collecting a reflection light in the running state obtained from the overlaid alignment marks, a focusing optical system for focusing the reflection light in the running state obtained from the objective lens, a scanning optical system for scanning reflection light image in the running state focused by the focusing optical system in a direction opposite to that of the running and a linear image sensor receiving reflection light image substantially in a static state being scanned in the opposite direction by the scanning optical system and converting them into image signal; and an alignment accuracy calculation device for measuring the alignment accuracy between the overlaid alignment marks at least for a direction perpendicular to the running direction based on the image signal converted by the linear image sensor.
摘要翻译：一种用于测量在布置在待测量基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置，包括：沿x方向和y方向运行的XY台，安装基板; 照明光学系统，用于在XY台在作为排列芯片的方向的方向x上行进的状态下照亮每个对准标记部分; 一种检测光学系统，具有用于收集从重叠的对准标记获得的运行状态的反射光的物镜，用于将反射光聚焦在从物镜获得的运行状态的聚焦光学系统，用于扫描反射的扫描光学系统聚焦光学系统以与行进方向相反的方向聚焦的运行状态的光图像和接收基本处于静止状态的反射光图像的线性图像传感器被扫描光学系统沿相反方向扫描并将其转换成图像信号; 以及对准精度计算装置，用于根据由线性图像传感器转换的图像信号，至少对垂直于行进方向的方向测量重叠的对准标记之间的对准精度。

9. 发明授权

US07271908B2 Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device 失效
标题翻译：用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统
公开(公告)号：US07271908B2
公开(公告)日：2007-09-18
申请号：US11131378
申请日：2005-05-18
申请人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
发明人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
IPC分类号： G01B11/00
CPC分类号： G01B11/272 , H05K1/0269 , H05K3/4638
摘要： An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured includes an XY stage movable X and Y directions while mounting the substrate, an illumination system for illuminating each of the alignment mark portions, a detecting system having a lens for collecting a reflection light, a focusing system for focusing the reflection light, a scanning system for scanning a reflection light image and an image sensor receiving reflection light image for conversion into an image signal. An alignment accuracy calculator measures the alignment accuracy between the overlaid alignment marks.
摘要翻译：用于测量在布置在被测定的基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置包括XY台可移动X和Y方向，同时安装基板，照明系统用于照亮每个对准标记部分，具有用于收集反射光的透镜的检测系统，用于聚焦反射光的聚焦系统，用于扫描反射光图像的扫描系统和接收反射光图像的图像传感器转换成图像信号。对准精度计算器测量重叠对准标记之间的对准精度。

10. 发明申请

US20050206898A1 Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device 失效
标题翻译：用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统
公开(公告)号：US20050206898A1
公开(公告)日：2005-09-22
申请号：US11131378
申请日：2005-05-18
申请人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
发明人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
IPC分类号： G01B11/00 , G01B11/27 , H01L21/027 , H01L21/66 , H05K1/02 , H05K3/46
CPC分类号： G01B11/272 , H05K1/0269 , H05K3/4638
摘要： An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured includes an XY stage movable X and Y directions while mounting the substrate, an illumination system for illuminating each of the alignment mark portions, a detecting system having a lens for collecting a reflection light, a focusing system for focusing the reflection light, a scanning system for scanning a reflection light image and an image sensor receiving reflection light image for conversion into an image signal. An alignment accuracy calculator measures the alignment accuracy between the overlaid alignment marks.
摘要翻译：用于测量在布置在被测定的基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置包括XY台可移动X和Y方向，同时安装基板，照明系统用于照亮每个对准标记部分，具有用于收集反射光的透镜的检测系统，用于聚焦反射光的聚焦系统，用于扫描反射光图像的扫描系统和接收反射光图像的图像传感器转换成图像信号。对准精度计算器测量重叠对准标记之间的对准精度。

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